JPS62277784A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS62277784A JPS62277784A JP12054686A JP12054686A JPS62277784A JP S62277784 A JPS62277784 A JP S62277784A JP 12054686 A JP12054686 A JP 12054686A JP 12054686 A JP12054686 A JP 12054686A JP S62277784 A JPS62277784 A JP S62277784A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- silver
- jumper
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052709 silver Inorganic materials 0.000 claims description 26
- 239000004332 silver Substances 0.000 claims description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000006071 cream Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、テープレコーダやラジオ受信機を量産する場
合に用いることができるプリント基板に関するものであ
る。Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a printed circuit board that can be used in the mass production of tape recorders and radio receivers.
従来の技術
一般に小型テープレコーダに使用されるプリント基板は
、そのサイズが限定されており、高密度化を実現するた
めの一つの方法として第２図に示すようにプリント基板
本体１の銅箔２の上に、その銅箔と絶縁された銀ジャン
パー４を配置するという２層構造をとっていた。2. Description of the Related Art Printed circuit boards used in small tape recorders are generally limited in size, and one way to achieve high density is to use copper foil 2 on the printed circuit board body 1 as shown in FIG. It had a two-layer structure in which a silver jumper 4 insulated from the copper foil was placed on top of the copper foil.
発明が解決しようとする問題点
ところが、このような２層構造のプリント基板では、第
２図に示すように銀ジャンパー４部分の総厚みは銀ジャ
ンパー４をはさんでの銅箔２との絶縁のためのアンダー
コート３およびオーバーコート６を含め、約１００ミク
ロンの厚みを持っている。したがって、銅箔２のみの面
と銀ジャンパー４を含む面とでは基板本体１からの高さ
が異ることになる。このような同一基板内で高さが異っ
た状態においては、スクリーン印刷法により基板本体の
銅箔２の面にクリームハンダをのせていく場合１銀ジャ
ンパー４０近くの銅箔２にのるクリームハンダの景と、
銀ジャンパー４から離れた場所にある銅箔２にのるクリ
ームハンダの量とが異なり、同一基板内でクリームハン
ダ量が異なることによるハンダ付は品質が非常に悪化し
てくるという問題を有していた。すなわち、クリームハ
ンダの厚みは、従来、スクリーン印刷での版の厚みで決
定されており、約２ｏｏミクロンが経験上。Problems to be Solved by the Invention However, in such a two-layer printed circuit board, as shown in FIG. It has a thickness of about 100 microns, including the undercoat 3 and overcoat 6. Therefore, the height from the board body 1 differs between the surface with only the copper foil 2 and the surface including the silver jumper 4. In such a situation where the heights are different on the same board, when cream solder is placed on the surface of the copper foil 2 of the board body using the screen printing method, cream solder placed on the copper foil 2 near the silver jumper 40 may A view of soldering,
The amount of cream solder applied to the copper foil 2 at a location away from the silver jumper 4 is different, and the quality of soldering due to the difference in the amount of cream solder on the same board has a problem that the quality deteriorates significantly. was. That is, the thickness of cream solder has conventionally been determined by the thickness of the plate used in screen printing, and is approximately 20 microns based on experience.
最もよいとされているが１第３図に示すように銀ジャン
パー４の近くにある銅箔２にはスクリーン版の厚みと銀
ジャンパーの厚みとの加算されたクリームハンダ６の景
が置かれ、一方銀ジャンパー４から離れた個所の銅箔２
にはスクリーン版の厚みのクリームハンダ６の量が置か
れ、その結果、約１００ミクロン程度のクリームハンダ
の高さでのバラツキが生じることと、このようなりリー
ムハンダ量のバラツキは品質に大きな問題を生じる。It is said to be the best method, but as shown in Figure 3, a cream solder 6 with the thickness of the screen plate and the thickness of the silver jumper added is placed on the copper foil 2 near the silver jumper 4. On the other hand, the copper foil 2 at a location away from the silver jumper 4
The amount of cream solder 6 with the thickness of the screen plate is placed, and as a result, there is a variation in the height of the cream solder of about 100 microns, and this variation in the amount of ream solder causes a big problem in quality. arise.
本発明はこのような従来の問題点を解消するものであり
、簡単な構成でクリームハンダ量を同一基板内で均一化
することができるプリント基板を提供するものである。The present invention solves these conventional problems and provides a printed circuit board that can uniformize the amount of cream solder within the same board with a simple configuration.
問題点を解決するための手段
本発明のプリント基板は、銀ジャンパーの延長線上に他
端にスルホール部を形成しない疑似の銀ジャンパーを配
置させたものである。Means for Solving the Problems In the printed circuit board of the present invention, a pseudo silver jumper having no through-hole portion formed at the other end is arranged on an extension of the silver jumper.
作用
本発明のプリント基板は、疑似の銀ジャンパーを従来の
銀ジャンパーから離れた箇所にちる銅箔の部分にまで延
ばすことにより１釧ジヤンパーの有無に起因する銅箔面
にのるクリームノ・ンダ量の不均一を解消して均一化す
ることができることになるものである。Function: The printed circuit board of the present invention has a pseudo silver jumper extending to a part of the copper foil that is away from the conventional silver jumper, thereby eliminating the cream nodule on the copper foil surface caused by the presence or absence of the jumper. This makes it possible to eliminate non-uniformity in quantity and make it uniform.
実施例
以下、本発明の実施例のプリント基板を図面を参照して
説明する。第１図に本発明の一実施例を示す。第１図に
おいて、基板本体上に銅箔２が設けられ、チップ部品が
実装される銅箔ランド２−人の近傍に２層目の銀ジャン
パー４−人が走っている。一方、上記銀ジャンパー４−
人から離れた箇所に銅箔ランド群２−Ｂが存在する。上
記の銀ジャンパー４−人を銅箔ランド群２−Ｂの近傍ま
で接近するようにそのままの形状で延長し、疑似の銀ジ
ャンパー４−Ｂを構成する。したがって。Embodiments Hereinafter, printed circuit boards according to embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention. In FIG. 1, a copper foil 2 is provided on the board body, and four second-layer silver jumpers run near the copper foil lands 2 on which chip components are mounted. On the other hand, the silver jumper 4-
Copper foil land group 2-B exists at a location away from people. The above-mentioned four silver jumpers are extended in the same shape so as to approach the copper foil land group 2-B to form a pseudo silver jumper 4-B. therefore.
スクリーン印刷によるクリームハンダ量は銀ジャンパー
４−人と疑似の銀ジャンパー４−Ｈに囲まれた領域にお
いてはほぼ一定にすることができる。The amount of cream solder by screen printing can be made almost constant in the area surrounded by the silver jumper 4-person and the pseudo silver jumper 4-H.
なお、この疑似の銀ジャンパー４−Ｂは５本来の目的に
使用する銀ジャンパー４−人と全く同じ工法で構成する
ことのできるものであり、プリント基板の作成工程にな
んらの影響を与えるものではない。Furthermore, this pseudo silver jumper 4-B can be constructed using exactly the same construction method as the silver jumper 4-man used for the original purpose of 5, and will not have any influence on the printed circuit board manufacturing process. do not have.
発明の効果
以上のように本発明のプリント基板は、２層構造により
構成されるプリント基板上の銀ジャンパーをクリームハ
ンダが置かれる銅箔の近傍まで延長することにより、従
来のスクリーン印刷におけるクリームハンダ量の違いを
大幅に少なくすることのできるものであり、しかも銀ジ
ャンパーの作成工程に何んらの変化を与えることなく安
価な方法でハンダ付は品質の良化を実現できるものであ
る。Effects of the Invention As described above, the printed circuit board of the present invention has a two-layer structure and extends the silver jumper on the printed circuit board to the vicinity of the copper foil on which the cream solder is placed. It is possible to significantly reduce the difference in quantity, and furthermore, it is possible to improve the quality of soldering using an inexpensive method without making any changes to the manufacturing process of silver jumpers.
第１図は本発明の一実施例におけるプリント基板の平面
図、第２図は従来のプリント基板の断面図、第３図は同
基板にクリームハンダが塗布された状態での断面図であ
る゛。
１・・・・・・基板本体、２−Ａ、２−Ｂ・・・・・・
銅箔ランド、４−人・・・・・・銀ジャンパー１４−Ｂ
・・・・・・疑似の銀ジャンパー。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名４−
Ａ −−一金艮ジインパー
４−Ｂ−一一疑５イｂジペンパー
区 ゝ
ＩＮ ｃＱ城
憾FIG. 1 is a plan view of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional printed circuit board, and FIG. 3 is a cross-sectional view of the same circuit board with cream solder applied. . 1... Board body, 2-A, 2-B...
Copper foil land, 4 people...Silver jumper 14-B
...Pseudo silver jumper. Name of agent: Patent attorney Toshio Nakao and 1 other person 4-
A--Ichikin Ai Jiimpa 4-B-Ichisusu 5ib Jipenpa Ward ゝIN cQ Castle
Regret
Claims (1)
置した２層構造のプリント基板であって、上記２層目の
銀ジャンパーの延長線上に他端にスルホール部を形成し
ない疑似の銀ジャンパーをクリームハンダが置かれる銅
箔ランドに接近するように配置させたことを特徴とする
プリント基板。A printed circuit board with a two-layer structure in which a silver jumper insulated from the copper foil is placed on top of the copper foil, and a pseudo-silver printed circuit board that does not form a through-hole part at the other end on the extension line of the second layer silver jumper. A printed circuit board characterized in that a jumper is arranged close to a copper foil land on which cream solder is placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12054686A JPH0760923B2 (en) | 1986-05-26 | 1986-05-26 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12054686A JPH0760923B2 (en) | 1986-05-26 | 1986-05-26 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62277784A true JPS62277784A (en) | 1987-12-02 |
| JPH0760923B2 JPH0760923B2 (en) | 1995-06-28 |
Family
ID=14788977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12054686A Expired - Fee Related JPH0760923B2 (en) | 1986-05-26 | 1986-05-26 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760923B2 (en) |
-
1986
- 1986-05-26 JP JP12054686A patent/JPH0760923B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0760923B2 (en) | 1995-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |