JPS622765Y2 - - Google Patents
Info
- Publication number
- JPS622765Y2 JPS622765Y2 JP6018982U JP6018982U JPS622765Y2 JP S622765 Y2 JPS622765 Y2 JP S622765Y2 JP 6018982 U JP6018982 U JP 6018982U JP 6018982 U JP6018982 U JP 6018982U JP S622765 Y2 JPS622765 Y2 JP S622765Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cavity
- molded product
- head
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 6
- 239000000470 constituent Substances 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6018982U JPS58162635U (ja) | 1982-04-23 | 1982-04-23 | 半導体樹脂封入成形用金型装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6018982U JPS58162635U (ja) | 1982-04-23 | 1982-04-23 | 半導体樹脂封入成形用金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58162635U JPS58162635U (ja) | 1983-10-29 |
| JPS622765Y2 true JPS622765Y2 (enrdf_load_stackoverflow) | 1987-01-22 |
Family
ID=30070449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6018982U Granted JPS58162635U (ja) | 1982-04-23 | 1982-04-23 | 半導体樹脂封入成形用金型装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58162635U (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6096424A (ja) * | 1983-11-01 | 1985-05-30 | Nec Corp | モ−ルド金型 |
-
1982
- 1982-04-23 JP JP6018982U patent/JPS58162635U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58162635U (ja) | 1983-10-29 |
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