JPS62274793A - 電子部品実装配線基板 - Google Patents

電子部品実装配線基板

Info

Publication number
JPS62274793A
JPS62274793A JP61118886A JP11888686A JPS62274793A JP S62274793 A JPS62274793 A JP S62274793A JP 61118886 A JP61118886 A JP 61118886A JP 11888686 A JP11888686 A JP 11888686A JP S62274793 A JPS62274793 A JP S62274793A
Authority
JP
Japan
Prior art keywords
wiring board
component mounting
electronic component
coated
antistatic agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61118886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469834B2 (enrdf_load_stackoverflow
Inventor
泰郎 羽鳥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61118886A priority Critical patent/JPS62274793A/ja
Publication of JPS62274793A publication Critical patent/JPS62274793A/ja
Publication of JPH0469834B2 publication Critical patent/JPH0469834B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP61118886A 1986-05-23 1986-05-23 電子部品実装配線基板 Granted JPS62274793A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61118886A JPS62274793A (ja) 1986-05-23 1986-05-23 電子部品実装配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61118886A JPS62274793A (ja) 1986-05-23 1986-05-23 電子部品実装配線基板

Publications (2)

Publication Number Publication Date
JPS62274793A true JPS62274793A (ja) 1987-11-28
JPH0469834B2 JPH0469834B2 (enrdf_load_stackoverflow) 1992-11-09

Family

ID=14747575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61118886A Granted JPS62274793A (ja) 1986-05-23 1986-05-23 電子部品実装配線基板

Country Status (1)

Country Link
JP (1) JPS62274793A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5603380B2 (ja) * 2012-07-26 2014-10-08 三菱電線工業株式会社 警告表示灯

Also Published As

Publication number Publication date
JPH0469834B2 (enrdf_load_stackoverflow) 1992-11-09

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