JPS6226584B2 - - Google Patents
Info
- Publication number
- JPS6226584B2 JPS6226584B2 JP12862480A JP12862480A JPS6226584B2 JP S6226584 B2 JPS6226584 B2 JP S6226584B2 JP 12862480 A JP12862480 A JP 12862480A JP 12862480 A JP12862480 A JP 12862480A JP S6226584 B2 JPS6226584 B2 JP S6226584B2
- Authority
- JP
- Japan
- Prior art keywords
- tool
- bonding
- pressurizing
- pressure
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003825 pressing Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12862480A JPS5753997A (ja) | 1980-09-18 | 1980-09-18 | Bondeingusochi |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12862480A JPS5753997A (ja) | 1980-09-18 | 1980-09-18 | Bondeingusochi |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5753997A JPS5753997A (ja) | 1982-03-31 |
| JPS6226584B2 true JPS6226584B2 (enrdf_load_html_response) | 1987-06-09 |
Family
ID=14989392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12862480A Granted JPS5753997A (ja) | 1980-09-18 | 1980-09-18 | Bondeingusochi |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5753997A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4454215A (en) * | 1981-05-27 | 1984-06-12 | Savin Corporation | Improved composition for developing latent electrostatic images for gap transfer to a carrier sheet |
| US4413048A (en) * | 1981-09-01 | 1983-11-01 | Savin Corporation | Developing composition for a latent electrostatic image for transfer of the developed image across a gap to a carrier sheet |
| JP2617203B2 (ja) * | 1988-04-21 | 1997-06-04 | カシオ計算機株式会社 | Ｉｃチップリードの接合方法 |
-
1980
- 1980-09-18 JP JP12862480A patent/JPS5753997A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5753997A (ja) | 1982-03-31 |
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