JPS6226578B2 - - Google Patents

Info

Publication number
JPS6226578B2
JPS6226578B2 JP56068532A JP6853281A JPS6226578B2 JP S6226578 B2 JPS6226578 B2 JP S6226578B2 JP 56068532 A JP56068532 A JP 56068532A JP 6853281 A JP6853281 A JP 6853281A JP S6226578 B2 JPS6226578 B2 JP S6226578B2
Authority
JP
Japan
Prior art keywords
mask
wafer
holding member
photoelectric
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56068532A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57183034A (en
Inventor
Ichiro Mori
Toshiaki Shinozaki
Kazuyoshi Sugihara
Tooru Tojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56068532A priority Critical patent/JPS57183034A/ja
Priority to DE8282103628T priority patent/DE3270064D1/de
Priority to EP82103628A priority patent/EP0065143B1/en
Priority to US06/374,724 priority patent/US4469949A/en
Publication of JPS57183034A publication Critical patent/JPS57183034A/ja
Publication of JPS6226578B2 publication Critical patent/JPS6226578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP56068532A 1981-05-07 1981-05-07 Electron bean transfer device Granted JPS57183034A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56068532A JPS57183034A (en) 1981-05-07 1981-05-07 Electron bean transfer device
DE8282103628T DE3270064D1 (en) 1981-05-07 1982-04-28 Electron beam pattern transfer device and method for aligning mask and semiconductor wafer
EP82103628A EP0065143B1 (en) 1981-05-07 1982-04-28 Electron beam pattern transfer device and method for aligning mask and semiconductor wafer
US06/374,724 US4469949A (en) 1981-05-07 1982-05-04 Electron beam pattern transfer device and method for aligning mask and semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56068532A JPS57183034A (en) 1981-05-07 1981-05-07 Electron bean transfer device

Publications (2)

Publication Number Publication Date
JPS57183034A JPS57183034A (en) 1982-11-11
JPS6226578B2 true JPS6226578B2 (enrdf_load_stackoverflow) 1987-06-09

Family

ID=13376433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56068532A Granted JPS57183034A (en) 1981-05-07 1981-05-07 Electron bean transfer device

Country Status (4)

Country Link
US (1) US4469949A (enrdf_load_stackoverflow)
EP (1) EP0065143B1 (enrdf_load_stackoverflow)
JP (1) JPS57183034A (enrdf_load_stackoverflow)
DE (1) DE3270064D1 (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4572956A (en) * 1982-08-31 1986-02-25 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam pattern transfer system having an autofocusing mechanism
JPS59220922A (ja) * 1983-05-31 1984-12-12 Toshiba Corp 位置合わせ方法
GB2155201B (en) * 1984-02-24 1988-07-13 Canon Kk An x-ray exposure apparatus
GB2157069A (en) * 1984-04-02 1985-10-16 Philips Electronic Associated Step and repeat electron image projector
US4749867A (en) * 1985-04-30 1988-06-07 Canon Kabushiki Kaisha Exposure apparatus
US4861162A (en) * 1985-05-16 1989-08-29 Canon Kabushiki Kaisha Alignment of an object
US5029222A (en) * 1987-09-02 1991-07-02 Fujitsu Limited Photoelectron image projection apparatus
US4928018A (en) * 1989-06-29 1990-05-22 Texas Instruments, Incorporated Thermo-enhanced electron image projector
JPH07263308A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 電子ビーム露光方法及び装置
JPH09320931A (ja) * 1996-05-28 1997-12-12 Nikon Corp 結像特性計測方法及び該方法を使用する転写装置
JP2000003847A (ja) * 1998-06-15 2000-01-07 Canon Inc 荷電粒子線縮小転写装置及びデバイス製造方法
US6437347B1 (en) 1999-04-13 2002-08-20 International Business Machines Corporation Target locking system for electron beam lithography
JP3805565B2 (ja) * 1999-06-11 2006-08-02 株式会社日立製作所 電子線画像に基づく検査または計測方法およびその装置
US6952255B2 (en) 2003-08-06 2005-10-04 Lam Research Corporation System and method for integrated multi-use optical alignment
JP6200224B2 (ja) * 2012-09-13 2017-09-20 日本メクトロン株式会社 フォトマスク、フォトマスク組、露光装置および露光方法
US9984943B2 (en) * 2016-05-16 2018-05-29 Massachusetts Institute Of Technology Systems and methods for aligning and coupling semiconductor structures
EP3706262B1 (en) * 2019-02-15 2022-01-26 Nichia Corporation Method of manufacturing light emitting device, light emitting device, and base member
US20250183074A1 (en) * 2023-12-01 2025-06-05 Applied Materials, Inc. Sensor substrate and integrated sensing surfaces

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1533755A (fr) * 1966-08-16 1968-07-19 Jeol Ltd Dispositif pour le réglage du point de traitement dans un appareil à faisceau électrique ou analogue
US3679497A (en) * 1969-10-24 1972-07-25 Westinghouse Electric Corp Electron beam fabrication system and process for use thereof
US3710101A (en) * 1970-10-06 1973-01-09 Westinghouse Electric Corp Apparatus and method for alignment of members to electron beams
US3683195A (en) * 1971-03-22 1972-08-08 Kasper Instruments Apparatus for the automatic alignment of two superimposed objects,e.g. a semiconductor wafer and mask
US3745358A (en) * 1971-05-10 1973-07-10 Radiant Energy Systems Alignment method and apparatus for electron projection systems
FR2146106B1 (enrdf_load_stackoverflow) * 1971-07-16 1977-08-05 Thomson Csf
DE2722958A1 (de) * 1977-05-20 1978-11-23 Siemens Ag Verfahren zur justierung einer halbleiterscheibe relativ zu einer bestrahlungsmaske bei der roentgenstrahl-fotolithografie
US4335313A (en) * 1980-05-12 1982-06-15 The Perkin-Elmer Corporation Method and apparatus for aligning an opaque mask with an integrated circuit wafer

Also Published As

Publication number Publication date
EP0065143A2 (en) 1982-11-24
EP0065143B1 (en) 1986-03-26
DE3270064D1 (en) 1986-04-30
EP0065143A3 (en) 1983-11-09
US4469949A (en) 1984-09-04
JPS57183034A (en) 1982-11-11

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