JPS62265727A - Ｉｃ部品の製造方法 - Google Patents

Ｉｃ部品の製造方法

Info

Publication number
JPS62265727A
JPS62265727A JP10993286A JP10993286A JPS62265727A JP S62265727 A JPS62265727 A JP S62265727A JP 10993286 A JP10993286 A JP 10993286A JP 10993286 A JP10993286 A JP 10993286A JP S62265727 A JPS62265727 A JP S62265727A
Authority
JP
Japan
Prior art keywords
oxide film
etching
thickness
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10993286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439226B2 (enrdf_load_html_response
Inventor
Michiaki Yamagata
通昭 山県
Hiroshi Suzuki
広志 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP10993286A priority Critical patent/JPS62265727A/ja
Publication of JPS62265727A publication Critical patent/JPS62265727A/ja
Publication of JPH0439226B2 publication Critical patent/JPH0439226B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP10993286A 1986-05-14 1986-05-14 Ｉｃ部品の製造方法 Granted JPS62265727A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10993286A JPS62265727A (ja) 1986-05-14 1986-05-14 Ｉｃ部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10993286A JPS62265727A (ja) 1986-05-14 1986-05-14 Ｉｃ部品の製造方法

Publications (2)

Publication Number Publication Date
JPS62265727A true JPS62265727A (ja) 1987-11-18
JPH0439226B2 JPH0439226B2 (enrdf_load_html_response) 1992-06-26

Family

ID=14522763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10993286A Granted JPS62265727A (ja) 1986-05-14 1986-05-14 Ｉｃ部品の製造方法

Country Status (1)

Country Link
JP (1) JPS62265727A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5622899A (en) * 1996-04-22 1997-04-22 Taiwan Semiconductor Manufacturing Company Ltd. Method of fabricating semiconductor chips separated by scribe lines used for endpoint detection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5622899A (en) * 1996-04-22 1997-04-22 Taiwan Semiconductor Manufacturing Company Ltd. Method of fabricating semiconductor chips separated by scribe lines used for endpoint detection

Also Published As

Publication number Publication date
JPH0439226B2 (enrdf_load_html_response) 1992-06-26

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