JPS6226178B2 - - Google Patents

Info

Publication number
JPS6226178B2
JPS6226178B2 JP57084325A JP8432582A JPS6226178B2 JP S6226178 B2 JPS6226178 B2 JP S6226178B2 JP 57084325 A JP57084325 A JP 57084325A JP 8432582 A JP8432582 A JP 8432582A JP S6226178 B2 JPS6226178 B2 JP S6226178B2
Authority
JP
Japan
Prior art keywords
wiring
pattern
wiring pattern
wiring layer
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57084325A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58201336A (ja
Inventor
Akira Morikuri
Eitaro Sugino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57084325A priority Critical patent/JPS58201336A/ja
Publication of JPS58201336A publication Critical patent/JPS58201336A/ja
Publication of JPS6226178B2 publication Critical patent/JPS6226178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P74/00—

Landscapes

  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP57084325A 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法 Granted JPS58201336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57084325A JPS58201336A (ja) 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57084325A JPS58201336A (ja) 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法

Publications (2)

Publication Number Publication Date
JPS58201336A JPS58201336A (ja) 1983-11-24
JPS6226178B2 true JPS6226178B2 (OSRAM) 1987-06-08

Family

ID=13827357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084325A Granted JPS58201336A (ja) 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法

Country Status (1)

Country Link
JP (1) JPS58201336A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146980U (OSRAM) * 1989-05-10 1990-12-13

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810741B2 (ja) * 2001-03-23 2011-11-09 富士ゼロックス株式会社 自己走査型発光デバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146980U (OSRAM) * 1989-05-10 1990-12-13

Also Published As

Publication number Publication date
JPS58201336A (ja) 1983-11-24

Similar Documents

Publication Publication Date Title
US4516071A (en) Split-cross-bridge resistor for testing for proper fabrication of integrated circuits
JPH0241172B2 (OSRAM)
KR950006957A (ko) 중첩 오차 측정 패턴을 형성하는 단계를 포함하는 반도체 장치 제조 방법
US4437760A (en) Reusable electrical overlay measurement circuit and process
KR100273317B1 (ko) 반도체 소자 제조 공정에서 미스얼라이먼트 측정을 위한 테스트패턴의 구조와 그 측정방법
KR20070118030A (ko) 레티클, 반도체 칩, 및 반도체 장치의 제조 방법
JPS6226178B2 (OSRAM)
CN115295532B (zh) 用于e-fuse刻蚀的检测结构、制备及检测方法
JP2010114130A (ja) 半導体装置及びその製造方法
JP2587614B2 (ja) 半導体装置
JPH0572748B2 (OSRAM)
JPH0435907B2 (OSRAM)
JPH06216208A (ja) 集積回路のコンタクト抵抗測定器
JP3719737B2 (ja) 重ね合わせ精度測定方法およびそれに用いる重ね合わせ精度測定用マーク
JP2891729B2 (ja) 誘電体分離基板の測定方法及びその測定装置
JP2839469B2 (ja) マスク合わせずれ測定用パターン及びその測定方法
JPH053237A (ja) スルーホール／上層配線の合わせずれ検知方法
JPH04228B2 (OSRAM)
JP2548780B2 (ja) Ｍｏｓ形トランジスタ定数測定用パターン
JPH0230173B2 (OSRAM)
KR100192578B1 (ko) 비아 저항 체크 패턴 형성 방법
JPH07106391A (ja) 半導体デバイス及びその検査方法
JPH02134843A (ja) 集積回路
JPH0680669B2 (ja) 半導体装置
JPH1074811A (ja) 半導体装置の評価方法