JPS6226176B2 - - Google Patents

Info

Publication number
JPS6226176B2
JPS6226176B2 JP53156624A JP15662478A JPS6226176B2 JP S6226176 B2 JPS6226176 B2 JP S6226176B2 JP 53156624 A JP53156624 A JP 53156624A JP 15662478 A JP15662478 A JP 15662478A JP S6226176 B2 JPS6226176 B2 JP S6226176B2
Authority
JP
Japan
Prior art keywords
solder
substrate support
substrate
molten solder
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53156624A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5582445A (en
Inventor
Hiroyuki Fujii
Moryoshi Oota
Satoru Umehara
Kenichi Tateno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP15662478A priority Critical patent/JPS5582445A/ja
Publication of JPS5582445A publication Critical patent/JPS5582445A/ja
Publication of JPS6226176B2 publication Critical patent/JPS6226176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP15662478A 1978-12-18 1978-12-18 Method of bonding semiconductor substrate Granted JPS5582445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15662478A JPS5582445A (en) 1978-12-18 1978-12-18 Method of bonding semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15662478A JPS5582445A (en) 1978-12-18 1978-12-18 Method of bonding semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5582445A JPS5582445A (en) 1980-06-21
JPS6226176B2 true JPS6226176B2 (cg-RX-API-DMAC7.html) 1987-06-08

Family

ID=15631764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15662478A Granted JPS5582445A (en) 1978-12-18 1978-12-18 Method of bonding semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5582445A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63209456A (ja) * 1987-02-23 1988-08-31 Meiwa Seisakusho:Kk 永久磁石からなる固定子を具備する防爆形モ−タ
JPS6440248U (cg-RX-API-DMAC7.html) * 1987-09-03 1989-03-10

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334269Y2 (cg-RX-API-DMAC7.html) * 1981-05-28 1988-09-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63209456A (ja) * 1987-02-23 1988-08-31 Meiwa Seisakusho:Kk 永久磁石からなる固定子を具備する防爆形モ−タ
JPS6440248U (cg-RX-API-DMAC7.html) * 1987-09-03 1989-03-10

Also Published As

Publication number Publication date
JPS5582445A (en) 1980-06-21

Similar Documents

Publication Publication Date Title
US7833831B2 (en) Method of manufacturing an electronic component and an electronic device
JP2014097529A (ja) 発泡金属による接合方法、半導体装置の製造方法、半導体装置
JP4025371B2 (ja) 固定用エレメントの接着面をホットメルト形接着剤で被覆するための方法
JP2003525974A (ja) 熱伝導性接着剤継目および該熱伝導性接着剤継目の製造法
JP2010080540A (ja) 電極接続部の形成方法
JPS60154537A (ja) 半導体デバイスの製作方法
JPS6226176B2 (cg-RX-API-DMAC7.html)
JP2538071B2 (ja) 半導体装置の製造方法
US20060011711A1 (en) Method of fabricating a semiconductor device and mounting equipment
JPH0158866B2 (cg-RX-API-DMAC7.html)
JPH11154689A (ja) 金バンプ付電子部品の実装方法
JPH07307341A (ja) バンプの形成方法
JP2006100492A (ja) 支持板上への電子部品の固着法
JP3481025B2 (ja) ペレットボンディング装置
JPH0222989Y2 (cg-RX-API-DMAC7.html)
JPH03120844A (ja) 半導体装置の製造方法及びその装置
JPH09148377A (ja) 電子部品の製造方法及び半田ブロック
JPS5844961A (ja) ろう付けによる組立方法
JP2523915B2 (ja) ワイヤ接合方法
JPH09232386A (ja) ワイヤボンダ
JPS6138185Y2 (cg-RX-API-DMAC7.html)
JPH1092829A (ja) バンプの形成方法並びに半導体装置の製造方法
JPH09223868A (ja) 部品のボンディング方法とこれに用いる装置、ディスペンサ
JPH05144872A (ja) バンプ電極の接合方法
JPS61263230A (ja) ペレット付方法