JPS62261163A - サ−デイツプ型半導体装置用リ−ドフレ−ム - Google Patents

サ−デイツプ型半導体装置用リ−ドフレ−ム

Info

Publication number
JPS62261163A
JPS62261163A JP10537286A JP10537286A JPS62261163A JP S62261163 A JPS62261163 A JP S62261163A JP 10537286 A JP10537286 A JP 10537286A JP 10537286 A JP10537286 A JP 10537286A JP S62261163 A JPS62261163 A JP S62261163A
Authority
JP
Japan
Prior art keywords
lead
frame
outer frame
ceramic substrate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10537286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0545066B2 (enrdf_load_stackoverflow
Inventor
Masao Ueda
植田　正夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10537286A priority Critical patent/JPS62261163A/ja
Publication of JPS62261163A publication Critical patent/JPS62261163A/ja
Publication of JPH0545066B2 publication Critical patent/JPH0545066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10537286A 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム Granted JPS62261163A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10537286A JPS62261163A (ja) 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10537286A JPS62261163A (ja) 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS62261163A true JPS62261163A (ja) 1987-11-13
JPH0545066B2 JPH0545066B2 (enrdf_load_stackoverflow) 1993-07-08

Family

ID=14405866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10537286A Granted JPS62261163A (ja) 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS62261163A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0545066B2 (enrdf_load_stackoverflow) 1993-07-08

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