JPS62257792A - Method of attaching circuit elements to printed wiring board - Google Patents
Method of attaching circuit elements to printed wiring boardInfo
- Publication number
- JPS62257792A JPS62257792A JP10069086A JP10069086A JPS62257792A JP S62257792 A JPS62257792 A JP S62257792A JP 10069086 A JP10069086 A JP 10069086A JP 10069086 A JP10069086 A JP 10069086A JP S62257792 A JPS62257792 A JP S62257792A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- circuit elements
- circuit element
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 13
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は印刷配線板への回路素子の取り付は方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for mounting circuit elements on printed wiring boards.
周知のように、電子機器の＠薄短小化と共に電子部品の
実装は高密度化し８部品は小型化への努力が限りなく行
なわれている。As is well known, as electronic devices become thinner, shorter, and smaller, electronic components are mounted at higher densities, and endless efforts are being made to miniaturize the components.
高密度実装において２本来”あるべき“でめつ友リード
線をなくシ、チップ部品が出現して面実装技術が導入さ
れている。In high-density packaging, lead wires have been eliminated as they should have been, chip components have appeared, and surface mount technology has been introduced.
電子部品のチップ化及び面実装部品化は従来のリードス
ル一方式、即ち印刷配線板上に穴を明け。The production of electronic components into chips and surface-mounted components uses the conventional lead-through method, that is, by drilling holes on a printed wiring board.
そこにリード線を通して、その周辺に形成されたラウン
ドにハンダ付けする方式とは異なり、印刷配線板の表面
にチップ部品を載せ、印刷配線板のラウンドにハンダ付
は接合を行うものである。Unlike the method of passing lead wires through the leads and soldering them to the rounds formed around them, chip components are placed on the surface of the printed wiring board and soldering is performed to the rounds of the printed wiring board.
従って、印刷配線板への穴明は工程が省け０両１１に部
品を実装することが可能、印刷配嶽板の小型化及びパタ
ーンの細密化等の利点があり、今後。Therefore, drilling holes in printed wiring boards has the advantage of saving processes, making it possible to mount components on both cars, and miniaturizing printed mounting boards and making patterns more detailed.
さらに展開され主流となることが明らかである。It is clear that it will be further developed and become mainstream.
面実装技術において、印刷配線板の表面に搭載されたチ
ップ部品は印刷配線板上の所定位置に固定する際、接着
剤を使って仮固足する方法が特公昭５７−４３４９６号
等によって提案されている。In surface mounting technology, when chip components mounted on the surface of a printed wiring board are fixed in a predetermined position on the printed wiring board, a method has been proposed in Japanese Patent Publication No. 57-43496, etc., in which adhesive is used to temporarily fix the chip components on the surface of the printed wiring board. ing.
かかる接着剤の供給は多すぎても、少なすぎても良好な
結果が得られないことは公知となっている。It is known that supplying too much or too little of such adhesive will not give good results.
従って接着剤の供給を適せとし、効率よく塗布すること
は製品の品質向上及び生産効率ヲよくシ。Therefore, optimizing the supply of adhesive and applying it efficiently will improve product quality and production efficiency.
原価低減に寄与すること大である。This greatly contributes to cost reduction.
この発明は上記した印刷配線板への回路素子の１１！２
り付は方法に係る技術的諸問題の一つである回路素子を
印刷配線板上に仮固定するのに用いる接着剤を均一にし
かも短時間に効率よく塗布する問題点を解決するために
なされたものであり、その目的は比較的簡便な方法によ
り、印刷配線板への回路素子方法を提供するにある。This invention provides 11!2 circuit elements for the above-mentioned printed wiring board.
Gluing was done to solve one of the technical problems associated with the method, which is how to uniformly and efficiently apply the adhesive used to temporarily fix circuit elements on printed wiring boards in a short time. The purpose is to provide a method for attaching circuit elements to printed wiring boards by a relatively simple method.
この発明にかかわる印刷配線板への回路素子の取り付け
方法は印刷配線板の所定の位置に仮固定するために接着
剤を塗布するシルクスクリーン製版を行なう手段と９回
路素子を搭載した後、塗布し７を接着剤を加熱硬化させ
る手段と１回路素子の各電極と印刷配線板のラウンド部
と全ハンダ付けする手段とを設けたものである。The method for attaching circuit elements to a printed wiring board according to the present invention includes means for performing silk screen printing to apply an adhesive to temporarily fix it in a predetermined position on the printed wiring board, and a method for applying the adhesive after mounting the circuit elements. 7 is provided with means for heating and curing the adhesive and means for soldering all the electrodes of one circuit element and the round portion of the printed wiring board.
この発明においては、印刷配線板への回路素子の仮固定
に用いる接着剤の塗布においてシルクスクリーン製版手
段を用いて行なうので、均一にしかも効率よく塗布する
ことができる。In this invention, since the adhesive used for temporarily fixing the circuit element to the printed wiring board is applied using a silk screen plate making means, the adhesive can be applied uniformly and efficiently.
以下において実施例を上げ、この発明を説明する。第１
図、第２図、８ｇ３図、第４図、第５図。The present invention will be explained below with reference to Examples. 1st
Figure, Figure 2, Figure 8g3, Figure 4, Figure 5.
第６図は本発明の印刷配線板への回路素子取り付は方法
を用いて製造した印刷配線板の一実施例を示す断面図で
ある。FIG. 6 is a sectional view showing an embodiment of a printed wiring board manufactured using the method for attaching circuit elements to a printed wiring board of the present invention.
実施例は印刷配線板の両面に回路素子全敗フ付は搭載し
次ものであ９１図において、（１）は印刷配線板、＋２
１Ｆｉペーストハンダ、（３］は接着剤、１４）は回路
素子、（５りは加熱装置である。In the embodiment, the circuit elements are mounted on both sides of the printed wiring board. In Fig. 91, (1) is the printed wiring board, +2
1Fi paste solder, (3) adhesive, 14) circuit element, (5) heating device.
次に製造プロセスについて概説すると、印刷配線板ｉｌ
ｌ上の片面の所定位置にスクリーン印刷手段を用いてペ
ーストハンダ（２−りを塗布し２次いで本発明のシルク
スクリーン手段を用いて接着剤（３−りを塗布する。Next, to outline the manufacturing process, printed wiring board il
A paste solder (2-layer) is applied to a predetermined position on one side of the film using a screen printing means, and then an adhesive (3-layer) is applied using a silk-screening means of the present invention.
上記のペーストハンダ（２−１） 、接着剤（６−り上
に回路素子（４−１）を搭載し、２１［７熱装置ｊ！ｔ
ξ５）によ）。The circuit element (4-1) is mounted on the paste solder (2-1) and the adhesive (6-ri), and the 21 [7 heat device j!t
ξ5).
ペーストハンダ（２−り及び接着剤Ｃ５−１＞’を加熱
硬化させるのである。The paste solder (2-reel and adhesive C5-1>' is heated and cured.
以上のようにして印刷配線板＋１１上の片面への回路素
子（４１の仮固定が行なわれる。As described above, the circuit element (41) is temporarily fixed to one side of the printed wiring board +11.
印刷配線板上の他方の面の所定位置にはスクリーン印刷
手段音用いてペーストハンダ（２−２）のみを塗布し９
回路素子（４−２）を搭載後、加熱装置＋５１によシ加
熱硬化し仮固定するのである。Apply only paste solder (2-2) to a predetermined position on the other side of the printed wiring board using screen printing means.9
After the circuit element (4-2) is mounted, it is heated and hardened using a heating device +51 to temporarily fix it.
第７図は印刷配線板に取り付け次回路素子の詳細を示す
図であり１図において１６１ 、 ［７１は印刷配線板
（１１上の各々のパターン、ラウンドで、（８）は回路
素子（４）の電極である。FIG. 7 is a diagram showing the details of the next circuit element attached to the printed wiring board. In FIG. This is the electrode.
印刷配線板（１１のパターンの末端にあるラウンド（７
）士に回路素子＋４１はペーストハンダ（２）及び接着
剤（３）とによって仮固定され、その後ハンダ付は手段
により固定させるのである。Printed wiring board (round (7) at the end of pattern 11)
) The circuit element +41 is temporarily fixed with paste solder (2) and adhesive (3), and then soldered and fixed by other means.
以上説明したようＫこの発明によれば、印刷配線板への
回路素子の仮固定が容易になシ、今後拡大展開されよう
としている部品の小型化、接続技術の高度化９面実装に
大きく寄与するものと確信する。As explained above, this invention makes it easy to temporarily fix circuit elements to printed wiring boards, and greatly contributes to the miniaturization of components and the sophistication of connection technology, nine-sided mounting, which is expected to be expanded in the future. I am confident that I will.
第１図、第２図、第３図、第４図、第５図および第６図
は本発明の印刷配線板への回路素子取り付は方法を用い
て製造した印刷配線板の一実施例を示す断面図、第１図
は印刷配線板に取シ付けた回路素子の詳細を示す図であ
る。
図中、（１）は印刷配線板、 （２−１） 、 （２−
２）はペーストハンダ、（３）は接着剤、 （４−１）
、 （４−２）は回路素子、 １５＋は加熱装置、
（ｓ−１）、 （＋５−２）はパターン。
（７−１） 、 （７−２）はラウンド、 （８−１）
、 （８−２）は電極である。
なお１図中同一あるいは相当部分には同一符号を付して
示しである。1, 2, 3, 4, 5, and 6 are examples of printed wiring boards manufactured using the method for attaching circuit elements to printed wiring boards of the present invention. FIG. 1 is a diagram showing details of a circuit element attached to a printed wiring board. In the figure, (1) is a printed wiring board, (2-1), (2-
2) is paste solder, (3) is adhesive, (4-1)
, (4-2) is a circuit element, 15+ is a heating device,
(s-1) and (+5-2) are patterns. (7-1), (7-2) are rounds, (8-1)
, (8-2) is an electrode. Note that in FIG. 1, the same or corresponding parts are designated by the same reference numerals.
Claims (1)
子の取付位置に、上記回路素子の両端部下側面が上記印
刷配線板のラウンド上に接触するように固定するにおい
て、上記印刷配線板の所定の位置に仮固定するために接
着剤を塗布するシルクスクリーン製版を行なう手段と、
上記回路素子を搭載した後、塗布した接着剤を加熱硬化
させる手段と、上記回路素子の各電極を上記印刷配線板
のラウンド部とをハンダ付けする手段とを特徴とする印
刷配線板への回路素子の取り付け方法。fixing the circuit element to a mounting position of a printed wiring board having a desired pattern and a desired shape so that the lower side surfaces of both ends of the circuit element are in contact with the round surface of the printed wiring board; means for performing silk screen printing to apply adhesive for temporary fixation;
A circuit on a printed wiring board, comprising means for heating and curing the applied adhesive after mounting the circuit element, and means for soldering each electrode of the circuit element to a round portion of the printed wiring board. How to install the element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10069086A JPS62257792A (en) | 1986-04-30 | 1986-04-30 | Method of attaching circuit elements to printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10069086A JPS62257792A (en) | 1986-04-30 | 1986-04-30 | Method of attaching circuit elements to printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62257792A true JPS62257792A (en) | 1987-11-10 |
Family
ID=14280723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10069086A Pending JPS62257792A (en) | 1986-04-30 | 1986-04-30 | Method of attaching circuit elements to printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62257792A (en) |
-
1986
- 1986-04-30 JP JP10069086A patent/JPS62257792A/en active Pending
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