JPH04262376A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To increase the number of terminals and provide possibility of mounting parts on both sides of circuit board by preparing a circuit board on which semiconductor element and passive elements are mounted, and furnishing also a circuit, board equipped with connection electrode and end-face electrode. CONSTITUTION:Through holes 2 are formed in a main circuit boards 1, and on a sub-circuit board 4, connection electrodes 7 of metal in the form of comical pin are connected with end-face electrodes 5 according to a circuit pattern 6 in positions corresponding to the through holes 2. Solder paste having high melting point is injected in these through holes 2, in which the connection electrodes 7 on the sub-circuit board 4 are fitted, and soldering is made by pressing to it a heater block which has been high frequency heated. Thereby a hybrid IC device as the object of invention is fitted with end-face electrodes 5 as external connective terminals. which allows responding to surface mounting.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device suitable for reflow soldering, which is one of the surface mounting techniques.

0002

2. Description of the Related Art Conventional hybrid integrated circuit devices of this type include a method of forming end face electrodes on the side surfaces of a hybrid integrated circuit board, and a method of forming terminals having a clip structure for sandwiching the board in the upper and lower directions of the hybrid integrated circuit board. There are structures in which flat leads are formed by attaching them to opposite sides, and structures in which, after assembly using a DIP structure, the external terminal leads are shaped horizontally to the board in the final assembly process and cut to the desired length. It was common.

In addition, in order to support reflow soldering mounting, methods for connecting terminals to circuit boards include methods of fixing them with resin after soldering, and methods of attaching terminals and terminal lands to prevent them from coming off during reflow. The common method was to plate it with gold and attach it using thermocompression bonding without using solder.

0004

[Problems to be Solved by the Invention] In the conventional hybrid integrated circuit device described above, with the method of providing end electrodes on the side surface of the circuit board, it is possible to mount components only on one side of the circuit board. It had the disadvantage of low efficiency. In addition, in the case of the method of forming flat leads using external terminals having a clip structure, it is difficult to realize a clip structure with a terminal pitch of 1 mm or less, so it is not suitable for hybrid integrated circuits having a large number of input/output terminals. There was a drawback. Furthermore, since the lead fixation relied on solder connections, manual work using a soldering iron was required to prevent the clip part from coming off during the reflow process, resulting in a significant increase in mounting costs. .

[0005]

[Means for Solving the Problems] A hybrid integrated circuit device of the present invention has semiconductor elements and passive elements mounted on a circuit pattern formed on an insulating substrate, and terminals for external connection of signals and power supply formed by through holes. a first circuit board;
An end surface electrode for external connection of the signal and power supply is formed on the end surface of the insulating substrate, which is arranged vertically over the first circuit board, and is connected to the end surface electrode and fitted into the through hole, and is soldered. and a second circuit board having pin-shaped connection electrodes to be bonded.

[0006]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a conceptual diagram showing an embodiment of a hybrid integrated circuit device of the present invention, in which (A) is a perspective view and (B) is a partial sectional view.

As shown in FIG. 1, the hybrid integrated circuit device of this embodiment includes a main circuit board 1 and a sub-circuit board 4 arranged vertically overlapping the main circuit board 1. There is.

The main circuit board 1 has semiconductor elements and passive elements mounted on a circuit pattern 3 formed on an insulating substrate, and terminals for external connection of signals and power are provided through through holes 2.
It is formed by The sub-circuit board 4 has an end face electrode 5 for external connection of signals and power supply formed on the end face of the insulating board, is connected to the end face electrode 5 by a circuit pattern 6, is fitted into the through hole 2, and is soldered with solder 8. It has a pin-shaped connection electrode 7 to be bonded.

Next, the actual application of this embodiment will be explained.

As an example, the main circuit board 1 of this embodiment
The thickness of the insulating substrate is 1.0 mm, and the diameter of the insulating substrate is 1 m.
The through holes 2 are formed with a pitch of 2.54 mm. Moreover, the sub-circuit board 4 has an insulating board thickness of 1.0 m.
m, and conical pin-shaped metal connection electrodes 7 are provided at positions corresponding to the through holes 2, that is, at a pitch of 2.54 mm, and are connected to the end surface electrodes 5 with a pitch of 2.54 mm by a circuit pattern 6. has been done.

The main circuit board 1 and sub-circuit board 4 are assembled in the following steps.

First, the through hole 2 of the main circuit board 1
Then, a high melting point solder paste of 230° C. is injected using a dispenser. Next, the connection electrodes 7 of the sub-circuit board 4 are fitted into the through holes 2, and soldered by pressing a high-frequency heated heater block against them. Due to the above,
The hybrid integrated circuit device is equipped with end face electrodes 5 as external connection terminals and can be used for surface mounting.

Next, a second embodiment of the present invention will be explained.

FIG. 2 is a diagram showing a second embodiment of the hybrid integrated circuit device of the present invention, in which (A) is a perspective view and (B) is a partial sectional view.

The difference between this embodiment and the first embodiment described above is that a stopper portion 9 such as a step is provided on the connection electrode 7 of the sub-circuit board 4 to restrict insertion into the through-hole 2 of the main circuit board 1. That's what I did. This makes it possible to set the distance between the main circuit board 1 and the sub-circuit board 4 to, for example, 3 mm. As a result, the main circuit board 1 is
Since components can be mounted on both sides, mounting density can be greatly improved.

Correspondingly, in this embodiment, the through holes 2 and the corresponding connection electrodes 7 are arranged at a pitch of 1.2.
An example of 7 mm arranged in two rows is shown. In this case, the pitch of the end face electrodes is 0.65 mm, so it is possible to significantly increase the number of terminals.

[0018]

As explained above, the hybrid integrated circuit device of the present invention has a first circuit board on which a semiconductor element and a passive element are mounted and has a through hole for external connection, and a connecting electrode that fits into the through hole. and a second circuit board having end surface electrodes, the pitch of the external terminals can be reduced to 1.
It has the effect of increasing the density to less than mm and greatly increasing the number of terminals. Furthermore, since components can be mounted on both sides, the mounting density can be improved. Furthermore, since no clip structure is used, the problem of detachment of the clip part during the reflow process can be avoided, and therefore the mounting cost can be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 is a conceptual diagram showing an embodiment of a hybrid integrated circuit device of the present invention.

FIG. 2 is a conceptual diagram showing a second embodiment of the hybrid integrated circuit device of the present invention.

[Explanation of symbols]

1 Main circuit board 2 Through hole 3,6 Circuit pattern 4 Sub circuit board 5 End electrode 7 Connection electrode 8 Solder 9 Stopper part

Claims (2)

[Claims] 1. A first circuit board, in which semiconductor elements and passive elements are mounted on a circuit pattern formed on an insulating substrate, and terminals for external connection of signals and power sources are formed by through holes; and the first circuit board. An end surface electrode for external connection of the signal and power supply is formed on the end surface of the insulating substrate, and a pin-shaped connection is connected to the end surface electrode, fits into the through hole, and is bonded by soldering. A hybrid integrated circuit device comprising: a second circuit board having electrodes. 2. The second circuit board is arranged one above the other at a predetermined distance from the first circuit board, and the connection electrode has a length equal to the distance from the surface of the second circuit board. 2. The hybrid integrated circuit device according to claim 1, further comprising a protruding portion on a circumferential portion thereof for restricting insertion into said through hole.