JPS622558A - 半導体整流装置 - Google Patents

半導体整流装置

Info

Publication number
JPS622558A
JPS622558A JP14116485A JP14116485A JPS622558A JP S622558 A JPS622558 A JP S622558A JP 14116485 A JP14116485 A JP 14116485A JP 14116485 A JP14116485 A JP 14116485A JP S622558 A JPS622558 A JP S622558A
Authority
JP
Japan
Prior art keywords
semiconductor pellet
conductive paste
semiconductor
electrodes
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14116485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365898B2 (OSRAM
Inventor
Kazuo Sonoda
園田　和夫
Kazuyoshi Naito
内藤　一芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP14116485A priority Critical patent/JPS622558A/ja
Publication of JPS622558A publication Critical patent/JPS622558A/ja
Publication of JPH0365898B2 publication Critical patent/JPH0365898B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP14116485A 1985-06-27 1985-06-27 半導体整流装置 Granted JPS622558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14116485A JPS622558A (ja) 1985-06-27 1985-06-27 半導体整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14116485A JPS622558A (ja) 1985-06-27 1985-06-27 半導体整流装置

Publications (2)

Publication Number Publication Date
JPS622558A true JPS622558A (ja) 1987-01-08
JPH0365898B2 JPH0365898B2 (OSRAM) 1991-10-15

Family

ID=15285622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14116485A Granted JPS622558A (ja) 1985-06-27 1985-06-27 半導体整流装置

Country Status (1)

Country Link
JP (1) JPS622558A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521124A (en) * 1995-04-04 1996-05-28 Tai; Chao-Chi Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals
US6946730B2 (en) 2001-04-25 2005-09-20 Denso Corporation Semiconductor device having heat conducting plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521124A (en) * 1995-04-04 1996-05-28 Tai; Chao-Chi Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals
US6946730B2 (en) 2001-04-25 2005-09-20 Denso Corporation Semiconductor device having heat conducting plate
US6963133B2 (en) * 2001-04-25 2005-11-08 Denso Corporation Semiconductor device and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JPH0365898B2 (OSRAM) 1991-10-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term