JPS622557A - 半導体デバイスの静電破壊防止方法 - Google Patents
半導体デバイスの静電破壊防止方法Info
- Publication number
- JPS622557A JPS622557A JP14077085A JP14077085A JPS622557A JP S622557 A JPS622557 A JP S622557A JP 14077085 A JP14077085 A JP 14077085A JP 14077085 A JP14077085 A JP 14077085A JP S622557 A JPS622557 A JP S622557A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- film
- electrostatic damage
- plastic member
- preventing electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000003068 static effect Effects 0.000 title claims abstract description 11
- 230000015556 catabolic process Effects 0.000 title abstract 2
- 239000004033 plastic Substances 0.000 claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001257 hydrogen Substances 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000006378 damage Effects 0.000 claims description 22
- 238000007600 charging Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 8
- 238000005240 physical vapour deposition Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000003566 sealing material Substances 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000000593 degrading effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14077085A JPS622557A (ja) | 1985-06-27 | 1985-06-27 | 半導体デバイスの静電破壊防止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14077085A JPS622557A (ja) | 1985-06-27 | 1985-06-27 | 半導体デバイスの静電破壊防止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS622557A true JPS622557A (ja) | 1987-01-08 |
| JPH0451060B2 JPH0451060B2 (enrdf_load_stackoverflow) | 1992-08-18 |
Family
ID=15276339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14077085A Granted JPS622557A (ja) | 1985-06-27 | 1985-06-27 | 半導体デバイスの静電破壊防止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622557A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106940A (ja) * | 1988-10-17 | 1990-04-19 | Semiconductor Energy Lab Co Ltd | 電子装置及びその作製方法 |
| US6756670B1 (en) | 1988-08-26 | 2004-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and its manufacturing method |
| US10167157B2 (en) | 2014-01-27 | 2019-01-01 | Danieli & C. Officine Meccaniche S.P.A. | Station for inspecting rolled strips in coils |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58102545A (ja) * | 1981-12-15 | 1983-06-18 | Nec Corp | 混成集積回路 |
-
1985
- 1985-06-27 JP JP14077085A patent/JPS622557A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58102545A (ja) * | 1981-12-15 | 1983-06-18 | Nec Corp | 混成集積回路 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756670B1 (en) | 1988-08-26 | 2004-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and its manufacturing method |
| JPH02106940A (ja) * | 1988-10-17 | 1990-04-19 | Semiconductor Energy Lab Co Ltd | 電子装置及びその作製方法 |
| US10167157B2 (en) | 2014-01-27 | 2019-01-01 | Danieli & C. Officine Meccaniche S.P.A. | Station for inspecting rolled strips in coils |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451060B2 (enrdf_load_stackoverflow) | 1992-08-18 |
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