JPS6225263B2 - - Google Patents

Info

Publication number
JPS6225263B2
JPS6225263B2 JP54500778A JP50077879A JPS6225263B2 JP S6225263 B2 JPS6225263 B2 JP S6225263B2 JP 54500778 A JP54500778 A JP 54500778A JP 50077879 A JP50077879 A JP 50077879A JP S6225263 B2 JPS6225263 B2 JP S6225263B2
Authority
JP
Japan
Prior art keywords
metal
semiconductor device
bonded
diffusion
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54500778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55500385A (enExample
Inventor
Saado Hoomaa Hopuson Gurasukotsuku
Dagurasu Yuujin Hausuton
Maikeru Haabaato Makuroorin
Harorudo Furanku Uebusutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS55500385A publication Critical patent/JPS55500385A/ja
Publication of JPS6225263B2 publication Critical patent/JPS6225263B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W40/611—
    • H10W40/47—
    • H10W76/138—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thyristors (AREA)
JP54500778A 1978-05-01 1979-04-30 Expired JPS6225263B2 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90179278A 1978-05-01 1978-05-01
US05/958,100 US4392153A (en) 1978-05-01 1978-11-06 Cooled semiconductor power module including structured strain buffers without dry interfaces

Publications (2)

Publication Number Publication Date
JPS55500385A JPS55500385A (enExample) 1980-07-03
JPS6225263B2 true JPS6225263B2 (enExample) 1987-06-02

Family

ID=27129303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54500778A Expired JPS6225263B2 (enExample) 1978-05-01 1979-04-30

Country Status (5)

Country Link
US (1) US4392153A (enExample)
EP (1) EP0012770B1 (enExample)
JP (1) JPS6225263B2 (enExample)
DE (1) DE2965896D1 (enExample)
WO (1) WO1979001012A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10634842B2 (en) 2017-04-21 2020-04-28 Nuburu, Inc. Multi-clad optical fiber
US10804680B2 (en) 2017-06-13 2020-10-13 Nuburu, Inc. Very dense wavelength beam combined laser system
US10971896B2 (en) 2013-04-29 2021-04-06 Nuburu, Inc. Applications, methods and systems for a laser deliver addressable array
US11612957B2 (en) 2016-04-29 2023-03-28 Nuburu, Inc. Methods and systems for welding copper and other metals using blue lasers
US11646549B2 (en) 2014-08-27 2023-05-09 Nuburu, Inc. Multi kW class blue laser system
JP2023168979A (ja) * 2022-05-16 2023-11-29 株式会社レゾナック 冷却構造体及び構造体

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3070263D1 (en) * 1979-03-08 1985-04-18 Gen Electric Thermo-compression bonding a semiconductor to strain buffer
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
EP0075036B1 (de) * 1981-09-19 1986-10-15 BROWN, BOVERI & CIE Aktiengesellschaft Mannheim Leistungshalbleiterbauelement für Flüssigkeitskühlung
DE3466833D1 (en) * 1983-11-02 1987-11-19 Bbc Brown Boveri & Cie Cooling body for the liquid cooling of power semiconductor devices
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
JPS61220359A (ja) * 1985-03-26 1986-09-30 Hitachi Ltd 半導体モジユ−ル冷却構造体
US4631573A (en) * 1985-05-24 1986-12-23 Sundstrand Corporation Cooled stack of electrically isolated semiconductors
US4921415A (en) * 1987-11-27 1990-05-01 General Electric Company Cure monitoring apparatus having high temperature ultrasonic transducers
US4825117A (en) * 1987-11-27 1989-04-25 General Electric Company Temperature compensated piezoelectric transducer assembly
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
DE4101205A1 (de) * 1990-02-09 1991-08-14 Asea Brown Boveri Gekuehltes hochleistungshalbleiterbauelement
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
FR2786656B1 (fr) * 1998-11-27 2001-01-26 Alstom Technology Composant electronique de puissance comportant des moyens de refroidissement
US6313992B1 (en) 1998-12-22 2001-11-06 James J. Hildebrandt Method and apparatus for increasing the power density of integrated circuit boards and their components
US6552901B2 (en) 1998-12-22 2003-04-22 James Hildebrandt Apparatus and system for cooling electronic circuitry, heat sinks, and related components
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
EP2244289B1 (en) * 2000-04-19 2014-03-26 Denso Corporation Coolant cooled type semiconductor device
US20030218057A1 (en) * 2000-11-07 2003-11-27 Craig Joseph Electrical bus with associated porous metal heat sink and method of manufacturing same
US6942019B2 (en) * 2002-03-25 2005-09-13 Ltx Corporation Apparatus and method for circuit board liquid cooling
US6772881B2 (en) * 2002-07-29 2004-08-10 Scott C. Le Remote control cover
US7068507B2 (en) * 2002-09-27 2006-06-27 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
US6956742B2 (en) * 2002-09-27 2005-10-18 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
US6885553B2 (en) * 2002-09-27 2005-04-26 Rockwell Automation Technologies, Inc. Bus bar assembly for use with a compact power conversion assembly
US20040060689A1 (en) * 2002-09-27 2004-04-01 Pfeifer David W. Compact liquid cooled heat sink
US6665185B1 (en) 2002-10-09 2003-12-16 Ltx Corporation Apparatus and method for embedded fluid cooling in printed circuit boards
US7632258B2 (en) * 2003-03-19 2009-12-15 Kimberly-Clark Worldwide, Inc. Multilayer absorbent article
US7030486B1 (en) * 2003-05-29 2006-04-18 Marshall Paul N High density integrated circuit package architecture
US7245493B2 (en) * 2003-08-06 2007-07-17 Denso Corporation Cooler for cooling electric part
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
EP1672692B1 (de) * 2004-12-16 2015-01-07 ABB Research Ltd Leistungshalbleiter-Modul
US7696532B2 (en) * 2004-12-16 2010-04-13 Abb Research Ltd Power semiconductor module
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
DE102005058654B4 (de) * 2005-12-07 2015-06-11 Infineon Technologies Ag Verfahren zum flächigen Fügen von Komponenten von Halbleiterbauelementen
US7965508B2 (en) * 2007-03-27 2011-06-21 Denso Corporation Cooling device for electronic component and power converter equipped with the same
US7492594B2 (en) * 2007-05-03 2009-02-17 Hamilton Sundstrand Corporation Electronic circuit modules cooling
US7737548B2 (en) * 2007-08-29 2010-06-15 Fairchild Semiconductor Corporation Semiconductor die package including heat sinks
WO2009125779A1 (ja) * 2008-04-09 2009-10-15 富士電機デバイステクノロジー株式会社 半導体装置及び半導体装置の製造方法
EP2277365B1 (en) 2008-05-16 2011-11-02 Parker-Hannifin Corporation Modular high-power drive stack cooled with vaporizable dielectric fluid
JP4586087B2 (ja) * 2008-06-30 2010-11-24 株式会社日立製作所 パワー半導体モジュール
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US20110317369A1 (en) * 2010-06-29 2011-12-29 General Electric Company Heat sinks with millichannel cooling
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US9048721B2 (en) * 2011-09-27 2015-06-02 Keihin Corporation Semiconductor device
CN103023279B (zh) * 2011-09-27 2015-05-13 株式会社京浜 半导体控制装置
US8711565B2 (en) 2011-11-02 2014-04-29 General Electric Company System and method for operating an electric power converter
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
DE102014114097B4 (de) 2014-09-29 2017-06-01 Danfoss Silicon Power Gmbh Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe
DE102014114096A1 (de) * 2014-09-29 2016-03-31 Danfoss Silicon Power Gmbh Sinterwerkzeug für den Unterstempel einer Sintervorrichtung
DE102014114095B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Sintervorrichtung
DE102014114093B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern
US9818726B2 (en) * 2015-12-28 2017-11-14 International Business Machines Corporation Chip stack cooling structure
JP7159620B2 (ja) * 2018-05-30 2022-10-25 富士電機株式会社 半導体装置、冷却モジュール、電力変換装置及び電動車両
JP7156319B2 (ja) * 2020-01-22 2022-10-19 株式会社デンソー 電力変換装置
CN115274584A (zh) * 2022-06-24 2022-11-01 华为数字能源技术有限公司 一种功率模组及其制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE537167A (enExample) * 1954-04-07
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
FR1476245A (fr) * 1965-04-23 1967-04-07 Siemens Ag Dispositif redresseur comportant une cellule redresseuse avec un corps semiconducteur monocristallin et un boîtier en forme de disque
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
US3787958A (en) * 1965-08-18 1974-01-29 Atomic Energy Commission Thermo-electric modular structure and method of making same
US3391446A (en) * 1965-08-30 1968-07-09 Atomic Energy Commission Usa Aluminum brazing
FR2003573A1 (enExample) * 1968-03-09 1969-11-07 Mitsubishi Electric Corp
US3585711A (en) * 1968-09-06 1971-06-22 Us Navy Gold-silicon bonding process
GB1297046A (enExample) * 1969-08-25 1972-11-22
US3678570A (en) * 1971-04-01 1972-07-25 United Aircraft Corp Diffusion bonding utilizing transient liquid phase
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device
US3761783A (en) * 1972-02-02 1973-09-25 Sperry Rand Corp Duel-mesa ring-shaped high frequency diode
US3768548A (en) * 1972-03-02 1973-10-30 Motor Co Cooling apparatus for semiconductor devices
US3872496A (en) * 1973-09-13 1975-03-18 Sperry Rand Corp High frequency diode having simultaneously formed high strength bonds with respect to a diamond heat sink and said diode
JPS5116302B2 (enExample) * 1973-10-22 1976-05-22
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
GB1598174A (en) * 1977-05-31 1981-09-16 Ibm Cooling electrical apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10971896B2 (en) 2013-04-29 2021-04-06 Nuburu, Inc. Applications, methods and systems for a laser deliver addressable array
US11646549B2 (en) 2014-08-27 2023-05-09 Nuburu, Inc. Multi kW class blue laser system
US11612957B2 (en) 2016-04-29 2023-03-28 Nuburu, Inc. Methods and systems for welding copper and other metals using blue lasers
US10634842B2 (en) 2017-04-21 2020-04-28 Nuburu, Inc. Multi-clad optical fiber
US10804680B2 (en) 2017-06-13 2020-10-13 Nuburu, Inc. Very dense wavelength beam combined laser system
JP2023168979A (ja) * 2022-05-16 2023-11-29 株式会社レゾナック 冷却構造体及び構造体

Also Published As

Publication number Publication date
DE2965896D1 (en) 1983-08-25
US4392153A (en) 1983-07-05
JPS55500385A (enExample) 1980-07-03
EP0012770A4 (en) 1980-09-29
EP0012770B1 (en) 1983-07-20
EP0012770A1 (en) 1980-07-09
WO1979001012A1 (en) 1979-11-29

Similar Documents

Publication Publication Date Title
JPS6225263B2 (enExample)
JP4292686B2 (ja) 冷媒冷却型両面冷却半導体装置
US5006921A (en) Power semiconductor switching apparatus with heat sinks
US3652903A (en) Fluid cooled pressure assembly
US4996586A (en) Crimp-type semiconductor device having non-alloy structure
US2907935A (en) Junction-type semiconductor device
JP2000174180A (ja) 半導体装置
US3763402A (en) Fluid cooled rectifier holding assembly
US5132777A (en) Cooled high-power semiconductor device
CN100385652C (zh) 半导体装置
US3328650A (en) Compression bonded semiconductor device
US3686541A (en) A flexible resilient member for applying a clamping force to thyristor units
JP2013042142A (ja) 電力半導体装置、複数の電力半導体装置を備えた電力半導体モジュール、及び複数の電力半導体モジュールを有するモジュール・アセンブリ
CN115868020A (zh) 带电流旁路机构的功率半导体装置
JP2000228491A (ja) 半導体モジュール及び電力変換装置
JP3394000B2 (ja) モジュール型半導体装置及びこれを用いた電力変換装置
CA1131793A (en) Fluid cooled semiconductor device
JPH0714029B2 (ja) 電力用半導体素子
JP2000307058A (ja) パワー半導体モジュール
JPH0677368A (ja) 半導体装置およびその製造方法
WO2021085006A1 (ja) パワー半導体装置およびパワー半導体装置の製造方法
JPS5832423A (ja) 半導体装置
JP3346901B2 (ja) 半導体装置
JPH09260557A (ja) 半導体装置およびその製造方法
JPH10245206A (ja) オゾン発生装置用放電セル