JPS6224938B2 - - Google Patents

Info

Publication number
JPS6224938B2
JPS6224938B2 JP60159026A JP15902685A JPS6224938B2 JP S6224938 B2 JPS6224938 B2 JP S6224938B2 JP 60159026 A JP60159026 A JP 60159026A JP 15902685 A JP15902685 A JP 15902685A JP S6224938 B2 JPS6224938 B2 JP S6224938B2
Authority
JP
Japan
Prior art keywords
boat
heat treatment
boats
holding member
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60159026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6144425A (ja
Inventor
Tatsunori Nakajima
Kosei Kajiwara
Kuni Ogawa
Kosuke Yasuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60159026A priority Critical patent/JPS6144425A/ja
Publication of JPS6144425A publication Critical patent/JPS6144425A/ja
Publication of JPS6224938B2 publication Critical patent/JPS6224938B2/ja
Granted legal-status Critical Current

Links

JP60159026A 1985-07-18 1985-07-18 半導体基板の熱処理用ボート Granted JPS6144425A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60159026A JPS6144425A (ja) 1985-07-18 1985-07-18 半導体基板の熱処理用ボート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60159026A JPS6144425A (ja) 1985-07-18 1985-07-18 半導体基板の熱処理用ボート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14345577A Division JPS5475985A (en) 1977-11-29 1977-11-29 Heat treatment method of semiconductor substrate and its unit

Publications (2)

Publication Number Publication Date
JPS6144425A JPS6144425A (ja) 1986-03-04
JPS6224938B2 true JPS6224938B2 (2) 1987-05-30

Family

ID=15684630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60159026A Granted JPS6144425A (ja) 1985-07-18 1985-07-18 半導体基板の熱処理用ボート

Country Status (1)

Country Link
JP (1) JPS6144425A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102792434A (zh) * 2010-02-18 2012-11-21 动力微系统公司 可堆叠基板载送装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2331288B (en) * 1994-12-20 1999-06-30 Dainippon Printing Co Ltd Sawtooth cutter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102792434A (zh) * 2010-02-18 2012-11-21 动力微系统公司 可堆叠基板载送装置

Also Published As

Publication number Publication date
JPS6144425A (ja) 1986-03-04

Similar Documents

Publication Publication Date Title
US20030150386A1 (en) Apparatus for fabricating a semiconductor device
JPH08330318A (ja) 被処理体の支持ボート
JPS6224938B2 (2)
JPS6122856B2 (2)
JP3103718B2 (ja) 太陽電池用半導体接合の形成装置
JPS6047981B2 (ja) 横型熱処理炉の内部温度検出用治具
JPS586136A (ja) 半導体ウエ−ハの熱処理法
JPH06333914A (ja) 半導体製造装置
JPH05315272A (ja) 石英ボート
JPS5832266Y2 (ja) 薄板体の立替具
JPH1131639A (ja) 半導体製造装置
JPS6020510A (ja) 不純物拡散方法
JPH0220830Y2 (2)
JPS6031260Y2 (ja) 半導体製造装置
JPS59154017A (ja) 半導体ウエハの加熱炉用パドル
JPS5934139Y2 (ja) ボ−ト保持具
JPS5922114Y2 (ja) 熱処理装置
KR200198408Y1 (ko) 웨이퍼의 확산, 증착용 반응장치
JPH01256120A (ja) 半導体基板の熱処理方法及びその装置
JPS6085538A (ja) 半導体製造方法
JPH05144759A (ja) 半導体製造装置
JPH01170020A (ja) 不純物拡散方法
JPS63160325A (ja) 半導体ウエハの熱処理方法および熱処理装置
JPH0669041B2 (ja) 短時間熱処理装置
JPH09139389A (ja) 半導体デバイス製造用治具及び半導体デバイスの製造方法