JPS62235482A - エツチング廃液の再生方法及び装置 - Google Patents
エツチング廃液の再生方法及び装置Info
- Publication number
- JPS62235482A JPS62235482A JP2513886A JP2513886A JPS62235482A JP S62235482 A JPS62235482 A JP S62235482A JP 2513886 A JP2513886 A JP 2513886A JP 2513886 A JP2513886 A JP 2513886A JP S62235482 A JPS62235482 A JP S62235482A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- electrolytic cell
- solution
- current density
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 104
- 239000002699 waste material Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims description 35
- 230000001172 regenerating effect Effects 0.000 title claims description 16
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 230000005484 gravity Effects 0.000 claims abstract description 42
- 230000001590 oxidative effect Effects 0.000 claims abstract description 3
- 238000011069 regeneration method Methods 0.000 claims description 14
- 229910021645 metal ion Inorganic materials 0.000 claims description 11
- 230000008929 regeneration Effects 0.000 claims description 9
- 238000005868 electrolysis reaction Methods 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims 2
- 238000003860 storage Methods 0.000 abstract description 10
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 abstract description 7
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 2
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 abstract 2
- 150000001455 metallic ions Chemical class 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 47
- 239000010949 copper Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000008151 electrolyte solution Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000033116 oxidation-reduction process Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- -1 chlorine ions Chemical class 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/938,926 US4781673A (en) | 1985-12-20 | 1986-12-08 | Brain ventricle shunt system with flow-rate switching mechanism |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60-288836 | 1985-12-20 | ||
| JP28883685 | 1985-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62235482A true JPS62235482A (ja) | 1987-10-15 |
| JPS6354795B2 JPS6354795B2 (enrdf_load_stackoverflow) | 1988-10-31 |
Family
ID=17735377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2513886A Granted JPS62235482A (ja) | 1985-12-20 | 1986-02-06 | エツチング廃液の再生方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62235482A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05117879A (ja) * | 1991-10-28 | 1993-05-14 | Nittetsu Mining Co Ltd | エツチング液の処理方法 |
| WO2023217253A1 (zh) * | 2022-05-12 | 2023-11-16 | 叶涛 | 一种递进式电解回用酸性蚀刻废液的方法及其装置 |
-
1986
- 1986-02-06 JP JP2513886A patent/JPS62235482A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05117879A (ja) * | 1991-10-28 | 1993-05-14 | Nittetsu Mining Co Ltd | エツチング液の処理方法 |
| WO2023217253A1 (zh) * | 2022-05-12 | 2023-11-16 | 叶涛 | 一种递进式电解回用酸性蚀刻废液的方法及其装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6354795B2 (enrdf_load_stackoverflow) | 1988-10-31 |
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