JPS6353267B2 - - Google Patents
Info
- Publication number
- JPS6353267B2 JPS6353267B2 JP14173186A JP14173186A JPS6353267B2 JP S6353267 B2 JPS6353267 B2 JP S6353267B2 JP 14173186 A JP14173186 A JP 14173186A JP 14173186 A JP14173186 A JP 14173186A JP S6353267 B2 JPS6353267 B2 JP S6353267B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- waste liquid
- etching waste
- copper chloride
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 78
- 239000002699 waste material Substances 0.000 claims description 72
- 239000007788 liquid Substances 0.000 claims description 67
- 239000010949 copper Substances 0.000 claims description 50
- 239000000243 solution Substances 0.000 claims description 45
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 24
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 17
- 229910001431 copper ion Inorganic materials 0.000 claims description 17
- 238000005868 electrolysis reaction Methods 0.000 claims description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 16
- 239000003085 diluting agent Substances 0.000 claims description 14
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical group [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 13
- 239000012895 dilution Substances 0.000 claims description 13
- 238000010790 dilution Methods 0.000 claims description 13
- 230000001172 regenerating effect Effects 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 239000011780 sodium chloride Substances 0.000 claims description 7
- 229910001514 alkali metal chloride Inorganic materials 0.000 claims description 6
- 238000007865 diluting Methods 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims description 2
- 238000011069 regeneration method Methods 0.000 description 22
- 230000008929 regeneration Effects 0.000 description 15
- 239000000203 mixture Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 230000033116 oxidation-reduction process Effects 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910021607 Silver chloride Inorganic materials 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- -1 chlorine ions Chemical class 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14173186A JPS62297476A (ja) | 1986-06-17 | 1986-06-17 | 塩化銅エツチング廃液の再生方法及び再生装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14173186A JPS62297476A (ja) | 1986-06-17 | 1986-06-17 | 塩化銅エツチング廃液の再生方法及び再生装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62297476A JPS62297476A (ja) | 1987-12-24 |
JPS6353267B2 true JPS6353267B2 (enrdf_load_stackoverflow) | 1988-10-21 |
Family
ID=15298898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14173186A Granted JPS62297476A (ja) | 1986-06-17 | 1986-06-17 | 塩化銅エツチング廃液の再生方法及び再生装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62297476A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5085730A (en) * | 1990-11-16 | 1992-02-04 | Macdermid, Incorporated | Process for regenerating ammoniacal chloride etchants |
US5248398A (en) * | 1990-11-16 | 1993-09-28 | Macdermid, Incorporated | Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath |
CN102807294A (zh) * | 2011-05-31 | 2012-12-05 | 无锡尚德太阳能电力有限公司 | 处理已使用蚀刻液的再循环系统 |
CN103422154A (zh) * | 2012-05-24 | 2013-12-04 | 叶福祥 | 电路板酸性废蚀刻液氯化亚铜(Cu+,CuCL)离子隔膜电积再生 |
CN203743090U (zh) * | 2013-12-13 | 2014-07-30 | 陶克(苏州)机械设备有限公司 | 磁力喷射泵浦 |
CN105177584A (zh) * | 2015-09-09 | 2015-12-23 | 成都虹华环保科技股份有限公司 | 一种具有再生液处理功能的酸性蚀刻废液循环再生系统 |
-
1986
- 1986-06-17 JP JP14173186A patent/JPS62297476A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62297476A (ja) | 1987-12-24 |
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