JPS62232188A - Apparatus for manufacture of thick film circuit board - Google Patents
Apparatus for manufacture of thick film circuit boardInfo
- Publication number
- JPS62232188A JPS62232188A JP7613786A JP7613786A JPS62232188A JP S62232188 A JPS62232188 A JP S62232188A JP 7613786 A JP7613786 A JP 7613786A JP 7613786 A JP7613786 A JP 7613786A JP S62232188 A JPS62232188 A JP S62232188A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thick film
- film circuit
- board body
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000010304 firing Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Furnace Charging Or Discharging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、厚膜回路基板の製造’Ａ ：ｉ’ｆ、特に
厚膜回路基板を載せて焼成を行う焼成用治具に関するも
のである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to the production of thick film circuit boards, particularly to a firing jig for mounting and firing a thick film circuit board. .
第３図は厚膜回路基板の一例を示す斜視図、第４図は厚
膜回路基板を表側より見た平面図で、第５図は厚膜回路
基板を裏側より見た平面図である。FIG. 3 is a perspective view showing an example of a thick film circuit board, FIG. 4 is a plan view of the thick film circuit board seen from the front side, and FIG. 5 is a plan view of the thick film circuit board seen from the back side.
第３図〜第５図において、１は厚膜回路基板本体であり
、２ばこの厚膜回路基板本体のベースを形成するセラミ
・ツク基板、３ａ〜３ｄ及び：３１！〜３ｇはセラミッ
ク基板２に印刷された導体パターン、４ａ〜４Ｃ及び４
ｄ、４ｅは印刷抵抗体である。次に第６図は従来の焼成
用治具に厚膜回路基板本体１を載１ｔた状態を示す斜視
図で、５は逆Ｕ字状に形成された焼成用治具である。第
７図は第６図の■−■線断面で見た従来の製造装置を示
す焼成炉の断面図で、６は上記焼成用治具５を載せて搬
送するベルトコンベア、７はこのベルトコンベア６に設
けられた多数の透孔、８は上部ヒータ、９は下部ヒータ
である。3 to 5, 1 is a thick film circuit board body, 2 is a ceramic substrate forming the base of the thick film circuit board body, 3a to 3d and: 31! ~3g is a conductor pattern printed on the ceramic substrate 2, 4a~4C and 4
d and 4e are printed resistors. Next, FIG. 6 is a perspective view showing a state in which a thick film circuit board main body 1 is placed on a conventional baking jig, and 5 is a baking jig formed in an inverted U shape. FIG. 7 is a sectional view of a firing furnace showing a conventional manufacturing apparatus taken along the line ■-■ in FIG. Numerous through holes are provided at 6, 8 is an upper heater, and 9 is a lower heater.
従来の厚膜回路基板の製造装置は以上のように構成され
ているので、第７図に矢印で示すように厚膜回路基板本
体１の表側にある印刷抵抗体４ａ〜４ｃは直接上部ヒー
タ８の輻射熱を受けるが、他方、厚膜回路基板本体ｌの
裏側にある印刷抵抗体４ｄ４ｅは、焼成用治具５に対向
密着しているので、ベルトコンベア６の透孔７を通過し
てきた下部ヒータ９の輻射熱を受けられず、このため厚
ｎ々回路基板本体１を表裏反転して、再度印刷抵抗体４
ｄ、 ４ｓを焼成し直さなければならなかった。又、従
来の焼成用治具５は厚膜回路基板本体１と直接接触する
為、外部振動などによって厚膜回路基板本体１にすり傷
が付くおそれがあった。Since the conventional thick film circuit board manufacturing apparatus is configured as described above, the printed resistors 4a to 4c on the front side of the thick film circuit board body 1 are directly connected to the upper heater 8, as shown by the arrows in FIG. On the other hand, since the printed resistor 4d4e on the back side of the thick film circuit board main body l is in close contact with the baking jig 5, the lower heater passing through the through hole 7 of the belt conveyor 6 Therefore, the printed resistor body 1 was turned upside down and the printed resistor 4 was reattached.
d. Had to refire 4s. Furthermore, since the conventional baking jig 5 is in direct contact with the thick film circuit board body 1, there is a risk that the thick film circuit board body 1 will be scratched by external vibrations or the like.
この発明は上記のような問題点を解消するためになされ
たもので、厚膜回路基板本体を表裏反転することなく焼
成できろとともに、厚膜回路基板本体をすり６などによ
る損傷から防ぐことができる製造装置を得ることを目的
とする。This invention was made in order to solve the above-mentioned problems, and it is possible to fire the thick film circuit board body without turning it upside down, and it is also possible to prevent the thick film circuit board body from being damaged by pickpockets, etc. The purpose is to obtain manufacturing equipment that can.
この発明に係る製造装置は、焼成用治具をほぼＭ字状に
構成し、その傾斜面に透孔を備えたものである。In the manufacturing apparatus according to the present invention, the firing jig is configured in a substantially M-shape, and a through hole is provided in the inclined surface of the firing jig.
この発明においては、はぼＭ字状の焼成用治具上の両傾
斜面に渡して厚膜回路基板を載置し、表側の焼成と同時
に裏面からも透孔を通して焼成が行えるようにしている
。In this invention, a thick-film circuit board is placed across both inclined surfaces of an M-shaped baking jig, so that baking can be performed from the back side through the through hole at the same time as the front side is baked. .
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図は焼成用冶具１０に厚膜回路基板本体１を載せた
状態を示す斜視図で、焼成用冶具１０は断屯はぼＭ字状
に構成されている。ｌｌａ、ｌｌｂはこの焼成用治具ｌ
Ｏに形成された両側傾斜面、１２はこの傾斜面１１ａ、
Ｉｌｂに設けられた多数の透孔である。次に第２図は
第１図の■−■線断面の焼成炉であり、ベルトコンベア
６の上に焼成用治具ｌＯを載せ、従来の製造装置と同様
、厚膜回路基板本体１の上部に上部ヒータ８をベルトコ
ンベア６の下部に下部ヒータ９を配する。FIG. 1 is a perspective view showing a thick film circuit board body 1 placed on a baking jig 10, and the baking jig 10 has an M-shaped cross section. lla, llb are the firing jigs l
12 is this inclined surface 11a,
A large number of through holes are provided in Ilb. Next, FIG. 2 shows a firing furnace shown in cross section along the line ■-■ in FIG. An upper heater 8 is placed at the bottom of the belt conveyor 6, and a lower heater 9 is placed at the bottom of the belt conveyor 6.
次に作用について説明する。下部ヒータ９の輻射熱は、
ベルトコンベア６の透孔７及び焼成用治具ｌＯの透孔１
２を通過して、厚膜回路基板本体１の裏側にある印刷抵
抗体４ｄ、４ａに達する。−・方、上部ヒータ８の輻射
熱は、従来の製造装置と同様、厚膜回路基板本体１の表
側にある印刷抵抗体４ａ〜４Ｃを直接加熱する。従って
従来の製造装置のように、表側の印刷抵抗体４ａ〜４Ｃ
の焼成工程、及び厚膜回路基板本体１を表裏反転して裏
側にあった印刷抵抗体４ｄ、４ｅの焼成工程の２工程を
必要とせず、厚膜回路基板本体１の表裏両面にある印刷
抵抗体４＆〜４ｃ及び４ｄ、４ｅを同時に一工程で焼成
することができる。しかも、厚膜回路基板本体ｌが載る
のは、焼成用治具ｌＯの傾斜面１１ａ、ｌｌｂであるの
で、焼成用治具１０と接するのは厚膜回路基板本体１
（＋）両端のみであり、厚膜回路基板本体１の表裏両面
にある印刷抵抗体や導体パターンを傷付けろことがない
。Next, the effect will be explained. The radiant heat of the lower heater 9 is
Through hole 7 of belt conveyor 6 and through hole 1 of baking jig IO
2 and reach the printed resistors 4d and 4a on the back side of the thick film circuit board body 1. - On the other hand, the radiant heat of the upper heater 8 directly heats the printed resistors 4a to 4C on the front side of the thick film circuit board body 1, as in conventional manufacturing equipment. Therefore, as in the conventional manufacturing equipment, the printed resistors 4a to 4C on the front side are
The printed resistors 4d and 4e on the back side of the thick film circuit board body 1 are not required, and the printed resistors 4d and 4e on the back side of the thick film circuit board body 1 are not required. The bodies 4&~4c and 4d, 4e can be fired simultaneously in one step. Moreover, since the thick film circuit board main body l rests on the inclined surfaces 11a and llb of the baking jig lO, the thick film circuit board main body l is in contact with the baking jig 10.
(+) Only at both ends, so printed resistors and conductor patterns on both the front and back sides of the thick film circuit board body 1 will not be damaged.
以上のようにこの発明によれば、極めて簡単な構成にて
、厚膜回路基板本体の表裏両面にある印刷抵抗体を同時
に一工程で焼成することができろとともに、従来のよう
に厚膜回ｐＲｓ基板本体の表裏両面にある印刷抵抗体や
導体パターンを傷つけろことがないなどのすぐれｔ：効
果を奏する。As described above, according to the present invention, printed resistors on both the front and back sides of a thick film circuit board body can be simultaneously fired in one step with an extremely simple configuration, and the printed resistors can be fired simultaneously in one step. It has excellent effects such as not damaging the printed resistors and conductor patterns on both the front and back sides of the pRs board body.
第１図、第２図はこの発明の一実施例を示すもので、第
１図は焼成用治具に厚膜回ｉＩ′８茎板本体を載せた状
態を示す斜視図、第２図は第１図の■−■線の断面で見
た焼成炉の断面図、第３図は厚膜回路基板の一例を示す
斜視図、第４図は厚膜回路基板本体を表側より見た平面
図、第５図は裏側より見ｔコ平面図、第６図は従来の焼
成治具に厚膜回路基板本体を載せた状態を示す斜視図、
第７図は第６図の■−■線断面で見た従来の製造装置を
示す焼成炉の断面図である。
図中、１ば厚膜回路基板本体、４ａ〜４ｅは印刷抵抗体
、６ばベルトコンベア、７は透孔、８はＪＪＩＳヒータ
、９は下部ヒータ、ｌＯは焼成用治具、ｌｌａ、１１ｂ
は傾斜面、１２は透孔である。
尚、図中同一符号は同−又は相当部分を示す。FIGS. 1 and 2 show an embodiment of the present invention. FIG. 1 is a perspective view showing the thick film iI'8 stem plate body placed on a firing jig, and FIG. Fig. 1 is a cross-sectional view of the firing furnace taken along the line ■-■ in Fig. 1, Fig. 3 is a perspective view showing an example of a thick film circuit board, and Fig. 4 is a plan view of the thick film circuit board main body as seen from the front side. , FIG. 5 is a plan view seen from the back side, and FIG. 6 is a perspective view showing a state in which a thick film circuit board body is placed on a conventional baking jig.
FIG. 7 is a cross-sectional view of a kiln furnace showing a conventional manufacturing apparatus taken along the line ■--■ in FIG. In the figure, 1 is the thick film circuit board body, 4a to 4e are printed resistors, 6 is a belt conveyor, 7 is a through hole, 8 is a JJIS heater, 9 is a lower heater, IO is a baking jig, lla, 11b
is an inclined surface, and 12 is a through hole. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
用治具をほぼＭ字状に構成し、その傾斜面に透孔を配設
したことを特徴とする厚膜回路基板の製造装置。A device for manufacturing a thick film circuit board, characterized in that a firing jig on which a double-sided printed thick film circuit board is placed and fired is formed into a substantially M-shape, and a through hole is provided on the inclined surface of the firing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7613786A JPS62232188A (en) | 1986-03-31 | 1986-03-31 | Apparatus for manufacture of thick film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7613786A JPS62232188A (en) | 1986-03-31 | 1986-03-31 | Apparatus for manufacture of thick film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62232188A true JPS62232188A (en) | 1987-10-12 |
Family
ID=13596580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7613786A Pending JPS62232188A (en) | 1986-03-31 | 1986-03-31 | Apparatus for manufacture of thick film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62232188A (en) |
-
1986
- 1986-03-31 JP JP7613786A patent/JPS62232188A/en active Pending
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