JPH0199285A - Solder member for mounting electronic component - Google Patents
Solder member for mounting electronic componentInfo
- Publication number
- JPH0199285A JPH0199285A JP25769487A JP25769487A JPH0199285A JP H0199285 A JPH0199285 A JP H0199285A JP 25769487 A JP25769487 A JP 25769487A JP 25769487 A JP25769487 A JP 25769487A JP H0199285 A JPH0199285 A JP H0199285A
- Authority
- JP
- Japan
- Prior art keywords
- ring
- solder
- electronic component
- terminal
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000005219 brazing Methods 0.000 abstract description 4
- 230000004907 flux Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品をプリント基板へ実装する際に使用
するはんだに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder used when mounting electronic components onto a printed circuit board.
従来電子部品をプリント基板へ実装する際に使用するは
んだは第4図に示すように本体が細長い棒状で、中心部
のフラックス102と外側のろう材101とからなって
いた。Conventionally, solder used to mount electronic components onto a printed circuit board has a main body shaped like a long and thin rod, as shown in FIG. 4, and consists of a flux 102 in the center and a brazing filler metal 101 on the outside.
従来のはんだは細長い棒状であるため、固定出来ず、片
手にはんだ、もう1方にこてを持ちはんだ付けする電子
部品を押さえられず、曲る、浮くなどして付くことがよ
くある。さらにその形状のなめ、1方向からしかはんだ
を供給出来なく、溶けて付く量がこての温度とこてをあ
てる時間により変わる為、熟練者でなければ適量を端子
の回りに均一に付けることが出来ない、1端子づつはん
だ付けするので手間がかかるという欠点がある。Conventional solder is in the form of a long, thin rod, so it cannot be fixed in place, and it is difficult to hold down the electronic components being soldered by holding the solder in one hand and the soldering iron in the other, which often causes the solder to bend or float. Furthermore, due to its shape, solder can only be supplied from one direction, and the amount that melts and adheres varies depending on the temperature of the iron and the time you apply the iron, so unless you are an expert, it is difficult to apply the appropriate amount evenly around the terminal. The drawback is that it is time-consuming as it requires soldering one terminal at a time.
本発明の電子部品実装用はんだ部材は、絶縁性シートに
リング状はんだが複数個電子部品の端子配列に対応する
位置にはめ込まれてなるというものである。The solder member for mounting electronic components of the present invention includes a plurality of ring-shaped solders fitted into an insulating sheet at positions corresponding to the terminal arrangement of the electronic components.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第1図(a)は本発明の第1の実施例の斜視図、第1図
(b)は第1図(a)のA−A’線で切断した断面斜視
図である。FIG. 1(a) is a perspective view of a first embodiment of the present invention, and FIG. 1(b) is a cross-sectional perspective view taken along line AA' in FIG. 1(a).
プラスチック製の絶縁性シート107は、直径1朋の穴
16個を2列に分けて有しており、隣り合う穴の中心間
の距離は2.54mm、隣りの列の穴との中心間距離は
、7.62mmである。長方形の短辺の1方にはICと
同様に方向を示す凹み1.06があり、ICの端子番号
105がそれぞれの穴104付近に記されている。穴の
まわりの金属リング103は銅からなり、リング以外の
部分はプラスチックよりなっている。またリングの部分
には1回の溶接に必要なろう材101とフラックス10
2が付帯している。The plastic insulating sheet 107 has 16 holes with a diameter of 1 mm divided into two rows, and the distance between the centers of adjacent holes is 2.54 mm, and the distance between the centers of the holes in the adjacent row is 2.54 mm. is 7.62 mm. One of the short sides of the rectangle has a recess 1.06 indicating the direction like the IC, and the terminal number 105 of the IC is written near each hole 104. The metal ring 103 around the hole is made of copper, and the parts other than the ring are made of plastic. In addition, the ring part is filled with brazing filler metal 101 and flux 10 necessary for one welding.
2 is attached.
第2図は本発明の電子部品実装用はんだ部材を用いてI
Cをプリント基板に実装した状態を示す断面斜視図であ
る。FIG. 2 shows I
FIG. 3 is a cross-sectional perspective view showing a state in which C is mounted on a printed circuit board.
プリント基板111に16ピンのIC109をさしこん
で、IC109の端子110に電子部品実装用はんだ部
材108の穴104にあてがって押込みはんだ付けをす
ればよい。ICのプリント基板への実装が簡単・確実に
行える。The 16-pin IC 109 may be inserted into the printed circuit board 111, and the terminals 110 of the IC 109 may be pressed into the holes 104 of the electronic component mounting solder member 108 for soldering. Mounting of IC on printed circuit board can be done easily and reliably.
第3図(a)は本発明の第2の実施例の斜視図、第3図
(b)は第3図(a)のA−A’線で切断した断面斜視
図である。FIG. 3(a) is a perspective view of a second embodiment of the present invention, and FIG. 3(b) is a cross-sectional perspective view taken along line AA' in FIG. 3(a).
穴の大きさ、穴と穴の中心間の距離、端子番号105、
凹み106は第1の実施例と同じである。Hole size, distance between holes, terminal number 105,
The recess 106 is the same as in the first embodiment.
この実施例は、溶接のためのはんだ部分が中心に向けて
伸ばしであるため、その伸ばした部分に、必要に応じて
シート線などの溶接を容易に行える構造になっていると
いう利点がある。This embodiment has the advantage that since the solder part for welding is stretched toward the center, the stretched part can be easily welded with sheet wires, etc., if necessary.
以上説明したように本発明は、リング状はんだを絶縁性
シートにはめこんであるので、そのまま電子部品の端子
をリングに通して溶接できるので、電子部品の実装が安
全・確実に行えるという効果がある。言い換えると、
a) 溶接、配線の際に、端子番号が】、目で解かるの
で、短時間でより確実な溶接、配線が出来る。As explained above, in the present invention, since the ring-shaped solder is fitted into the insulating sheet, the terminal of the electronic component can be passed through the ring and welded as is, so the electronic component can be mounted safely and reliably. be. In other words, a) When welding or wiring, terminal numbers can be determined visually, allowing more reliable welding and wiring in a shorter time.
b) 1度にIC1つ分のはんだが固定出来るので、
溶接の手間かはふける。b) Solder for one IC can be fixed at a time, so
I don't mind the hassle of welding.
C) 端子の溶接の際、はんだを持つ必要がないのでそ
の手で、溶接物を押さえられる。C) When welding terminals, there is no need to hold the solder, so you can hold the workpiece with your hands.
d) すべての溶接を適量のはんだで、端子の回りに均
等に行なえる。d) All welds can be made evenly around the terminal with the appropriate amount of solder.
第1図(a)は本発明の第1の実施例の斜視図、第1図
(b)は第1図(a)のA−A’線で切断した断面斜視
図、第2図は第1の実施例を使用してICをプリント基
板に実装するときの状態を示す断面斜視図、第3図(a
)は第2の実施例の斜視図、第3図(b)のA−A’線
で切断した断面斜視図、第4図は従来のはんだの斜視図
である。
101・・・ろう材、102・・・フラックス、103
・・・金属リング、104・・・穴、105・・・端子
番号、106・・・凹み、107・・・絶縁性シート、
108・・・電子部品実装用はんだ部材、109・・・
IC1110・・・端子、111・・・プリント基板、
112・・・導電パターン。FIG. 1(a) is a perspective view of the first embodiment of the present invention, FIG. 1(b) is a cross-sectional perspective view taken along line AA' in FIG. 1(a), and FIG. 2 is a perspective view of the first embodiment of the present invention. FIG. 3 is a cross-sectional perspective view showing the state when an IC is mounted on a printed circuit board using the embodiment 1.
) is a perspective view of the second embodiment, a cross-sectional perspective view taken along line AA' in FIG. 3(b), and FIG. 4 is a perspective view of conventional solder. 101... Brazing metal, 102... Flux, 103
...metal ring, 104...hole, 105...terminal number, 106...dent, 107...insulating sheet,
108...Solder member for electronic component mounting, 109...
IC1110... terminal, 111... printed circuit board,
112...Conductive pattern.
Claims (1)
子配列に対応する位置にはめ込まれてなることを特徴と
する電子部品実装用はんだ部材。A solder member for mounting electronic components, characterized in that a plurality of ring-shaped solder rings are fitted into an insulating sheet at positions corresponding to the terminal arrangement of electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25769487A JPH0199285A (en) | 1987-10-12 | 1987-10-12 | Solder member for mounting electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25769487A JPH0199285A (en) | 1987-10-12 | 1987-10-12 | Solder member for mounting electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0199285A true JPH0199285A (en) | 1989-04-18 |
Family
ID=17309813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25769487A Pending JPH0199285A (en) | 1987-10-12 | 1987-10-12 | Solder member for mounting electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0199285A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107580425A (en) * | 2017-09-18 | 2018-01-12 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and preparation method thereof, multiple-printed-panel for circuit board, mobile terminal |
-
1987
- 1987-10-12 JP JP25769487A patent/JPH0199285A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107580425A (en) * | 2017-09-18 | 2018-01-12 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and preparation method thereof, multiple-printed-panel for circuit board, mobile terminal |
CN107580425B (en) * | 2017-09-18 | 2020-06-26 | Oppo广东移动通信有限公司 | Circuit board assembly and manufacturing method thereof, circuit board jointed board and mobile terminal |
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