JPS6350107B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a furnace that can be used for soldering components to printed circuit boards.

Conventional configuration and its problems A conductive pattern is formed on a ceramic substrate, and a part of this conductive pattern is coated with cream solder.
Place the parts on top of this. A device constructed in this way is placed in a furnace and soldered. However, as shown in FIG. 1, if a component 2 such as a socket attached to the back surface of the ceramic substrate 1 protrudes from the ceramic substrate 1, if the component 2 is placed in the furnace as it is, the protruding portion of the component 2 will be exposed to the heat source. The heat will be directly irradiated, and the protruding parts will be burnt by the heat. Therefore, in order to eliminate this drawback, as shown in Fig. 2, the parts other than the ceramic substrate 1 are covered with a metal pallet 3 so that the protruding parts of the parts 2 are not directly exposed to heat. There is. However, this method is not suitable for mass production because the ceramic substrate 1 must be fitted onto the metal pallet 3 one by one.

OBJECTS OF THE INVENTION The present invention seeks to provide a furnace that eliminates the need to fit pallets to each ceramic substrate.

Structure of the Invention The present invention provides a heat shielding plate between an object to be heated and a heat source, which partially blocks heat coming directly from the heat source, and heat-shields objects that should not be heated. It is something.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 3, a glass plate 5 is provided inside the furnace body 4 to partition the room into upper and lower halves.
A lamp 6 as a heat source is placed above the glass plate 5. A heat shielding plate 7 for heat shielding is placed on this glass plate 5. The heat shield plate 7 is made of a ceramic plate, a metal plate, etc., and is provided by combining a plurality of small plates. The arrangement of this heat shield plate 7 is as follows:
For example, if a component protrudes from the right side of a ceramic substrate that is an object to be heated, the protruding parts are arranged so that the heat from the lamp 6 does not directly hit the protruding part. Since the object to be heated moves on the conveyor 8 and enters the furnace, and is heated while moving, a heat shield plate 7 is continuously provided so that the protruding parts of the parts are not exposed to heat. By doing this, a special palette is not required.

Effects of the Invention As described above, according to the present invention, the heat shield plate is formed of small pieces of ceramic or metal, so that by changing the combination and arrangement of the plates, partial heat shielding for the object to be heated can be achieved. This makes it possible to eliminate the need to fit a jig for heat-shielding parts such as special pallets onto the object to be heated, and is suitable for mass production.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an object to be heated, Fig. 2 is a perspective view of a combination of an object to be heated and a pallet placed in a conventional furnace, and Fig. 3 is a cross-sectional side view of a furnace in an embodiment of the present invention. It is. 4... Furnace body, 5... Glass plate, 6... Lamp, 7... Heat shield, 8... Conveyor.

Claims (1)

[Claims] 1 A heat-transmitting partition member disposed between an object to be heated and a heat source, and a plurality of heat shielding plates made of ceramic, metal, etc. placed on the partition member, and the above-mentioned A furnace characterized by partially blocking heat rays directly radiated from a heat source, and blocking direct irradiation of heat rays to electronic components, etc. on a board transferred below the partition member.