JPS6222558B2 - - Google Patents

Info

Publication number
JPS6222558B2
JPS6222558B2 JP56054643A JP5464381A JPS6222558B2 JP S6222558 B2 JPS6222558 B2 JP S6222558B2 JP 56054643 A JP56054643 A JP 56054643A JP 5464381 A JP5464381 A JP 5464381A JP S6222558 B2 JPS6222558 B2 JP S6222558B2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
resin mold
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56054643A
Other languages
English (en)
Other versions
JPS57169281A (en
Inventor
Shuichi Oosaka
Shunichi Kamimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56054643A priority Critical patent/JPS57169281A/ja
Publication of JPS57169281A publication Critical patent/JPS57169281A/ja
Publication of JPS6222558B2 publication Critical patent/JPS6222558B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Description

【発明の詳細な説明】 この発明は、発光素子からの有害光を可及的に
減少せしめた半導体装置に関するものである。
発光素子の半導体装置において、一般的に発光
素子の表面を発光源とする場合が多い。この場合
第１図に示すようにリードフレーム１上に発光素
子２を固着し、金線３でワイヤボンデイングした
後に透明の樹脂モールド４がなされている。この
ときに得られる発光のプロフアイルは第２図に示
すように発光ピークが低く、かつ半値幅の広いも
のしか得られない。
この発明は上記の点にかんがみなされたもので
ある。以下図面についてこの発明を説明する。
低電力で高発光を得るためには、発光素子の切
断面に露出するPN接合部分から発する光を直接
発光源とすればよい。この場合、発光源から出る
光は素子固着部での反射光、樹脂境界部での反射
等による有害光を出すことがある。この発明はこ
れらの有害光を除去したものである。
第３図の、この発明の一実施例を示す。この図
で、符号１〜４は第１図と同じものである。ま
た、５は素子固着部、６は前記リードフレーム１
の突出部で遮光のために設けられる。７は前記樹
脂モールド４の端部、８は前記樹脂モールド４の
バリを示す。
さて、発光素子２のPN接合部で発した光は直
接樹脂モールド４に出るものと、発光素子２の中
を伝わるものがある。発光素子２の中を伝わる光
はリードフレーム１の素子固着部５で反射するた
めに切断方向から見ると、あたかも光源のように
見える。ここでは素子固着部５に突出部６を設
け、光の遮へい板としている。また、樹脂モール
ド４に出た光は端部７で反射され、前記のように
有害光源となる。ここで、端部７での光の反射を
少なくするには端部７を主光源より離せばよい
が、寸法上大きくできない場合が多い。この端部
７での光の反射による有害光は、樹脂モールド４
を行う場合の金型の組み合せ部に発生する。いわ
ゆるバリ８によるものが大きい。ここでは端部７
でのバリ８を発光素子２の素子固着部５よりも下
部になるようにしている。そして、発光素子２の
４つの切断面と相対する少なくとも１つの樹脂
面、例えば第３図で点線の斜線を施した面を平滑
にしておく。このようにして得られた発光プロフ
アイルを第４図に示す。第４図ａは素子固着部５
に発光素子２を固着し樹脂モールド４を行つたも
のであり、第４図ｂは発光素子２の発光面側の素
子固着部５に突出部６を設け、バリ８を素子固着
部５の下部に設けたものである。第４図ｂより明
らかなように、主発光以外の有害光は除去できる
ことがわかる。
以上説明したように、この発明は有害光の出や
すい樹脂モールドのバリの位置を発光素子の固着
部の下部に位置するようにしたので、樹脂モール
ドの大きさを増すことなく有害光を減少させるこ
とができる利点がある。
【図面の簡単な説明】
第１図は従来の半導体装置の断面略図、第２図
は第１図に示す従来の半導体装置の発光プロフア
イルを示す図、第３図はこの発明の一実施例を示
す要部の斜視図、第４図ａは発光素子の切断面に
おける発光プロフアイルの一般例を示す図、第４
図ｂはこの発明による発光プロフアイルを示す図
である。 図中、１はリードフレーム、２は発光素子、３
は金線、４は樹脂モールド、５は素子固着部、６
は突出部、７は端部、８はバリである。なお、図
中の同一符号は同一または相当部分を示す。

Claims (1)

    【特許請求の範囲】
  1. １ リードフレームに発光素子を固着し前記発光
    素子を透明の樹脂モールドでおおつた半導体装置
    において、前記リードフレームに遮光のための突
    出部を設け、さらに前記発光素子の固着部の下部
    に前記樹脂モールドのバリが位置するようにした
    ことを特徴とする半導体装置。
JP56054643A 1981-04-10 1981-04-10 Semiconductor device Granted JPS57169281A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56054643A JPS57169281A (en) 1981-04-10 1981-04-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56054643A JPS57169281A (en) 1981-04-10 1981-04-10 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57169281A JPS57169281A (en) 1982-10-18
JPS6222558B2 true JPS6222558B2 (ja) 1987-05-19

Family

ID=12976450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56054643A Granted JPS57169281A (en) 1981-04-10 1981-04-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57169281A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097338A1 (en) 2012-12-11 2014-06-26 Trovo' Stefano Useful composition for the biological control of bee diseases

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10131698A1 (de) 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097338A1 (en) 2012-12-11 2014-06-26 Trovo' Stefano Useful composition for the biological control of bee diseases

Also Published As

Publication number Publication date
JPS57169281A (en) 1982-10-18

Similar Documents

Publication Publication Date Title
JPS62260384A (ja) 半導体装置
JPS6222558B2 (ja)
JPS6012782A (ja) 発光ダイオ−ド実装構造
JP3625498B2 (ja) 表示装置
JPS57106091A (en) Semiconductor laser device
US5686362A (en) Method of manufacturing a semiconductor integrated circuit device
JPH05110203A (ja) 半導体レーザ装置およびその製造方法
JPS609189A (ja) 半導体レ−ザ装置
JPH0439236B2 (ja)
JPS63136684A (ja) 光電子装置およびその製造方法ならびにその方法に用いるリ−ドフレ−ム
JPS603794B2 (ja) 発光表示装置
JPH057874B2 (ja)
JPH0543560U (ja) 発光ダイオード装置
JPH0538927U (ja) 発光装置
JPS5977249U (ja) 横方向出力発光ダイオ−ド装置
JPH01302874A (ja) 光半導体装置
JP2944139B2 (ja) 発光装置用パッケージ
JPS6236311Y2 (ja)
JPH0693525B2 (ja) 発光素子
JPS63300578A (ja) 発光ダイオード
JPH07202270A (ja) 側面発光型ｌｅｄランプ
JP2884642B2 (ja) 発光ダイオード
JPS6244876B2 (ja)
JPS6127192Y2 (ja)
JPH06838Y2 (ja) 光結合素子