JPS62216972A - High thermal shock resistance joining method of ceramic to metal and joined product - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a joining method and a joining product for joining ceramics and metal to obtain a joining product having high thermal shock resistance.

``Conventional Technology J'' As is well known, metal parts (
For metal base materials), measures are being taken to improve the wear resistance and heat resistance of parts by using ceramics in some parts.

Conventionally, the above-mentioned bonded products of ceramics and metals are made of a metal base material 1 and a ceramic material 2, as shown in FIG.
and were integrated by bonding through the intermediate metal layer 3. The following three methods are mainly used to join this joined product.

First, in the first method, 3
In this method, a metallized layer having a thickness of approximately 0 to 60 μm is formed, and the intermediate metal layer 3 is brazed to the ceramic 2, and the intermediate metal layer 3 is brazed to the metal filmItl. In the second method, a metal brazing filler metal is applied to the joint surface of the metal base material 1, and at the same time,
In this method, a brazing material for metallization is applied to the ceramics 2, an intermediate metal layer 3 is interposed between them, and these are brazed and integrated by heating. and,
The third method is I? of metal base material l and ceramics 2? f
This is a method in which an intermediate metal layer 3 is interposed between the metal 1 and the ceramic 2, these three are heated under pressure, and the intermediate metal layer 3 is diffused into the metal 1 and the ceramic 2, respectively, and then bonded.

The intermediate metal layer 3 may include Cu, A(7,N+,
In addition, noble metals such as Ag, soft alloys containing these single metals, Fe-Ni-Co alloys, Fe-N
Alloys such as i-alloy, W, and Mo, or single low thermal expansion metals are used.

In the above bonding structure, it is known that the bonding strength is proportional to the bonding area between the ceramic 2 and the intermediate metal layer 3. In addition, in order to alleviate the stress applied between the metal base material l and the ceramics 2, the intermediate metal layer 3 needs to have a certain thickness or more, but the deformation force due to the expansion and contraction of the intermediate metal layer 3 itself is If the influence on the ceramics 2 is to be avoided, it is preferable that the intermediate metal layer 3 be thinner.

Therefore, at present, the metallized layer directly bonded to the ceramic 2 has a thickness of 30 to 60 μm as described above.
It is formed to a certain degree of thinness.

[Problems to be Solved by the Invention] By the way, the above-mentioned conventional bonded products of ceramics and metal have the following problems, and it is desired to solve them.

In other words, in the above-mentioned bonded products, as shown in Figure 14, ceramics 2 is usually used to increase the bonding strength.
The intermediate metal layer 3 is formed so as to cover almost the entire area of the bonding side 2a.
are formed and joined together. However, in such a structure, for example, the tensile stress applied to the intermediate metal layer 3 due to cooling contraction of the metal base material l having a large coefficient of thermal expansion acts toward the center of each side as shown by the arrow in the figure. As a result, the largest tensile stress acts on the corners C of the intermediate metal layer 3. Therefore, the ceramic 2, which is weak against tensile stress, often experiences stress concentration in the portion corresponding to the corner C, causing cracks and peeling.

On the other hand, as shown in FIG. 15, a structure may be considered in which the intermediate metal layer 3 is shaped like a disk so that no corners are formed in the joint portion 4 in order to avoid stress concentration. However, for example, the coefficient of thermal expansion of A12203 is 7.8X 10-6.
513N4 has a coefficient of thermal expansion of 4 x 10-', which is 2 to 1 times that of ceramics. Even with the above-mentioned improved structure in which the bonding strength is sacrificed to some extent, as shown in Figure 16, cracks will occur in the ceramic 2 along the outer periphery of the bonded part over time, and the holly will peel off. The phenomenon of deterioration over time cannot be avoided. In particular, when the metal base material is subjected to external heat or external mechanical force and undergoes large deformation, the force is further applied to the ceramic and cracks are likely to occur.

This invention was made in view of the above circumstances, and its purpose is to reduce the deformation force that is applied to ceramics due to thermal expansion and contraction of the metal base material and external forces, thereby reducing cracks in ceramics and improving the heat resistance of products. The object of the present invention is to provide a method for bonding ceramics and metals with high thermal shock resistance and a bonded product that can improve impact resistance, reliability, and extend life.

[Means for Solving the Problems] In order to solve the above problems, the present inventors combined various bonding structures and bonding methods and conducted repeated research.
We have come to the following findings.

(1) As shown in Figure 1 (aXb), the intermediate metal layer interposed between the metal 1 and the ceramic 2 is divided into two,
Assuming that the area of the layer (intermediate metal layer) 10 to be bonded onto the ceramic is approximately equal to the area of the ceramic 2, and by setting its thickness to 0.1 to 0.7 mm, the stress applied to the ceramic 2 can be reduced. You can significantly reduce the horns.

(11) By making the other layer (buffer metal layer) 11 smaller in area than the intermediate metal layer 10 and having a thickness of 0.5 to 3 mm, the deformation caused in the metal layer 1 can be reduced.
can significantly reduce the impact on

(iii) A metallized layer 12 is formed on the ceramics 2, and the intermediate metal layer 10 to be bonded thereon is made such that its entire outer periphery 1i10a is from the entire outer periphery 2a of the ceramics 2 by a dimension that is 1 to 5 times the thickness of the intermediate metal layer 10. By joining the buffer metal 11 on the inside with the brazing metal 13, the brazing metal 13 flows into the stepped portion 14 formed by the ceramic 2 and the intermediate metal layer 10. , fills this step 14 and solidifies (a fitlet 15 is formed on the outer periphery of the intermediate metal layer 10). This FilleL15 has a shape that becomes thinner toward the outer periphery on the ceramic 2, and the thinner the thickness, the better the ability to follow expansion and contraction deformation.
The stress on the joint ends of the joints is significantly reduced.

(iv) Both the brazing material 13 for bonding the buffer metal layer 11 onto the intermediate metal layer 10 and the brazing material 16 for bonding the metal l onto the buffer metal layer 11 have a higher oxidation rate than the intermediate metal layer lO and the buffer metal layer 11. By using a slow brazing filler metal (hereinafter referred to as a coupled brazing filler metal), the exposed surfaces of the intermediate metal layer IO and the buffer metal layer 11, as well as the ceramic 2
The surface (upper surface on the bonding side) is coated with the above-mentioned coupled wax No. 13.16.
The intermediate metal layer 10, the buffer metal layer 11, and the surfaces of the ceramics 2 can be covered with a thin film of This makes it possible to improve product durability and thermal shock resistance.

This invention has been made based on the above findings.

First, ceramics and metals according to this invention
rz ′Jlr t, + AI+ jl; +'! J
zL)*MunarI-r-1 (a) Form a metallized layer 12 on the surface of the ceramic 2, and form an intermediate metal layer 10 with a thickness of 0.1 to 0.7 mm on top of the metallized layer 12, which is 1 to 5 times the thickness. an intermediate metal layer bonding step in which the entire outer periphery 10a of the ceramics 2 is bonded inwardly than the entire outer periphery 2a of the ceramics 2 by a dimension of Buffer metal layer 11 with a small thickness and a thickness of 0.5 to 3 mm
(c) a metal bonding step of bonding the metal I onto the buffer metal layer 11 using the coupled brazing filler metal 16; The present invention is characterized in that by carrying out all the steps, the exposed upper surface of the ceramic and the exposed surfaces of the intermediate metal layer and the buffer metal layer are coated with a coupled wax.

Further, the high thermal shock-resistant bonded product of ceramics and metal according to the present invention has a metallized layer 12 on the ceramics 2 with a thickness of 0.
．． The intermediate metal layer 10 with a thickness of 1 to 0.7 mm has a thickness of [
It is bonded so that the entire outer peripheral edge 1 (la) is inside the entire outer peripheral edge 2a of the ceramic 2 by ~5 times the dimension, and a layer with a smaller area and thickness than this intermediate metal layer IO is placed on this intermediate metal layer la. A buffer metal layer 11 with a thickness of 0.5 to 3 mm is bonded with a coupling brazing filler metal 13, and a metal l is bonded onto this buffer metal layer 11 with a coupling brazing filler metal 16, on the bonding side of the ceramics. It is characterized in that the exposed upper surface and the exposed surfaces of the intermediate metal layer and the buffer metal layer are covered with a coupled brazing filler metal.

In the above configuration, the thickness of the intermediate metal layer 10 is 0.1 to 0.
．． The reason why it is set to 7 mm is because if it is less than 0.1 mm, the ability to follow deformation will be too large and stress dispersion will be lost; if it exceeds 0.7 mm, the ability to follow deformation will be lost, and This is because the expansion/contraction deformation of itself becomes large.

Furthermore, the reason why the bonding area of the buffer metal layer 11 is made smaller than that of the intermediate metal layer 10 is to prevent large deformation occurring in the metal l from being transmitted to the intermediate metal layer IO1 and, furthermore, to the ceramics 2. The reason why the thickness is set to 0.5 to 3 mm is because if it is less than 0.5 mm, the breaking strength will decrease rapidly, and if it exceeds 3 yttm, the thickness of the bonded product will increase unnecessarily, and the strength will tend to decrease. It is from.

Furthermore, the intermediate metal layer 10 is bonded onto the ceramic 2 by a dimension 1 to 5 times its thickness so that its entire outer periphery 10a is inside the entire outer periphery 2a of the ceramic 2. If it is less than 5 times, Fillet 15 will not be formed, and if it exceeds 5 times, Fillet 1 will not be formed.
This is because the end portion of the ceramic member 5 does not reach the vicinity of the outer peripheral edge 2a of the ceramic member 2.

Further, the reason why the metallized layer 12 was formed on the ceramic 2 is that the wettability of the brazing material to the ceramic 2 is very poor, and it is only by forming the metallized layer 12 that the above-mentioned Fille L 15 can be easily formed. It is.

In addition, in the intermediate metal layer bonding process having the above configuration, as shown in FIG. Alternatively, the metallized layer formation and the intermediate metal layer bonding may be performed in one heat treatment by stacking the intermediate metal layer 10 on the ceramic 2 via a brazing material and heating this. To do it all at once, for example, use Ag-Cu-T as a brazing material.
I-based active metal brazing filler metal etc. should be used. In addition, when forming the metallized layer and bonding separately, MO・M,
A known method such as metallization using the n-method is used.

In addition, in this invention, the coupled brazing filler metal refers to a brazing filler metal whose oxidation rate is slower than that of the intermediate metal layer 10 and the rear metal 5u, as described above, and as the coupled brazing filler metal, For example, intermediate metal layer lO and warm gold@layer 1
When 1 is copper or nickel, silver, gold, palladium, etc. can be mentioned.

When selecting this coupled brazing filler metal, it is preferable to use one with high spreadability in consideration of coverage and FilleL forming properties.

tr oni −, −'J>'Q [IIl, = t−;
It is preferable that the coupled wax vr 13 is applied in an area equal to or slightly larger than that of the intermediate metal layer 10 in order to facilitate the formation of the fillet 15.

Furthermore, in this invention, brazing is performed under a non-oxidizing atmosphere such as vacuum or an inert gas at normal pressure, at a temperature of 700 to 12
It is carried out at 50°C. Also, when forming a metallized layer alone, it is carried out at 700 to 1400° C. in a non-oxidizing atmosphere.

In addition, in the bonded product of the present invention, as is clear from the examples shown below, the strength reduction rate in the thermal shock resistance test shows an actual value of about 14% or less.

On the other hand, although it generally varies depending on the type of ceramics and metals, a strength reduction of about 30% from the initial bonding strength (mainly shear strength), including measurement errors, is generally within the practically acceptable range. It is.

Therefore, the bonded product of the present invention is judged to have high practical performance.

Next, the present invention will be explained in more detail with reference to Examples.

"Examples 1 to 4" In the structure shown in FIG.
is formed, and an intermediate metal layer 10 is bonded thereon by a coupling brazing filler metal 17, and a coupling brazing filler metal 13 is further bonded thereon.
Bonded products each having a structure in which the buffer metal layer 11 was bonded were prepared using the following materials and dimensions.

(Example I) A mixture of silver, gold, and titanium powder was coated on Si3N (30x15x5t Cam) ceramics, and this was heated under vacuum at 1000°C for 10 minutes to form a 50 μm metallized layer. On top of this, B is added as a coupled brazing filler metal.
Coat Ag-8 (J Is Z3261) powder and layer 29.5x 14.5x 0.1 on top as an intermediate metal layer.
Place temporary Ca of t(xi) on top and heat at 850°C under vacuum for 10
They were bonded by heating for a minute. Furthermore, B on the intermediate metal layer
Ag-8 powder is applied, and 1oφ is applied as a buffer metal layer on top of this.
Two Cu disks of X2t (, vm) were mounted, and the
Heated at 0℃ for 10 minutes and bonded 7 pieces.

The resulting bonded product was subjected to the following thermal shock test. That is, the temperature was raised from room temperature to 350'C at 200'C/win, then held at 350°C for 15 minutes, and then heated to 350'C at 200'C/win.
This is a test in which the temperature is lowered to room temperature at 'C/man and maintained at room temperature for 15 minutes, followed by one cycle.

As a result, as shown in Figure 2, this example! The bonded product has an initial shear strength of 4.20 on average of 10 points, which is 9/■2.
(Hereinafter, all intensity values similarly show the average value of 1o point), but after adding 50 cycles, the average value was 3
．． 90/9/mar", and the rate of decrease in heat resistance strength was approximately 14% or less, indicating high performance.

(Example 2) In the above Example 1, only the thickness dimension of the intermediate metal layer was set to 0.
, 2 t (ua), and other conditions were kept the same to create a bonded product.

The resulting bonded product was subjected to the same thermal shock test as above.

As a result, as shown in Fig. 3, the bonded product of Example 2 had an average shear strength of 11.40 kg/π72 at the beginning, but after 50 cycles, the average shear strength was 10.8.
0&g/xz”, and the rate of decrease in heat resistance strength is approximately 5
% or less.

(Example 3) The above example! In this case, only the thickness of the intermediate metal layer is set to 0.
．． 7t (, 1lz), and other conditions were kept the same to create a bonded product.

The resulting bonded product was subjected to the same thermal shock test as above.

As a result, as shown in FIG. 4, the bonded product of Example 3 had an average initial shear strength of 8.30 kg/mrtr'
The average was 7 after adding 50 cycles.
, 97 am” at 30, and the rate of decrease in heat resistance strength is:
It showed high performance of about 12% or less.

(Example 4) A mixture of silver, copper, and titanium powders was applied onto 30x 15x 5 L (zm) of A(!203 ceramics, and this was heated under vacuum at 1000°C for 10 minutes to form a 50 μm metallized layer. On top of this, BAg-8 powder was applied as a coupled brazing filler metal, and on top of this, 2 layers were applied as an intermediate metal layer.
9.5X 14.5X 0.2t zi) Ca temporary was glued and bonded by heating at 850° C. for 10 minutes under vacuum. Furthermore, applying BAg-8 powder on the intermediate metal layer,
On top of this is a buffer metal island of 10φX 2 t (zz)
Two Cu disks were placed on top of each other, and they were bonded together by heating at 850° C. for 10 minutes under vacuum.

The resulting bonded product was subjected to the same thermal shock test as above.

As a result, as shown in Figure 5, the bonded product of Example 4 had an initial shear strength of 7.14 on average, 9/y, m2, but after 50 cycles Average 6.8
0kg/yttvt”, and the rate of decrease in heat resistance strength is:
It showed high performance of about 5% or less.

"Example 5" A mixture of silver, copper, and titanium powders was applied onto Si and N4 ceramics of 30X 15X 5 L (am), and this was heated under vacuum at 1000°C for 10 minutes to form a 50 μm metallized layer. Formed. On top of this, BAg-8 powder is applied as a coupled brazing filler metal, and on top of this as an intermediate metal layer, 29
．． A temporary Ca layer of 5X 14.5X O, 2t (Rz) was placed and bonded by heating at 850° C. for 10 minutes under vacuum. Furthermore, BAg-8 powder is applied on the intermediate metal layer, and a buffer metal layer is formed on top of this, with a diameter of 10φ (ryrm>Te, each 0.5mm).
5.1.0.1.5.2.0, 3, OL (in) C
Two U-discs were placed on each other and heated under vacuum at 850° C. for 10 minutes to join them.

When the shear strength of each of the obtained bonded products was measured, as shown in FIG. 6, at 0.5t, the average was 8.09 and 9/1.
1. OL has an average of 11.74Jc9/1m', ■. 5
L average 11.63kg/vrytr', 2. The average in Ot is 11.40kl! / mm2.3. At Ot, the average L is 1.20&y/my, 2, and below 0.5, the shear strength decreases rapidly; 3. Beyond Ot, the decrease in O shear strength was gradual.

"Example 6": A mixture of silver, copper, and titanium was coated on 513N4 ceramics of aOx 15x 5t (am), and 29.5X 14.5X O,2 was applied as an intermediate metal layer on top of this.
A Cu plate of t (Rz) was placed and heated at 1000°C under vacuum for 1
By heating for 0 minutes, the metallized layer was formed and simultaneously joined. Furthermore, a mixture of silver and copper is coated on the surface intermediate metal layer, and a buffer metal layer of 10φ×2t is applied on top of this as a buffer metal layer.
The Cu disk of (xi) was heated under vacuum at 850°C.
, and bonded by heating for 10 minutes.

The obtained bonded product was subjected to the same thermal shock test as described above.

As a result, as shown in Fig. 7, the bonded product of Example 6 had an average shear strength of 10.49 ky/mm2 at the beginning, but after 50 cycles, the average shear strength was 9.
, 22 becomes 9/am', and the rate of decrease in heat resistance strength is:
It showed a high performance of about 12%.

Note that in each of the above embodiments, the metal base material 1 is not bonded, that is, the metallized layer 12 is formed on the ceramic 2, and the intermediate metal layer 10 is bonded thereon using the coupled brazing material 17. However, the strength was measured on a bonded product with a structure in which a buffer metal layer 11 was further bonded with a coupled brazing filler metal 13, and this was used instead of the strength measurement on a finished product in which the metal base material 1 was bonded. This is because, as shown in the following reference example, when the temperature rises and falls at 350°C, a product with a structure in which the metal layer +41 is not bonded is subjected to more severe conditions than a finished product with the metal base material 1 bonded. This is because it has come to fruition.

(Reference example) Figure 8 is 30x 15x 5 as shown in Figure 9.
BAg- on Si3N+ ceramics 20 at t(zm)
A mixture of 8 powder and titanium powder is applied, and a Cu circle [2L 2
1 was placed, and BAg-8 powder was applied on top of this, and a metal base material (steel material) 22 of 30 x 60 x 5 t (mm) was placed on top of this, and the metal base material (steel material) 22 was placed under vacuum at 850°C for 10 minutes to join. This figure shows the shear strength of the bonded product as a result of subjecting it to the thermal shock resistance test. As shown in the figure, this bonded product is
The initial shear strength averaged 8.58.9/my”, but after 10 cycles it decreased to an average of 5.60k.
y/mx', on average 2 after adding 20 cycles
．． 45ky/mytt”.

On the other hand, the change in shear strength of the above structure without bonding the metal base material 20 was initially 8.58 ky/mi' on average, but as shown in Figure 10, after 10 cycles were added average of 0.16 ky/mm' after adding 20 cycles and 0.60 ky/rtun after adding 20 cycles.
Therefore, it was found that performing the test without bonding the metal layer (No. 20) resulted in a more severe performance test.

This seems to be due to the following reason - namely, as mentioned earlier, in order to avoid the effect of heat shrinkage of the metal base material (iron), a copper plate is used as a metal intermediate layer between the metal base material and the ceramics. Intermediate heat shrinkage of metal layer to improve flexibility, ductility,
This is alleviated by the use of a copper plate with high followability. This is not because copper has a smaller thermal expansion than iron; on the contrary, copper has a larger thermal expansion, but when joined to iron, iron is rigid, while copper is flexible and expandable. Due to its high ductility and conformability, its heat shrinkage is restricted by the iron material, and the appearance is equivalent to that of the top iron material.As a result, the copper plate as the intermediate metal layer has the characteristics of Only ductility and followability are exhibited,
This is because the load on the ceramics from the iron material is reduced. Therefore, if the copper plate is simply bonded to the ceramic as an intermediate metal layer, there is no way to restrict the thermal contraction of the copper plate, and the deformation force due to the thermal contraction of the copper plate is directly applied to the ceramic. Therefore, as shown in the reference example above, it is thought that the structure B, in which the metal base materials are not bonded, will be subjected to more severe conditions in the thermal shock test.

[Comparative Example] Next, a comparative example based on the conventional example will be shown to confirm the high performance of the product of the present invention.

(Comparative Example I) Figure 11 shows the change in shear strength in a thermal shock test of a bonded product that corresponds to the conventional example shown in Figure 14 and has a structure in which metal base materials are not bonded. is 30
It is made by bonding Si3N of X tsx 5 t (mm) and Cu temporary of 13X 13X 2 t (mx) to ceramics using a brazing filler metal (13Ag=8).

This comparative product had an average initial shear strength of 4.46 kg, /
ff, W'', it has already decreased to an average of 2.58&y/mm2 in the 10th cycle, which shows the high performance of the product of the present invention.

(Comparative Example 2) Figure 12 shows the change in shear strength in a thermal shock test of the conventional example shown in Figure 15 (the target bonded product, which has a structure in which the metal base materials are not bonded). This bonded product is made by combining one Cu disk of lOφX 2 L (am) with one brazing filler metal (BAg-8) on Si3N4 ceramics of 30 x 15 x 5 t (TIm).

In this comparative product, the initial breaking strength was 9.44 &@/
The area was 2m2, but by the 10th cycle it had already become an average of 3m2.
, 63, and 9/my'', which shows the high performance of the product of the present invention.

"Effects of the Invention" As explained above, according to the present invention, it is possible to easily obtain a ceramic-metal bonded product that has high impact resistance, excellent reliability, and long life.

[Brief explanation of drawings]

1 to 7 are for explaining the present invention, FIG. 1(a) is a side sectional view showing an example of a bonded product with high thermal shock resistance according to the present invention, and FIG. ), and FIGS. 2 to 5 show the first to fourth embodiments of the present invention, respectively, and are graphs showing changes in shear strength due to thermal shock tests of the resulting joined products. , FIG. 6 shows the fifth example, and FIG. 7 is a graph showing the change in shear strength when the thickness of the buffer metal layer is changed.
Figures 8 to 10 are graphs showing changes in shear strength due to thermal shock tests of the resulting bonded products. This is a reference example showing that a completed joint product that has been joined up to the material is subjected to a more severe test. Figure 8 is a graph showing the change in shear strength of the completed joint product, and Figure 9 is the completed joint used in Figure 8. FIG. 10 is a graph showing changes in shear strength of a bonded product without the metal base material, and FIGS. 11 to 16 are for explaining conventional bonded products. The figures are graphs showing changes in shear strength due to thermal shock, Fig. 13 is a side configuration diagram showing an example of a conventional bonded product, Fig. 14 is a sectional view taken along line A-A in Fig. 13, and Fig. 15 is a pond FIG. 16 is a plan view of the main part of the conventional example, and FIG. 16 is a side view of the main part of the conventional example. 1...metal layer (e), 2...ceramics, 2a...outer circumference of ceramics, 10...intermediate metal layer, lfL+...1.-width division diagram Noriji I-If・
...Buffer metal layer, 12...Metallized layer, 13.16.17...Slow oxidizing wax, ■...
・Step part, 15...- Fillet. Applicant: Sumitomo Cemen) / Maishiki Company Figure 8 Number of thermal shocks Figure 10! f needle stitch opening several times) Fig. 13 Fig. 14 Fig. 16

Claims (4)

[Claims] (1) (a) Form a metallized layer on the ceramic, and add an intermediate metal layer with a thickness of 0.1 to 0.7 mm on top of the metallized layer by a dimension of 1 to 5 times the thickness so that the entire outer periphery of the metallized layer is the same as that of the ceramic. an intermediate metal layer bonding step in which the intermediate metal layer is bonded so as to be on the inside of the entire outer periphery, and (b) a buffer metal layer having a smaller area than the intermediate metal layer and a thickness of 0.5 to 3 mm is formed on the intermediate metal layer. (c) a metal bonding step of bonding a metal onto the buffer metal layer using a slow-oxidizing brazing filler metal, and by performing all of the above steps, the A method for bonding ceramics and metals with high thermal shock resistance, characterized in that the exposed upper surface of the ceramic and the exposed surfaces of the intermediate metal layer and the buffer metal layer are covered with a slow-oxidizing brazing filler metal. (2) The ceramic according to claim 1, wherein the intermediate metal layer bonding step is performed by forming a metallized layer on the ceramic and then bonding the intermediate metal layer with a slow oxidizing brazing material. A method for joining metals with high thermal shock resistance. (3) In the intermediate metal layer bonding step, the intermediate metal layer is layered on the ceramic via a brazing material, and this is heated to perform bonding of the metallized layer and the intermediate metal layer in a single heat treatment. Claim 1
A method for bonding ceramics and metals with high thermal shock resistance as described in 2. (4) Thickness 0 through a metallized layer on ceramics
．． The intermediate metal layer of 1 to 0.7 mm has a thickness of 1 to 5 mm.
It is bonded so that its entire outer periphery is inside the entire outer periphery of the ceramic by double the dimension, and a layer with a thickness of 0.5 to 3 mm is placed on this intermediate metal layer with a smaller area than this intermediate metal layer.
a buffer metal layer is bonded with a slow oxidizing brazing material, and a metal is bonded onto the buffer metal layer with a slow oxidizing brazing material, and the exposed surface of the upper surface of the ceramic to be bonded, the intermediate metal layer and the buffer metal A highly heat-resistant bonding product between ceramic and metal, characterized in that the exposed surface of the layer is covered with a slow-oxidizing brazing filler metal.