JPH0492871A - Ceramic-metal binding body and production thereof - Google Patents
Ceramic-metal binding body and production thereofInfo
- Publication number
- JPH0492871A JPH0492871A JP20903290A JP20903290A JPH0492871A JP H0492871 A JPH0492871 A JP H0492871A JP 20903290 A JP20903290 A JP 20903290A JP 20903290 A JP20903290 A JP 20903290A JP H0492871 A JPH0492871 A JP H0492871A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- foil
- metal
- layer
- ceramic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 24
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 23
- 238000009792 diffusion process Methods 0.000 claims abstract description 23
- 239000007769 metal material Substances 0.000 claims abstract description 22
- 239000011888 foil Substances 0.000 claims abstract description 20
- 239000007790 solid phase Substances 0.000 claims abstract description 19
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 17
- 229910002555 FeNi Inorganic materials 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005219 brazing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000746 Structural steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- -1 metallizing brazing Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、良好な接合強度をもつセラミックス−金属接
合体及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a ceramic-metal bonded body having good bonding strength and a method for manufacturing the same.
［従来の技術〕
セラミックスは、高温強度、耐食性、耐摩耗性等に優れ
た性質を呈することを利用して、内燃機関等の高温で使
用される各種部品としての用途が検討されている０反面
、セラミックスのもつ脆性が、各種用途にセラミックス
製品を使用する上で大きな欠点となる。そこで、実用化
に際しては、過酷な使用雰囲気にさらされる部分のみを
セラミックスで構成し、他の部分を構成する金属材料と
接合して使用する方法が採用されている。[Prior Art] Ceramics are being considered for use as various parts used at high temperatures in internal combustion engines, etc., due to their excellent properties such as high-temperature strength, corrosion resistance, and wear resistance. The brittleness of ceramics is a major drawback when using ceramic products for various purposes. Therefore, for practical use, a method has been adopted in which only the parts exposed to the harsh operating atmosphere are made of ceramics, and the other parts are bonded to metal materials.
セラミックスを金属に接合する方法としては、有機接着
剤を使用した接着、メタライジング−ロウ付け、固相拡
散接合等が知られている。Known methods for bonding ceramics to metal include bonding using an organic adhesive, metallizing brazing, and solid phase diffusion bonding.
たとえば、特開昭６３−１９０７７３号公報においては
、セラミックス部材の表面にＴｉ、Ｃｕ及びＡｇを物理
蒸着によって積層蒸着又は複合蒸着した後、金属化処理
し、Ａｇ−Ｃｕ系ロウ材を挟んで接合することが開示さ
れている。For example, in Japanese Patent Application Laid-Open No. 63-190773, Ti, Cu, and Ag are layered or compositely deposited on the surface of a ceramic member by physical vapor deposition, then metallized, and bonded using an Ag-Cu brazing material. It is disclosed that
また、特開昭６２−１７６９６６号公報では、金属母材
の表面部にＣｕ層９次いでＮｉ層を設けて、これらの層
を介し金属母材とセラミックス材料とを固相拡散接合す
る方法が開示されている。Furthermore, JP-A No. 62-176966 discloses a method in which a Cu layer 9 and a Ni layer are provided on the surface of a metal base material, and solid phase diffusion bonding is performed between the metal base material and a ceramic material through these layers. has been done.
［発明が解決しようとする課題］
しかし、有機接着剤を使用した接合方法では、接合部の
高温強度が有機接着剤の耐用温度に支配される。そして
、有機接着剤の耐用温度は一般的に２００℃前後である
ことから、この温度以上の高温雰囲気で接合体を使用す
ることができない。[Problems to be Solved by the Invention] However, in the bonding method using an organic adhesive, the high temperature strength of the bonded portion is controlled by the withstand temperature of the organic adhesive. Furthermore, since the serviceable temperature of organic adhesives is generally around 200° C., the bonded body cannot be used in a high-temperature atmosphere exceeding this temperature.
また、メタライジング−ロウ付けによる場合には、多数
の工程を経て接合体が製造されるため、接合体の製造コ
ストが上昇することは勿論、メタライジング用の蒸着装
置等が必要となる。なお、セラミックス用に開発された
活性金属ロウを使用したロウ付けや液相拡散接合の場合
には、ロウ材としてＡｕ、Ａｇ等の貴金属を含有するも
のを使用するため、製造コストが高くなる。Furthermore, in the case of metallizing-brazing, the joined body is manufactured through a large number of steps, which not only increases the manufacturing cost of the joined body but also requires a vapor deposition apparatus for metallizing. In addition, in the case of brazing or liquid phase diffusion bonding using an active metal solder developed for ceramics, the manufacturing cost increases because a material containing noble metals such as Au and Ag is used as the brazing material.
他方、固相拡散接合によってセラミックス−金属接合体
を製造する方法は、比較的少ない工数で接合体が得られ
る利点を有する。しかし、この方法によるとき、セラミ
ックス材料と金属母材との間に介在させるインサート如
何によって接合体の特性が大きく変わる。On the other hand, the method of manufacturing a ceramic-metal bonded body by solid-phase diffusion bonding has the advantage that the bonded body can be obtained with a relatively small number of man-hours. However, when using this method, the characteristics of the joined body vary greatly depending on the type of insert inserted between the ceramic material and the metal base material.
この点、前掲の特開昭６２−１７６９８６号公報では、
Ｃｕ及びＮｉをインサートとして使用している。しかし
、Ｎｉをセラミックス側に配置した場合、Ｎｉとセラミ
ックスとの親和性が低いことから、接合強度の小さな接
合体となる。その結果、得られたセラミックス−金属接
合体を実用に供する場合、用途に著しい制約を受ける。In this regard, in the above-mentioned Japanese Patent Application Laid-open No. 176986/1986,
Cu and Ni are used as inserts. However, when Ni is placed on the ceramic side, the affinity between Ni and the ceramic is low, resulting in a bonded body with low bonding strength. As a result, when the obtained ceramic-metal bonded body is put into practical use, there are significant restrictions on its use.
そこで、本発明は、これらの問題を解消すべく案出され
たものであり、Ｔｉ箔、Ｃｕ箔及びＦｅＮｉ合金箔を組
合せてインサートとして使用することにより、簡単な方
法で製造され、しかも優れた接合強度をもったセラミッ
クス−金属接合体を提供することを目的とする。Therefore, the present invention was devised to solve these problems, and by using a combination of Ti foil, Cu foil, and FeNi alloy foil as an insert, it can be manufactured by a simple method and has excellent properties. The purpose of the present invention is to provide a ceramic-metal bonded body with high bonding strength.
［課題を解決するための手段］
本発明のセラミックス−金属接合体は、その目的を達成
するために、セラミックス材料と金属材料との接合界面
にセラミックス側表面からＴｉ層１次いでＣｕ層及びＦ
ｅＮｉ合金層があり、これら各層の間が固相拡散接合さ
れていることを特徴とする。[Means for Solving the Problems] In order to achieve the object, the ceramic-metal bonded body of the present invention includes a Ti layer 1, a Cu layer and an F layer from the ceramic side surface at the bonding interface between the ceramic material and the metal material.
It is characterized by having an eNi alloy layer and solid phase diffusion bonding between these layers.
また、このセラミックス−金属接合体は、金属材料とセ
ラミックス材料との間に、セラミックス側表面からＴ
ｌ 箔＋ Ｃｕ箔及びＦｅＮｉ合金箔を挟み、全体に圧
力を加えた状態で真空中で固相拡散接合することによっ
て製造される。Further, in this ceramic-metal bonded body, there is a T between the metal material and the ceramic material from the ceramic side surface.
l Foil + Manufactured by sandwiching Cu foil and FeNi alloy foil and performing solid-phase diffusion bonding in vacuum while applying pressure to the whole.
Ｃ作 用〕
本発明の接合体においては、セラミックス側表面にＴｉ
層が形成される。このＴｉ層は、セラミックスとの親和
性が高く、且つセラミックス表面を接合に遺した活性状
態にするものである。しかも、Ｔｉ層は、固相拡散接合
時にセラミックスを構成する原子との間で拡散し、セラ
ミックスに対して強固に接着する。C action] In the joined body of the present invention, Ti is added to the ceramic side surface.
A layer is formed. This Ti layer has a high affinity with ceramics and makes the ceramic surface active for bonding. Moreover, the Ti layer diffuses with atoms constituting the ceramic during solid-phase diffusion bonding, and is firmly adhered to the ceramic.
他方、ＦｅＮｉ合金は、セラミックスと同等又はそれよ
りも小さい熱膨張係数をもつ材料であって、固相拡散接
合時に金属材料の変形をブロックする作用を呈する。そ
の結果、接合界面に発生する熱応力が緩和され、熱応力
に起因した亀裂１割れ、疲労等の欠陥がない接合体が得
られる。このようなＦｅＮｉ合金としては、インバー、
パーマロイ等がある。On the other hand, FeNi alloy is a material having a coefficient of thermal expansion equal to or smaller than that of ceramics, and exhibits the effect of blocking deformation of metal materials during solid phase diffusion bonding. As a result, the thermal stress generated at the bonding interface is alleviated, and a bonded body free of defects such as cracks, fatigue, etc. caused by thermal stress can be obtained. Such FeNi alloys include invar,
Permalloy etc.
また、これらＴｉ及びＦｅＮｉ合金は、高温強度の優れ
た材料であり、しかもこの性質は固相拡散接合によって
も実質的な変化を受けない。そのため、接合部の高温強
度は、インサートの耐用温度まで保証される。Furthermore, these Ti and FeNi alloys are materials with excellent high-temperature strength, and these properties are not substantially changed by solid-phase diffusion bonding. Therefore, the high temperature strength of the joint is guaranteed up to the insert's service temperature.
更に、Ｔｉ層とＦｅＮｉ合金層との間に、Ｃｕ層を介在
させる。このＣｕ層は、固相拡散接合時及び接合体が高
温雰囲気に長時間晒された際、Ｔｉ層とＦｅＮｉ合金層
との間で有害な金属間化合物が生成されることを防止す
るインヒビターとして働く。この点、Ｃｕ層は、少なく
とも１００μｍ程度の厚みをもつことが必要である。し
かし、Ｃｕ層の厚みが大きくなり過ぎると、接合体の高
温強度がＣｕの強度に支配されることになり、高温雰囲
気での使用に制約を受ける。Furthermore, a Cu layer is interposed between the Ti layer and the FeNi alloy layer. This Cu layer acts as an inhibitor to prevent harmful intermetallic compounds from being generated between the Ti layer and the FeNi alloy layer during solid phase diffusion bonding and when the bonded body is exposed to a high temperature atmosphere for a long time. . In this respect, the Cu layer needs to have a thickness of at least about 100 μm. However, if the thickness of the Cu layer becomes too large, the high-temperature strength of the bonded body will be dominated by the strength of Cu, which will restrict its use in a high-temperature atmosphere.
固相拡散接合は、セラミックス材料と金属材料との間に
Ｔｉ箔、Ｃｕ箔及びＦｅＮｉ合金箔を挟んだ積層体を加
圧しながら、１０−”〜Ｉｉ’ｈ−ルの真空雰囲気中で
８００〜８６０℃に１５〜６０分間加熱することによっ
て行われる。Solid-phase diffusion bonding is performed in a vacuum atmosphere of 10" to 1000 hr while pressing a laminate in which a Ti foil, a Cu foil, and a FeNi alloy foil are sandwiched between a ceramic material and a metal material. This is done by heating to 860°C for 15-60 minutes.
このとき、積層体に加える圧力は、０．５〜２ｋｇｆ／
ｍｍ”の範囲に維持される。この圧力が０．５ｋｇｆ／
ｍｍ”未満では、接合面の密着性が十分でなく、良好な
接合強度が得られない。また、圧力が２ｋｇｆ／ｍｍ”
を超えると、拡散接合時に金属側に塑性変形が生じる虞
れがある。At this time, the pressure applied to the laminate is 0.5 to 2 kgf/
This pressure is maintained within the range of 0.5 kgf/
If the pressure is less than 2 kgf/mm, the adhesion of the joint surfaces will not be sufficient and good joint strength will not be obtained.
If it exceeds this, there is a risk that plastic deformation will occur on the metal side during diffusion bonding.
固相拡散接合は、温度が高いほど拡散反応が迅速に進行
する。そこで、加熱温度を上昇させるとき、加熱時間の
短縮を図ることができる。しかしながら、加熱温度が高
過ぎると、インサート或いは金属母材の一部が溶融し、
インサート金属層の流失が生じる。その結果、ボイド、
亀裂等の欠陥がある接合部となる場合がある。In solid-phase diffusion bonding, the higher the temperature, the faster the diffusion reaction proceeds. Therefore, when increasing the heating temperature, it is possible to shorten the heating time. However, if the heating temperature is too high, part of the insert or the metal base material will melt,
Washing away of the insert metal layer occurs. As a result, void,
The joint may have defects such as cracks.
そこで、接合温度としてインサートや金属材料が溶融し
ない温度範囲、具体的にはインバーをインサートとして
使用するとき８００〜８６０℃に維持し、加熱時間を拡
散状態に応じて１５〜６０分間に設定する。Therefore, the bonding temperature is maintained within a temperature range in which the insert and the metal material do not melt, specifically 800 to 860°C when Invar is used as the insert, and the heating time is set to 15 to 60 minutes depending on the diffusion state.
この方法で接合される金属材料は、特に種類が限定され
るものではないが、−殻構造用鋼、高張力鋼、ステンレ
ス鋼、Ｎｉ基合金鋼等がある。他方、金属材料に接合さ
れるセラミックス材料としては、アルミナ、ジルコニア
、窒化珪素、炭化珪素等が具体的に掲げられる。The metal materials to be joined by this method are not particularly limited in type, but include steel for shell structure, high tensile strength steel, stainless steel, Ni-based alloy steel, and the like. On the other hand, specific examples of ceramic materials to be bonded to metal materials include alumina, zirconia, silicon nitride, and silicon carbide.
［実施例］ 以下、実施例によって、本発明を具体的に説明する。[Example] Hereinafter, the present invention will be specifically explained with reference to Examples.
セラミックス材料と金属材料とを、第１図に示すように
積層して固相拡散接合した。セラミックス材料１として
は、厚さ３ｍｍのアルミナセラミックスを使用した。そ
して、セラミックス材料ｌの両面に、金属材料２として
構造用鋼５Ｍ５０を配置した。また、セラミックス材料
ｌと金属材料２との間には、セラミック材料１側に厚さ
ｌｕｍのＴｉ箔３を、金属材料２側に厚さ１ｍｍのＦｅ
Ｎｉ合金箔４を配置した。そして、チタン箔３とＦｅＮ
ｉ合金箔４との間に、厚さ１００ＬＬｍ１００ＬＬ箔５
を挟み込んだ。A ceramic material and a metal material were laminated and solid phase diffusion bonded as shown in FIG. As ceramic material 1, alumina ceramics with a thickness of 3 mm was used. Then, structural steel 5M50 was placed as the metal material 2 on both sides of the ceramic material 1. Further, between the ceramic material 1 and the metal material 2, a Ti foil 3 with a thickness of lum is placed on the ceramic material 1 side, and a Fe foil 3 with a thickness of 1 mm is placed on the metal material 2 side.
Ni alloy foil 4 was placed. Then, titanium foil 3 and FeN
i Between the alloy foil 4, the thickness 100LLm100LL foil 5
was inserted.
この積層体を真空チャンバー内に装入し、積層体全体に
ラム６で１ｋｇｆ／ｍｍ”の圧力を加えながら、真空度
４ＸＩＯ−’トールの真空雰囲気中で高周波加熱コイル
７によって８６０”Ｃに３０分間加熱した。This laminate is placed in a vacuum chamber, and while applying a pressure of 1 kgf/mm" to the entire laminate with a ram 6, the high-frequency heating coil 7 is heated to 860"C at 30°C in a vacuum atmosphere with a vacuum degree of 4 Heated for a minute.
この加熱によって各層の間で拡散が十分に行われ、金属
材料２に対してセラミックス材料１が強固に接合した接
合体が得られた。This heating caused sufficient diffusion between the layers, and a bonded body in which the ceramic material 1 was firmly bonded to the metal material 2 was obtained.
この接合体から厚さ３ｍｍ、幅４ｍｍ、長さ４０ｍｍの
試験片を切り出し、高温４点曲げ試験によって接合強度
を測定した。その結果、曲げ強度は、２００℃及び４０
０℃でそれぞれ１２０ＭＰａ及び１１０ＭＰａであった
。A test piece with a thickness of 3 mm, a width of 4 mm, and a length of 40 mm was cut out from this joined body, and the joint strength was measured by a high-temperature four-point bending test. As a result, the bending strength was 200°C and 40°C.
They were 120 MPa and 110 MPa at 0°C, respectively.
なお、比較のため、厚さ２ｍｍのＣｕｉをインサートと
して使用する外は同様な接合条件下で、セラミックス材
料と金属材料とを固相拡散接合した。このとき得られた
接合体の接合強度は、室温で１１０Ｍ Ｐ ａであった
。また、アルミナセラミックス側から１ｍｍ厚のＴｉ箔
及び２ｍｍ厚のＣｕｉを介して接合した接合体の強度は
、室温で１００ Ｍ Ｐ ａであった。For comparison, a ceramic material and a metal material were solid-phase diffusion bonded under the same bonding conditions except that Cui with a thickness of 2 mm was used as an insert. The bonding strength of the bonded body obtained at this time was 110 MPa at room temperature. Further, the strength of the joined body joined from the alumina ceramic side via a 1 mm thick Ti foil and a 2 mm thick Cu foil was 100 MPa at room temperature.
この対比から明らかなように、Ｔ ｉ ／ Ｃｕ ／
ＦｅＮｉをインサートとして使用した本実施例の接合体
は、Ｃｕ又はＴ ｉ ／ Ｃｕをインサートとしたもの
に比較して、接合強度が優れていることが判かる。特に
、接合強度が高温で劣化することがないため、高温雰囲
気の使用に耐える接合体が得られた。As is clear from this comparison, T i / Cu /
It can be seen that the bonded body of this example using FeNi as the insert has superior bonding strength compared to the bonded body using Cu or Ti/Cu as the insert. In particular, since the bonding strength does not deteriorate at high temperatures, a bonded body that can withstand use in a high-temperature atmosphere was obtained.
［発明の効果］
以上に説明したように、本発明においては、Ｔｉ、Ｃｕ
及びＦｅＮｉ合金を組合せてインサートとし、セラミッ
クス材料と金属材料とを固相拡散接合している。そのた
め、インサート又は金属材料の耐用限界までの高温使用
環境に耐える接合体が得られる。また、ＦｅＮｉ合金が
セラミックスと同等或いは小さな熱膨張係数をもつ材料
であることから、セラミックス及び金属との熱膨張差に
起因した熱応力も緩和される。しかも、メタライジング
−ロウ付は法に比較して、接合工程が加圧・加熱という
一つの工程ですむため、製造コストの低減も図られる。[Effect of the invention] As explained above, in the present invention, Ti, Cu
and FeNi alloy are combined to form an insert, and the ceramic material and the metal material are solid phase diffusion bonded. Therefore, it is possible to obtain a joined body that can withstand high-temperature usage environments up to the durability limits of the insert or metal material. Furthermore, since the FeNi alloy is a material having a coefficient of thermal expansion equal to or smaller than that of ceramics, thermal stress caused by the difference in thermal expansion between ceramics and metals is also alleviated. Furthermore, compared to the metallizing-brazing method, the bonding process requires only one step of pressurization and heating, so manufacturing costs can be reduced.
第１図は、本発明に従ってセラミックス材料と金属材料
とを固相拡散接合している状態を示す。
１：セラミックス材料 ２：金属材料
３：Ｔｉ箔 ４：ＦｅＮｉ合金箔５：Ｃｕ箔
６：ラム
７：高周波加熱コイル
第
図FIG. 1 shows a state in which a ceramic material and a metal material are solid phase diffusion bonded according to the present invention. 1: Ceramic material 2: Metal material 3: Ti foil 4: FeNi alloy foil 5: Cu foil 6: Ram 7: High frequency heating coil diagram
Claims (2)
ミックス側表面からＴｉ層、次いでＣｕ層及びＦｅＮｉ
合金層があり、これら各層の間が固相拡散接合されてい
ることを特徴とするセラミックス−金属接合体。(1) At the bonding interface between the ceramic material and the metal material, there is a Ti layer from the ceramic side surface, then a Cu layer and a FeNi layer.
A ceramic-metal bonded body comprising an alloy layer and solid phase diffusion bonding between these layers.
クス側表面からＴｉ箔、Ｃｕ箔及びＦｅＮｉ合金箔を挟
み、全体に圧力を加えた状態で真空中で固相拡散接合す
ることを特徴とするセラミックス−金属接合体の製造方
法。(2) Ti foil, Cu foil, and FeNi alloy foil are sandwiched between the metal material and the ceramic material from the ceramic side surface, and solid phase diffusion bonding is performed in vacuum while applying pressure to the entire material. A method for manufacturing a ceramic-metal bonded body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2209032A JP2941382B2 (en) | 1990-08-07 | 1990-08-07 | Ceramic-metal bonded body and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2209032A JP2941382B2 (en) | 1990-08-07 | 1990-08-07 | Ceramic-metal bonded body and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0492871A true JPH0492871A (en) | 1992-03-25 |
| JP2941382B2 JP2941382B2 (en) | 1999-08-25 |
Family
ID=16566129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2209032A Expired - Lifetime JP2941382B2 (en) | 1990-08-07 | 1990-08-07 | Ceramic-metal bonded body and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2941382B2 (en) |
Cited By (6)
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|---|---|---|---|---|
| JP2006519471A (en) * | 2003-03-03 | 2006-08-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | X-ray tube cathode assembly and interfacial reaction bonding process |
| CN103183520A (en) * | 2013-03-01 | 2013-07-03 | 西北工业大学 | Partial transient liquid phase bonding method for carbon/carbon composite material and nickel-base superalloy |
| WO2015141295A1 (en) * | 2014-03-20 | 2015-09-24 | 三菱マテリアル株式会社 | Bonded body, substrate for power modules, power module and method for producing bonded body |
| CN106270882A (en) * | 2016-08-19 | 2017-01-04 | 哈尔滨工业大学（威海） | Titanizing Al in a kind of artificial retina2o3pottery and the method for attachment of titanacycle |
| CN114211076A (en) * | 2022-01-06 | 2022-03-22 | 哈尔滨工业大学 | Connection method of silicon nitride ceramic/nickel-based high-temperature alloy |
| CN115319263A (en) * | 2022-10-13 | 2022-11-11 | 中山大学 | Carbon-based material/metal connection method based on Cu-C/Ti instantaneous liquid phase in-situ reaction |
-
1990
- 1990-08-07 JP JP2209032A patent/JP2941382B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006519471A (en) * | 2003-03-03 | 2006-08-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | X-ray tube cathode assembly and interfacial reaction bonding process |
| CN103183520A (en) * | 2013-03-01 | 2013-07-03 | 西北工业大学 | Partial transient liquid phase bonding method for carbon/carbon composite material and nickel-base superalloy |
| WO2015141295A1 (en) * | 2014-03-20 | 2015-09-24 | 三菱マテリアル株式会社 | Bonded body, substrate for power modules, power module and method for producing bonded body |
| JP2015193526A (en) * | 2014-03-20 | 2015-11-05 | 三菱マテリアル株式会社 | Joined body, substrate for power module, power module, and method for producing joined body |
| CN105829266A (en) * | 2014-03-20 | 2016-08-03 | 三菱综合材料株式会社 | Bonded body, substrate for power modules, power module and method for producing bonded body |
| US9735085B2 (en) | 2014-03-20 | 2017-08-15 | Mitsubishi Materials Corporation | Bonded body, power module substrate, power module and method for producing bonded body |
| CN106270882A (en) * | 2016-08-19 | 2017-01-04 | 哈尔滨工业大学（威海） | Titanizing Al in a kind of artificial retina2o3pottery and the method for attachment of titanacycle |
| CN114211076A (en) * | 2022-01-06 | 2022-03-22 | 哈尔滨工业大学 | Connection method of silicon nitride ceramic/nickel-based high-temperature alloy |
| CN114211076B (en) * | 2022-01-06 | 2022-09-13 | 哈尔滨工业大学 | Connection method of silicon nitride ceramic/nickel-based high-temperature alloy |
| CN115319263A (en) * | 2022-10-13 | 2022-11-11 | 中山大学 | Carbon-based material/metal connection method based on Cu-C/Ti instantaneous liquid phase in-situ reaction |
| CN115319263B (en) * | 2022-10-13 | 2023-01-17 | 中山大学 | Carbon-based material/metal connection method based on Cu-C/Ti instantaneous liquid phase in-situ reaction |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2941382B2 (en) | 1999-08-25 |
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