JP2522124B2 - Method of joining ceramics to ceramics - Google Patents

Method of joining ceramics to ceramics

Info

Publication number
JP2522124B2
JP2522124B2 JP3157373A JP15737391A JP2522124B2 JP 2522124 B2 JP2522124 B2 JP 2522124B2 JP 3157373 A JP3157373 A JP 3157373A JP 15737391 A JP15737391 A JP 15737391A JP 2522124 B2 JP2522124 B2 JP 2522124B2
Authority
JP
Japan
Prior art keywords
ceramics
joining
plate
chrome
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3157373A
Other languages
Japanese (ja)
Other versions
JPH04357175A (en
Inventor
志朗 内田
伸昭 新矢
強 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isuzu Motors Ltd
Original Assignee
Isuzu Motors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isuzu Motors Ltd filed Critical Isuzu Motors Ltd
Priority to JP3157373A priority Critical patent/JP2522124B2/en
Publication of JPH04357175A publication Critical patent/JPH04357175A/en
Application granted granted Critical
Publication of JP2522124B2 publication Critical patent/JP2522124B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、セラミックス同士を接
合する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining ceramics together.

【0002】[0002]

【従来の技術】従来、セラミックス等の粉末成形体と金
属とを接合するには、先ず、セラミックスの表面をMo
−Mn法(テレフケン法)で金属化し、その後にニッケ
ル(Ni)鍍金を施し、必要に応じて応力緩衝のための
中間材を用い、銀(Ag)ろう等で金属にろう接してい
る。特開昭60−145972号公報には、セラミック
スと熱膨張係数が近似している銅、モリブテン板を緩衝
材として使用したセラミックスと金属の接合体が提案さ
れている。
2. Description of the Related Art Conventionally, in order to bond a powder compact such as ceramics to a metal, first, the surface of the ceramic is Mo.
It is metallized by the -Mn method (telefken method), then nickel (Ni) plating is applied, and if necessary, an intermediate material for buffering stress is used, and the metal is brazed with silver (Ag) solder or the like. Japanese Unexamined Patent Publication (Kokai) No. 60-145972 proposes a bonded body of ceramics and a metal, which uses a copper or molybdenum plate having a thermal expansion coefficient similar to that of the ceramics as a cushioning material.

【0003】 本出願人は、クローム鍍金を施したニッ
ケル板を用いてメタライズと同時に接合する発明につい
て、先に特許出願(特願平1−313223号)してい
る。これは、予めクローム鍍金を施したニッケル板と緩
衝材をセラミックスとステンレスとの間に介在させ、真
空度10−3〜10−5Torr程度の真空雰囲気中で
加熱加圧して接合する方法である。
The applicant of the present invention has previously filed a patent application (Japanese Patent Application No. 1-313223) for an invention in which a nickel plate plated with chrome is used for joining at the same time as metallization. This is a method in which a nickel plate preliminarily plated with chrome and a cushioning material are interposed between ceramics and stainless steel, and heated and pressed in a vacuum atmosphere with a vacuum degree of about 10 −3 to 10 −5 Torr to join them. .

【0004】[0004]

【発明が解決しようとする課題】従来のセラミックスと
金属の接合方法では、セラミックスと金属をろう接する
前に、セラミックス表面の金属化及び鍍金工程が必要と
なるので作業能率が悪く、また、銀ろうを使用した場合
には、銀の融点が低いため接合体の耐熱性が低くなる。
前記先願の発明では、メタライズと接合を同時に行なう
ことができるが、予めクロ−ム鍍金を施す工程が必要で
あり、このクロ−ムの膜厚を最適に制御するのが難し
い。また、セラミックス同士の接合については考慮され
ていない。本発明は、セラミックス同士を高能率で接合
でき、また、高接合強度で接合できるセラミックス同士
の接合方法を提供することを目的とするものである。
In the conventional method of joining ceramics and metal, metallization of the ceramics surface and plating process are required before brazing the ceramics and the metal, so that the working efficiency is poor, and the silver soldering is not performed. In the case of using, since the melting point of silver is low, the heat resistance of the bonded body becomes low.
In the invention of the above-mentioned prior application, metallization and bonding can be performed at the same time, but a step of performing chromium plating in advance is required, and it is difficult to optimally control the film thickness of this chromium. Also, no consideration is given to the joining of ceramics. It is an object of the present invention to provide a method of joining ceramics that can join the ceramics with each other with high efficiency and with high joining strength.

【0005】[0005]

【課題を解決するための手段】本発明は、セミックスと
セラミックスとの間に、クローム薄膜層を形成したニッ
ケル板からなる接合板をクローム薄膜層が両セラミック
スに対向するように配設し、所定の真空状態で加熱、加
圧するセラミックス同士の接合方法である。
Means for Solving the Problems The present invention, between the Semikkusu and ceramics, Knitting forming the chrome thin film layer
This is a method of joining ceramics in which a bonding plate made of a Kell plate is arranged such that the chrome thin film layer faces both ceramics, and the ceramics are heated and pressed in a predetermined vacuum state.

【0006】[0006]

【作用】接合板のクローム層がセラミックスと接触して
その表面を金属化し、同時にクロームとセラミックスの
窒素とが反応してCrxNyを生成して接合する。ま
た、接合板のクロームコーテイングは、接合板のニッケ
がセラミックス側に侵入して化合物を生成するのを防
止し、接合部の接合強度と耐熱性が向上する。
The chrome layer of the joining plate comes into contact with the ceramic to metallize its surface, and at the same time, the chrome reacts with the nitrogen of the ceramic to produce CrxNy and join. Also, chrome Cote queuing junction plate, nickel bonding plate
It prevents the resin from penetrating into the ceramics side to form a compound, and improves the joint strength and heat resistance of the joint.

【0007】[0007]

【実施例】本発明の実施例を図面を参照して説明する。
例えば、窒化珪素セラミックス(Si3N4)同士を接合
するのに、図1に示すように、セラミックス1,1の間
に、延性金属である厚さ0.2mmのニッケル(Ni)板にク
ロ−ム鍍金又はIP法、蒸着法によりクロ−ム(Cr)
コ−ティングを施した接合板2,2を、クロ−ム層をセ
ラミックス1側に向けて配設し、これらを0.53Kg/mm2
加圧し、5×10-5Torrの真空中で1100℃以上に加熱して
20分間保持した。上記条件により、クロ−ム層の厚さ、
加熱温度を変えて実験した結果、別表の例1,2に示す
ように高接合強度が得られた。別表の「2.98μmCr-0.2m
mNi」は、図1における接合板2として、2.98μmのクロ
−ムコ−ティングを施した0.2mm厚のニッケル板を示
し、接合強度MPaは、四点曲げ試験の強度を示す。
An embodiment of the present invention will be described with reference to the drawings.
For example, in order to bond silicon nitride ceramics (Si3N4) to each other, as shown in FIG. 1, a chromium (Ni) plate having a thickness of 0.2 mm, which is a ductile metal, is plated between the ceramics 1, 1 by chromium plating or Chrome (Cr) by IP method or vapor deposition method
Coated bonding plates 2 and 2 are arranged with the chrome layer facing the ceramics 1 side, and these are pressed at 0.53 Kg / mm 2 and 1100 in a vacuum of 5 × 10 -5 Torr. Heat above ℃
Hold for 20 minutes. According to the above conditions, the thickness of the chrome layer,
As a result of an experiment conducted by changing the heating temperature, a high bonding strength was obtained as shown in Examples 1 and 2 of the attached table. Attached table `` 2.98μm Cr-0.2m
"mNi" indicates a 0.28-mm-thick nickel plate subjected to 2.98 µm chrome coating as the joint plate 2 in Fig. 1, and the joint strength MPa indicates the strength of the four-point bending test.

【0008】クロ−ム層がセラミックスと接触してその
表面を金属化し、同時にクロ−ムとセラミックスの窒素
とが反応してCrxNyを生成して接合する。また、接合
板のクロ−ムコ−テイングは、接合板のニッケルがセラ
ミックス側に侵入してNi−Si化合物を生成するのを防
止し、接合部の接合強度と耐熱性が向上する。以上のと
おり、ろう材として銀を用いずニッケルを使用したこと
により、接合部の耐熱性が向上し、1工程でセラミック
スの金属化と接合が行えるので、作業能率が向上する。
上記の接合条件は、真空度を10-4〜10-5Torr、加圧
力を0.1〜6Kg/mm2、加熱温度を1000〜1200℃、保持時
間を3〜60分の範囲で変更しても、セラミックス同士の
平均接合強度及び耐熱性は実質的に変わらない。
The chrome layer comes into contact with the ceramic to metallize its surface, and at the same time, the chrome reacts with the nitrogen of the ceramic to produce CrxNy to bond. Further, the chromium coating of the joint plate prevents nickel of the joint plate from penetrating into the ceramics side to form a Ni-Si compound, and the joint strength and heat resistance of the joint portion are improved. As described above, by using nickel instead of silver as the brazing material, the heat resistance of the joint is improved, and the metallization and joining of the ceramics can be performed in one step, thus improving the work efficiency.
The above-mentioned joining conditions are such that the degree of vacuum is changed from 10 -4 to 10 -5 Torr, the applied pressure is changed from 0.1 to 6 kg / mm 2 , the heating temperature is changed from 1000 to 1200 ° C, and the holding time is changed from 3 to 60 minutes. The average bonding strength and heat resistance of the ceramics do not substantially change.

【0009】別の実施例を図2に示す。低熱膨張材であ
るモリブデン(Mo)板3を接合板2,2の間に介在さ
せ、同様に真空雰囲気中において、1000〜1200℃に加熱
し、加圧した状態で1〜60分間保持し、セラミックス1
の表面にクロ−ムメタライズ層を形成すると同時にセラ
ミックス同士を接合するものである。試験の結果では、
別表の例3に示すような条件で、高接合強度が得られ
た。
Another embodiment is shown in FIG. A molybdenum (Mo) plate 3, which is a low thermal expansion material, is interposed between the bonding plates 2 and 2, and is similarly heated to 1000 to 1200 ° C. in a vacuum atmosphere, and is held under pressure for 1 to 60 minutes, Ceramics 1
At the same time as forming a chromium metallized layer on the surface of the ceramics, the ceramics are bonded together. In the test results,
High bonding strength was obtained under the conditions as shown in Example 3 of the attached table.

【0010】次に、別の実施例を図3に示す。軟質金属
である銅(Cu)板4を接合板2,2の間に介在させて
熱応力の緩和を図り、同様に真空雰囲気中において、加
熱、加圧してセラミックス同士を接合するものである。
試験の結果では、別表の例4,5に示す接合強度が得ら
れた。
Next, another embodiment is shown in FIG. A copper (Cu) plate 4, which is a soft metal, is interposed between the bonding plates 2 and 2 to reduce thermal stress, and similarly, heating and pressing are performed in a vacuum atmosphere to bond the ceramics together.
As a result of the test, the bonding strength shown in Examples 4 and 5 of the attached table was obtained.

【0011】図4に、熱応力緩和材として、モリブデン
板3と2枚の銅板4を使用したものを示す。接合条件
は、上記の実施例の場合と同様とする。別表の例6に、
図1において接合板2,2の間に0.3mm厚のニッケル
板を介在させた場合の試験の結果を示す。
FIG. 4 shows a thermal stress relaxation material using a molybdenum plate 3 and two copper plates 4. The joining conditions are the same as those in the above-mentioned embodiment. In Example 6 of the attached table,
FIG. 1 shows the result of a test when a nickel plate having a thickness of 0.3 mm is interposed between the joining plates 2 and 2.

【0012】別表の例7に、図1において接合板2,2
の間に0.1mm厚のSi3N4と比較的熱膨張率が近い低熱
膨張合金コバ−ル(Ni 29%,Co 17%,Mn,Si,M
g,Zr,C,Al,Ti全て1%以下、残部Fe)板を介
在させた場合の試験の結果を示し、高接合強度が得られ
た。
In Example 7 of the attached table, the joining plates 2 and 2 in FIG.
Between low thermal expansion alloys (Ni 29%, Co 17%, Mn, Si, M) having a thermal expansion coefficient relatively close to that of 0.1 mm thick Si3N4.
All the g, Zr, C, Al, and Ti are 1% or less, the balance Fe) shows the results of the test when a plate is interposed, and high bonding strength was obtained.

【0013】 [0013]

【0014】[0014]

【発明の効果】本発明は、セラミックス同士の接合部の
接合強度及び耐熱性が向上し、また、1工程でセラミッ
クスの金属化と接合が行えるので作業能率を向上するこ
とができる効果がある。
EFFECTS OF THE INVENTION The present invention has an effect that the joint strength and heat resistance of the joint portion between the ceramics are improved, and the metallization and the jointing of the ceramics can be performed in one step, so that the working efficiency can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明方法の一実施例の説明図。FIG. 1 is an explanatory view of an embodiment of the method of the present invention.

【図2】本発明方法の他の実施例の説明図。FIG. 2 is an explanatory view of another embodiment of the method of the present invention.

【図3】本発明方法の他の実施例の説明図。FIG. 3 is an explanatory view of another embodiment of the method of the present invention.

【図4】本発明方法の他の実施例の説明図。FIG. 4 is an explanatory view of another embodiment of the method of the present invention.

【符号の説明】[Explanation of symbols]

1 セラミックス 2 クロ−ムコ−ティングニッケル板 3 モリブデン板 4 銅板 1 Ceramics 2 Chrome Coating Nickel Plate 3 Molybdenum Plate 4 Copper Plate

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−90878(JP,A) 特開 昭61−137688(JP,A) 特開 昭63−274677(JP,A) 特開 昭63−230576(JP,A) 特開 平4−26571(JP,A) ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-60-90878 (JP, A) JP-A-61-137688 (JP, A) JP-A-63-274677 (JP, A) JP-A-63- 230576 (JP, A) JP-A-4-26571 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 セミックスとセラミックスとの間に、ク
ローム薄膜層を形成したニッケル板からなる接合板をク
ローム薄膜層が前記両セラミックスに対向するように配
設し、所定の真空状態で加熱、加圧することを特徴とす
るセラミックス同士の接合方法。
1. A bonding plate made of a nickel plate on which a chrome thin film layer is formed is provided between the ceramics and the ceramics so that the chrome thin film layer faces both of the ceramics and heated and heated in a predetermined vacuum state. A method for joining ceramics to each other characterized by applying pressure.
JP3157373A 1991-06-03 1991-06-03 Method of joining ceramics to ceramics Expired - Fee Related JP2522124B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3157373A JP2522124B2 (en) 1991-06-03 1991-06-03 Method of joining ceramics to ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3157373A JP2522124B2 (en) 1991-06-03 1991-06-03 Method of joining ceramics to ceramics

Publications (2)

Publication Number Publication Date
JPH04357175A JPH04357175A (en) 1992-12-10
JP2522124B2 true JP2522124B2 (en) 1996-08-07

Family

ID=15648240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3157373A Expired - Fee Related JP2522124B2 (en) 1991-06-03 1991-06-03 Method of joining ceramics to ceramics

Country Status (1)

Country Link
JP (1) JP2522124B2 (en)

Also Published As

Publication number Publication date
JPH04357175A (en) 1992-12-10

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