JPS60108376A - Bonded body of nitride ceramic and metal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a bonded body of nitride ceramics and 10,000 gold.

[Technical background of the invention and its problems]

Recently, ceramic materials have been used in a wide range of fields such as structural materials and functional materials due to their excellent properties. In many cases, the parts are composed of ceramic 11i bodies,
In order to use ceramics in more fields, it is necessary that they can be bonded to metals. In this case, if it is a structural component, sufficient bonding strength is required, while if it is a functional component, continuity or the like is required at the bonding interface.

However, ceramics and metals have different atomic bonding states, and when joining metals and ceramics, their chemical properties such as reactivity, thermal expansion coefficient,
Physical properties such as electrical conduction characteristics vary greatly. Therefore, both members are well r, 7. + Highly reliable
It is quite difficult to perform metal bonding.

By the way, one of the conventional methods for joining ceramics and metals is the method of using active metals (U.S. Special Regulations 2,85
7,663) is known. This method is T i ,
When active metals such as Zr are alloyed with metals such as Cu and N+, their melting point decreases by several hundred C1.
Metals and alumina, forsterite, and beryllia are produced using fruits.

This is a method for joining oxide ceramics such as zirconia.

However, the method described above does not apply to ceramic-metal bonded bodies, especially A7! When a bonded body of nitride ceramics such as N or S-N4 and metals such as Cu or NI is made,
When a thermal shock is applied to the bonded body, thermal stress is generated due to the difference in thermal expansion between the bonded bodies, which has the drawback of causing cranks in the nitride ceramics. That is, as shown in the table below, the coefficient of thermal expansion of ordinary oxide ceramics is 8.6
10-'/'C, ~l 3.5X10 "6/'C,
−C′l>, u.

A I NIS i, N4CD thermal expansion coefficient is approximately 5X each
Compared to 10-'/'C, 2,5X l O-'/C, it is much larger.

It shows a value close to the thermal expansion coefficient of Cu+Fe. Therefore, greater thermal stress occurs in a bonded body of nitride ceramics and Cu, FC, etc. than in a bonded body of oxide ceramics and metal, making the ceramic more susceptible to cranking.

For this reason, there is a ductility between the wax pine and the wax pine containing active gold 11 (,lu, Cu alloy.

A method of joining nitride ceramics and amalgamated duck using a metal plate (Japanese Unexamined Patent Application Publication No. 1983-111) where the solder +a and a metal thin plate are spot-welded and integrated by intervening gold 1i4R such as Al (Japanese Unexamined Patent Publication No. 56-1
63093) has been proposed. Furthermore, a bonded body in which a filter material containing an active metal is diffused into a ceramic and metal matrix has also been developed. However, these methods have problems involving complicated steps and long-time heat treatment.

For this reason, there is a strong need for a bonded body of nitride ceramics and transition metals that can be manufactured through a simpler process and that can improve bonding strength and alleviate thermal stress.

[Purpose of the invention]

The present invention aims to provide a bonded body of nitride ceramics and metal that can be manufactured in a premature process, has high bonding strength, has a high thermal stress relaxation effect, and can prevent cranking of nitride ceramics.

[Summary of the invention]

The present inventors have succeeded in developing a CC nitride ceramic metal bonded body based on the points explained below.

That is, a brazing material containing active metals such as Ti+Zr has good wettability with nitride ceramics. This is Ti, Z
r reacts with nitride ceramics to form nitrides (TiN, Z
It has already been confirmed that the purpose is to form (rN, etc.).

Also, 'l'' i, 'l, r are All!N+5i
The Chinese-Japanese value t'1 of the coefficient of thermal expansion of SN4 nitride ceramics and Cu and 1QivJ metals is approximately 3.9 X l
o-'/'C,.

5XlO-'/'C.

Further, the coefficient of thermal expansion of an alloy consisting of metals A and B generally has a proportional relationship of tensile coefficient αalloy-αAMA+αBMB as shown in the following equation.

However, from the above research results, AIN and St m N
In a bonded body of a fluoride ceramic with a relatively small coefficient of thermal expansion such as a and a metal such as Cu or Ni, the active metal nitride IO is connected to the joint from the nitride ceramic side.
, an alloy of λ゛m Sugikin metal rich in active metals of at least lj (99 to 50 wt+t'%), and at least one layer of active metals rich in active metals (99 to 50 wt%). By forming a multilayer structure in which alloy metals are sequentially arranged, the difference in coefficient of thermal expansion between the nineride ceramic and the transition metal II can be gradually reduced at the joint.

We have found a bonded body in which nitride ceramics and 10,000 ml of transition gold are bonded to 10,000 ml of nitride ceramics, which can prevent the occurrence of cracks in yellowed ceramics by reducing the thermal stress between them.

This effect of reducing thermal stress in the bonded body will be clear from the following explanation.

In other words, if σ is the stress generated in the valve 1 in the ceramic-gold 1-like bonded body, then the following equation is obtained: [In the equation, Δα is the difference in thermal expansion coefficient between the ceramic and metal, and ΔT is the molding temperature and chamber temperature. Temperature difference between Ni+A, Ed
, Young's modulus, t is thickness, c and m are Cefmix and metal, respectively).

From this equation, it can be seen that in the case of an equal bond (other than Δα), if Δα is smaller than 3, the generated stress σ will be smaller.

The conjugated body il:fri11 of the present invention is manufactured by the following method.

Mari, 1001 at the joint between dust ceramics and metal
j'o or t8i, is an active metal close to ioo%. position 16 on the side
So that I can do it. θ(at 900'C, preferably 92(n~l), at 050'C, l~2
Nitride ceramics and gold are bonded by heat treatment for 0 minutes at qr4H degrees for a short time of 11.1. ．． +: Forming a joint consisting of an active metal compound layer between i, an alloy layer of 1υ with active metal and 10,000 mol of active metal, and an alloy layer of activated duck with 10,000 of 3:3 molten metal. A bonded body having the above-mentioned good properties is produced.

[Embodiments of the invention]

Next, the present invention will be explained in detail.

Example 1 First, a Zr layer with a thickness of 50 μm was placed between the AdN member and the Cu member.
A Cu foil with a thickness of 50 μm was interposed between the Zr9 member and the C11 member.

Then, heat treated at 920'C for 5 minutes.
N? A joint of the IS fence and the Cu member was manufactured.

The obtained bonded body contains zrNfU, 95 to 98 atomic% Zr- from the AgN side between the AeN side and the Cu BIS side.
The balance Cu alloy layer and the 75% Cu alloy layer and the balance zr alloy layer formed a JI [first order ff, >t]C multilayer structure joint. When the cross section of such a bonded body was observed with an optical microscope at a magnification of 100 times, no cranking was observed in the AlN portion.

In addition, solder the C11 tensile test jig to the Cu part of the obtained product with PB-8N solder.

A short continuous tensile test was conducted at room temperature. the result.

It was confirmed that the rupture always occurred at the soldering part, and that the bonded body was strongly joined at the joint part of the eight-part multilayer structure.

Implementation [Nri 2 Ill with a thickness of 10 μm between the AgN part and the C and u members
i F^ is interposed, and TI foil and C11 part (between issues V
C, Il; I: Sl OO74m17) Cu foil was interposed. A bonded body was manufactured by performing the same heat treatment as in Fall 1 (4.1).

``A'', combined with the torn 1 is the AdN section and the cough of the Cu member, the A/N section (from the '' side 'f' i Nl 13.95 ~ 9
8 atomic %'1'1-remaining FXtSCu alloy layer and 75
A multi-structured joint was formed in which alloy layers of 1% Cu and I and I'fl were sequentially arranged. As in Example 1, when the cross section of such a joined body was observed, no cranking occurred at the A6N6 portion. Ushida, joint) 廿も柿め1
It was a commercial item.

〔Effect of the invention〕

As detailed above, according to the present invention, there is a difference between I14! Nitride ceramics are effective for various functional parts, which can be manufactured by a process that is easy to manufacture, have a stable bonding strength, and can prevent the occurrence of cranks due to the effect of mitigating thermal stress when affected by heat. and metal joints.

[Brief explanation of drawings]

The figure is a characteristic diagram showing the relationship between composition and thermal expansion coefficient in a zr-Cu alloy. Applicant's agent Patent attorney Rin Pressure b Zr＞)l , L /wt% Continued from page 1 0 Inventor Shiro Kane 1, Komukai Toshiba-cho, Saiwai-ku, Seiyousaki-shi Tokyo Shibaura Electric Co., Ltd. Research Center

Claims (1)

[Claims] The joint between the nitride ceramic and the metal includes, from the ceramic side, a nitride layer of an active metal, at least one layer of an active metal-rich transition metal alloy, and at least one layer of an active metal-rich transition metal layer. A bonded body of nitride ceramics and metal formed of a multilayer structure in which alloys of nitride and metal are sequentially arranged.