JPS62187183A - Method of joining ceramic to metal - Google Patents
Method of joining ceramic to metalInfo
- Publication number
- JPS62187183A JPS62187183A JP2783586A JP2783586A JPS62187183A JP S62187183 A JPS62187183 A JP S62187183A JP 2783586 A JP2783586 A JP 2783586A JP 2783586 A JP2783586 A JP 2783586A JP S62187183 A JPS62187183 A JP S62187183A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- metal
- alloy
- joining
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 18
- 239000000919 ceramic Substances 0.000 title claims description 17
- 239000002184 metal Substances 0.000 title claims description 17
- 238000009792 diffusion process Methods 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000007790 solid phase Substances 0.000 claims description 12
- 229910052720 vanadium Inorganic materials 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 229910000765 intermetallic Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 239000010410 layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- 239000000843 powder Substances 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910001235 nimonic Inorganic materials 0.000 description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910017150 AlTi Inorganic materials 0.000 description 1
- 229910018507 Al—Ni Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001005 Ni3Al Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910000946 Y alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミックと金属の接合方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for joining ceramics and metals.
セラミックを金属に接合する方法として、アルミまたは
アルミ合金をインサートメタルとして用い、セラミック
と金属を固相拡散接合する方法が知られている。この方
法は、金属母材に対し４００〜６００℃という比較的低
い温度でセラミックを接合できるため、所謂ろう付性の
ように耐熱鋼や耐熱合金の高温強度が過時効や再結晶な
どにより低下してしまうという不都合は生じない。As a method for bonding ceramic to metal, a method is known in which aluminum or an aluminum alloy is used as an insert metal and the ceramic and metal are solid-phase diffusion bonded. This method allows the ceramic to be joined to the metal base material at a relatively low temperature of 400 to 600°C, so the high-temperature strength of heat-resistant steels and heat-resistant alloys, such as so-called brazeability, decreases due to overaging or recrystallization. There will be no inconvenience caused.
しかし、この方法は接合部に高温強度の低いアルミを主
体とする層が残存するため。However, this method leaves a layer consisting mainly of aluminum, which has low high-temperature strength, in the joint.
得られる接合体は高温機器部には使用できないという欠
点がある。The resulting joined body has the disadvantage that it cannot be used in high-temperature equipment.
従来の接合法は、接合しようとするセラミックと金属材
の間にアルミ又はアルミ合金の箔又は粉末を挾み、４０
０〜６００ｔ：で加圧（１〜１ｏ ｏ ＫｙｔｉＪ ）
するものであり、接合雰囲気は大気中、真空中不活性雰
囲気のいずれかで行なわれる。第５図は、このｉ合部分
の主要構成元素の濃度変化を示すものであり、Ｌの範囲
で示すようなｋＡを主体とする軟質層が残存する。この
ような層が残存すると、接合体の強度は室温から３００
℃の間では約２０ＫＩＩｆＺ−であるが、これ以上の温
度では強度が急激に低下してしまう。従って、このよう
な接合体を３００℃以上の温度で使うことはできない。The conventional joining method involves sandwiching aluminum or aluminum alloy foil or powder between the ceramic and metal materials to be joined.
0~600t: pressurized (1~1o KytiJ)
The bonding atmosphere is either air, vacuum, or inert atmosphere. FIG. 5 shows the concentration changes of the main constituent elements in this i-junction part, and a soft layer mainly composed of kA remains as shown in the range L. If such a layer remains, the strength of the bonded product will increase from room temperature to 300
The strength is approximately 20KIIfZ- at temperatures above 20°C, but the strength rapidly decreases at temperatures above this temperature. Therefore, such a bonded body cannot be used at temperatures above 300°C.
本発明はこのような従来の問題に鑑みなされたもので、
高温状態でも高い接合強度が維持される接合構造を得る
ことができる方法を提供せんとするものである。The present invention was made in view of such conventional problems,
The present invention aims to provide a method capable of obtaining a bonded structure that maintains high bonding strength even under high temperature conditions.
このため本発明は、 ＡｌまたはＡｌ合金からなる接合
用インサート部材を用いてセラミックと金属とを接合す
るに当り、接合用インサート部材と金属材との間に、Ｎ
１％Ｔ１． Ｃｏ、 Ｖ％またはＷ若しくはこれら金属
の１種または２種以上を含む合金からなる中間部材を介
在させ、固相拡散接合及びその後必要に応じて行われる
拡散熱処理により接合用インサート部材の紅の少なくと
も一部と中間部材を構成するＮｉ 、 Ｔｉ 、’ Ｃ
ｏ、 Ｖ及びＷの１種または２種以上とにより金属間化
合物を形成させるようにしたことをその基本的特徴とす
る。Therefore, in the present invention, when joining a ceramic and a metal using a joining insert member made of Al or an Al alloy, N is added between the joining insert member and the metal material.
1%T1. An intermediate member made of Co, V%, W, or an alloy containing one or more of these metals is interposed, and at least the red color of the joining insert member is removed by solid-phase diffusion bonding and subsequent diffusion heat treatment as necessary. Ni, Ti, 'C forming part and intermediate member
The basic feature is that an intermetallic compound is formed by one or more of O, V, and W.
上記Ｎ１．Ｔｉ、Ｃｏ、Ｖ、Ｗの各金属元素はＡｌとの
間で高温強度の高い金属間化合物を形成するものであり
、固相拡散接合及びその後必！！番ζ応じて行われる拡
散熱処理によって金属間化合物が形成されることにより
、紅を主体とする高温強度の低い層（Ａｌ、 Ｎｉ Ａ
ｌｓ等）が減少ないし消失し、これによって高温強度の
大きい接合体が得られる。Above N1. Each of the metal elements Ti, Co, V, and W forms intermetallic compounds with high high temperature strength with Al, and solid-phase diffusion bonding and subsequent bonding are essential. ! As a result of the formation of intermetallic compounds through the diffusion heat treatment carried out depending on the number of
ls, etc.) is reduced or eliminated, thereby resulting in a bonded body with high high-temperature strength.
以下１本発明の詳細な説明する。Hereinafter, one aspect of the present invention will be explained in detail.
本発明は、金属材とセラミックとをＡｌまたはＡｌ合金
からなる接合用インサート部材を介在させて接合するｔ
こ轟り、接合用インサート部材と金属材との間に、 Ｎ
ｌ、 Ｔｉ、Ｃｏ％ＶまたはＷ若しくはこれら金属の１
種または２種以上を含む合金からなる中間部材を介在さ
せ、この中間部材と接合用インサート部材を固相拡散接
合し、さらに必要に応じて拡散熱処理を行う。The present invention is a method for joining metal materials and ceramics with a joining insert member made of Al or Al alloy interposed therebetween.
There is noise between the joining insert member and the metal material.
l, Ti, Co%V or W or one of these metals
An intermediate member made of a species or an alloy containing two or more species is interposed, and the intermediate member and the joining insert member are solid-phase diffusion bonded, and further, if necessary, diffusion heat treatment is performed.
上記中間部材はＭとの間で比較的高温強度の嵩い金属間
化合物、例えばＮ１５ｋｔ。The intermediate member is made of a bulky intermetallic compound with relatively high temperature strength, for example, N15kt.
Ｎ１５（Ａｊ、Ｔｉ ） 、 Ｎ１５（Ａ４Ｎｂ ）、
Ｎｈ （Ａｊ、Ｃｒ ） 、 ｋｔＴｉ等を形成するも
のであり、その種類としては、純Ｎｌ 、純Ｔ１、Ｎｉ
−Ｔｉ合金、Ｎ１−ｃｒ金合金純ｃｏ、 Ｎｉ−Ｃｒ
Ｃｏ合金、Ｎ１−ｃｒ−Ｆｅ合金、純ｖ、ｙ合金、純
Ｗ、Ｗ合金等があげられる。N15 (Aj, Ti), N15 (A4Nb),
It forms Nh (Aj, Cr), ktTi, etc., and its types include pure Nl, pure T1, Ni
-Ti alloy, N1-Cr gold alloy pure co, Ni-Cr
Examples include Co alloy, N1-cr-Fe alloy, pure V, Y alloy, pure W, W alloy, etc.
このようにＡｌまたはＡｌ合金の接合用インサート部材
と金属材との間に中間部材を介在させて固相拡散接合及
びその後必要に応じて拡散熱処理を行うことにより、中
間部材のＮ１ｍＴｌ、 Ｃｏ、 Ｖ、 Ｗが接合用イン
サート部材のＭとの間で高温強度の高い金属間化合物を
形成し、この結果、高温強度の低い紅を主体とする層（
接合用インサート部材による層）。In this way, by interposing the intermediate member between the Al or Al alloy bonding insert member and the metal material and performing solid phase diffusion bonding and then performing diffusion heat treatment as necessary, the intermediate member's N1mTl, Co, V , W forms an intermetallic compound with high high temperature strength with M of the bonding insert member, and as a result, a layer mainly composed of red with low high temperature strength (
layer with bonding insert members).
すなわち、ＡＬ、Ｎ１Ａｊ３等の層が減少ないし消失し
、高い高温強度を有する接合体が得られる。That is, the layers such as AL, N1Aj3, etc. are reduced or eliminated, and a joined body having high high temperature strength is obtained.
本発明が接合の対象とするセラミックは、Ｓｉｎ、 ５
１３Ｎ４ 、 Ａｊ！０３ 、ＺｒＯ２，サイア０７等
であり、また接合用インサート部材としては、通常綿Ａ
ｌ、Ａｌ合金（Ａｌ−Ｎｉ、紅−Ｎｉ−Ｔｉ、ｋｌ −
Ｎｉ −Ｃｒ等）の板体、箔体が用いられるが、場合に
よっては粉体を用い、或いは中間部材のセラミック接合
側の面等にＡｌ若しくは紅合金コーチインクＯμメッキ
、 Ａｌ溶射、 Ａｌ蒸着等）したものを用いることも
できる。The ceramic to be bonded in the present invention is Sin, 5
13N4, Aj! 03, ZrO2, SIA 07, etc., and as a joining insert member, usually cotton A
l, Al alloy (Al-Ni, Beni-Ni-Ti, kl -
(Ni-Cr, etc.) plates or foils are used, but in some cases powder is used, or the surface of the ceramic bonding side of the intermediate member is coated with Al or red alloy coach ink Oμ plating, Al spraying, Al vapor deposition, etc. ) can also be used.
固相拡散接合及びその後必要に応じて行われる拡散熱処
理は１通常次のような条件で行われる。Solid-phase diffusion bonding and subsequent diffusion heat treatment, if necessary, are usually performed under the following conditions.
接合条件 温度・・・４００〜６５０℃圧縮応力・・
・Ｏ〜１０販乙−
雰囲気・・・真空、又は不活性ガス
拡散熱処理条件 温度・・・５５０〜７５０℃雰囲気・
・・真空、大気、又は不活性ガスなお、前記拡散熱処理
は接合時間を比較的長くしたり、締金用インサートメタ
ルの厚さを小さくすることにより省くこともできる。Bonding conditions Temperature: 400-650℃ Compressive stress...
・O ~ 10 sales - Atmosphere: Vacuum or inert gas diffusion heat treatment conditions Temperature: 550 to 750℃ Atmosphere・
...Vacuum, air, or inert gas Note that the diffusion heat treatment can be omitted by making the bonding time relatively long or by reducing the thickness of the fastening insert metal.
第１図に本発明法を母材金属とセラミックの接合に適用
した場合の工程例を示す。FIG. 1 shows an example of a process in which the method of the present invention is applied to bonding a base metal and a ceramic.
母材面には中間部材、接合用インサート部材（Ａｌ）、
セラミック材の順に重ねられ、加圧加熱処理することｌ
こより各部材が固相拡散接合する・この場合、接合用イ
ンサート部材たるＡｌとしては、（Ａ）に示すような箔
体、（Ｂ）に示すような中間部材のコーティング層、或
いは（Ｃ）に示すような粉体を用いることができる。On the base metal surface are an intermediate member, a joining insert member (Al),
Ceramic materials are layered in order and subjected to pressure and heat treatment.
As a result, each member is solid phase diffusion bonded. In this case, the Al serving as the bonding insert member may be a foil as shown in (A), a coating layer of an intermediate member as shown in (B), or a A powder as shown can be used.
上記固相拡散接合により、中間部材の一部が接合用イン
サート部材たる紅の少なくとも下層側と反応し、Ａｌと
Ｎｉ、 Ｔｉ、Ｃｏ、 ＶまたはＷの１種または２種以
上とを含む金属化合物反応層が形成される。By the solid-phase diffusion bonding, a part of the intermediate member reacts with at least the lower layer side of the bonding insert member, and a metal compound containing Al and one or more of Ni, Ti, Co, V, or W is formed. A reaction layer is formed.
さらにＡｌ層と中間部材金属との反応が不十分な場合に
は、続いて拡散熱処理を行い。Further, if the reaction between the Al layer and the intermediate member metal is insufficient, a diffusion heat treatment is subsequently performed.
反応を促進させてＡｌ層を消失させるか或いは必要な程
度までＡｌ層を減少させる。第２図はこのようにして得
られた接合材の層高方向における成分分布を示す・
なお、本発明では材質の異なる中間部材を複数枚積層さ
せるようにすることができる。The reaction is accelerated to eliminate the Al layer or reduce the Al layer to a necessary extent. FIG. 2 shows the component distribution in the layer height direction of the bonding material thus obtained. In the present invention, a plurality of intermediate members made of different materials may be laminated.
また接合用インサート部材に粉末を用いる場合、Ａｌま
たはＡｌ合金粉末とＮｉｓ （ＡｌＴｉ ）等のＮｌ、
Ｔｉ、 Ｃｏ、Ｖ、 Ｗの１糧または２種以上を含む金
属間化合物粉末とを混合したものを用いることができる
。In addition, when using powder for the joining insert member, Al or Al alloy powder and Nl such as Nis (AlTi),
A mixture with an intermetallic compound powder containing one or more of Ti, Co, V, and W can be used.
［１） ＳＩＣ材とＮｌｍｏｎｉｃ合金材（母材）とを
以下の条件で接合し、しかる後拡散熱処理した。゛なお
、本実施例では中間部材としてニッケル板とタングステ
ン板の２種類の部材を用い、しかも接合用インサート部
材と中間部材のほかに、中間部材と母材との間に熱応力
緩和用部材として銅板を介在させた・Ａ）材料及び寸法
・セラミック：常圧焼結８ｉＣ＃１５ｍＸｔ２■・接合
用インサート部材
ニアルミ箔 ｇｌｉｓ■Ｘ ｔＯ，１０■曇中間部材
二ニッケル板グ１８ｗＸｔＯ，５■： タングステン板
グ１８■Ｘ ｔ Ｏ，５■・熱応力緩和用部材
：銅板 ＄ １８ｗＸｔ Ｏ，２ｍ
・母 材： Ｎｉｍｏｎｉｃ ８０Ａ ｊ１５ｓａＸ
ｔ ３０ ｍＢ）接合条件
温 度：６００℃
圧縮応カニ ２． Ｑ Ｋｆｆ ／１ｔｅｎ”圧縮時間
：２．Ｏｈ
暮囲気： １．０Ｘ１０ ｔｏｒｒ
Ｃ）拡散熱処理
温 度二 ６５０℃
時 間：０．２５ｈ
雰囲気： １．ＯＸ １０ ｔｏｒｒ第３図は本実施
例における接合体の断面構造を模式的番ζ示すもので、
（ａ）は固相拡散接合後の構造を、（ｂ）は熱拡散処理
後の構造を示している。これによれば固相拡散接合のま
までは低融点で高温強度の低いＡｌ。[1] The SIC material and the Nlmonic alloy material (base material) were joined under the following conditions, and then subjected to diffusion heat treatment.゛In this example, two types of members, a nickel plate and a tungsten plate, are used as the intermediate member, and in addition to the joining insert member and the intermediate member, there is a member between the intermediate member and the base material as a thermal stress relaxation member. Copper plate interposed ・A) Materials and dimensions ・Ceramic: Pressureless sintered 8iC#15m
Nickel plate 18wXtO,5■: Tungsten plate 18XtO,5■・Thermal stress relaxation member: Copper plate $18wXtO,2m・Base material: Nimonic 80A j15saX
t 30 mB) Bonding conditions Temperature: 600℃ Compression cracking 2. Q Kff /1ten'' Compression time: 2.Oh Surrounding atmosphere: 1.0X10 torr C) Diffusion heat treatment temperature 2650℃ Time: 0.25h Atmosphere: 1.OX 10 torr Figure 3 shows the joined body in this example. The schematic number ζ shows the cross-sectional structure of
(a) shows the structure after solid phase diffusion bonding, and (b) shows the structure after thermal diffusion treatment. According to this, Al has a low melting point and low high-temperature strength when solid-phase diffusion bonded.
Ｎ１ＡＡ１が比較的多く残存しているのに対し、拡散熱
処理後ではこのような層はほとんど消失し、高温強度の
比較的高いＮ１ｋｔ、 Ｎｉ３Ａｌの反応層が形成され
ている。While a relatively large amount of N1AA1 remains, such a layer almost disappears after the diffusion heat treatment, and a reaction layer of N1kt and Ni3Al with relatively high high temperature strength is formed.
第４図はこのような接合体の引張強度を従来法による接
合体と比較して示すもので。Figure 4 shows the tensile strength of such a bonded body in comparison with that of a bonded body made using a conventional method.
本発明材では室温付近の強度は従来法によるものとほと
んど変らないが６５０〜７５０℃では２０ Ｋｇ ｆ
／ ｍ”以上の引張強度を示している・
Ｃｎ ］ Ｓ ｉ ｓ Ｎ４材とＮｉｍｏｎｉｃ合金材
を以下の条件で接合した一本実施例では中間部材たる二
ツケル板ｌこアルミコーティングを行い、このアルミコ
ーティング層を接合用インサートメタルとして用いた。The strength of the material of the present invention near room temperature is almost the same as that of the conventional method, but at 650 to 750°C, the strength is 20 kg f.
In this example, a Nitsukeru plate serving as an intermediate member was coated with aluminum, and the Nitskel plate was coated with aluminum. The coating layer was used as an insert metal for joining.
なお５本実施例でも中間部材としてはニッケル板とタン
グステン板を用い、また中間部材と母材との間に熱応力
緩和用部材として銅板を介在させた。In the fifth embodiment, a nickel plate and a tungsten plate were used as the intermediate member, and a copper plate was interposed between the intermediate member and the base material as a member for relieving thermal stress.
Ａ）材料及び寸法
・セラミック：常圧焼結Ｓｉ３Ｎ４０１５■Ｘｔ２■・
接合用インサート部材及び中間部材 −二アルミコーテ
ィングニッケル板
・アルミコーティング層（接合用インサートメタル）
厚さ０．０２０露
・ニッケル板 ｊ！Ｌｉｓ■ｘｔｏ、ｏｓ■： タング
ステン板 Ｊ２ｒ１８ｍＸｔＯｊ■・熱応力緩和用部材
：銅板 ｌ １８ｗＸ ｔ Ｏ，５ｍ
・母 材： Ｎｉｍｏｎｉｃ ８０ Ａ １６１５ｍＸ
ｔ３０ｗＢ）接合条件
温 度二６２５℃
圧縮応力＝２．０〜ｆ ／ｍ’
圧縮時間：２．Ｏｈ
雰囲気： ｔｘｉｏ ｔｏｒｒ
本実施例はニッケル板上にＡｌの薄膜（コーティング層
）を形成すること化より、接合ままの状態でＡｌ又はに
’ｓ Ｎ ｉなどの軟質層を残存させないようにしたも
のであり、反応層の相構成は第３図（ｂ）に示す拡散熱
処理を施したものとほぼ同様であった。A) Materials and dimensions・Ceramic: Pressure sintered Si3N4015■Xt2■・
Insert parts and intermediate parts for joining - Dialuminum coated nickel plate/aluminum coating layer (insert metal for joining)
Thickness 0.020 dew/nickel plate j! Lis■xto,os■: Tungsten plate J2r18mXtOj■・Thermal stress relaxation member: Copper plate l 18wX t O, 5m・Base material: Nimonic 80A 1615mX
t30wB) Bonding conditions Temperature 2625°C Compressive stress = 2.0~f/m' Compression time: 2. Oh Atmosphere: txio torr In this example, a thin Al film (coating layer) was formed on the nickel plate, so that no soft layer such as Al or Ni's Ni remained in the bonded state. The phase structure of the reaction layer was almost the same as that shown in FIG. 3(b) after the diffusion heat treatment.
（Ｉｌｌ〕ＳｉＣ材とＮｉｍｏｎｉｃ合金材を以下の条
件で接合した６本実施例でも中間部材としてニッケル板
とタングステン板を用い、また中間部材と母材との関ζ
ζ熱応力緩和用部材として銅板を介在させた。(Ill) In the 6th embodiment in which SiC material and Nimonic alloy material were joined under the following conditions, a nickel plate and a tungsten plate were used as intermediate members, and the relationship between the intermediate member and the base material ζ
ζ A copper plate was interposed as a member for relaxing thermal stress.
Ａ）材料及び寸法
・セラミック：常圧焼結ＳｉＣグ１５箇Ｘ ｔ １．Ｏ
ｍ・接合用インサート部材
： Ａｌ−Ｎｉ５Ａｌ箔Ｊ２１）８ｍＸ ｔ Ｏ，０５
ｗｉ・中間部材二ニッケル板り１８鱈ＸｔＯ，０５■：
タングステン板 ３２１）８ｗＸｔ０．５ｍ・熱応力
緩和用部材
：銅板９６１８ＷＸ ｔ Ｏ，５−
・母 材 ： Ｎｉｍｏｎｌｃ８０Ａ ｊｒ１５
ｍＸｔ３０ｍＢ）接合条件 １：Ｉｌ］Ｂ）と同じ
本実施例は接合用のインサート部材としてアルミ箔の代
りにＡｌＮｉ５ Ａｌ箔を用いたものであり、その組成
は３０ ｗｔ ％ ｋＡ−７０ｗｔ％Ｎ１３Ａｌである
。なお箔の替りＪＣＡｌ粉末とＮｉ５Ａｌ粉末を用いる
ことも可能である・接合後の反応層の相構成は第３開缶
）に示すものとほぼ同じであり、接合体の高温強度も優
れていた。A) Materials and dimensions - Ceramic: Pressure sintered SiC 15 pieces x t 1. O
m/Joining insert member: Al-Ni5Al foil J21) 8mX t O,05
wi・Intermediate member 2 nickel plate 18 cod XtO, 05■:
Tungsten plate 321) 8wXt0.5m・Thermal stress relaxation member: Copper plate 9618WXt O,5-・Base material: Nimonlc80A jr15
mXt30mB) Bonding conditions 1: Il] Same as B) This example uses AlNi5 Al foil instead of aluminum foil as the insert member for bonding, and its composition is 30 wt % kA - 70 wt % N13 Al. . Note that it is also possible to use JCAl powder and Ni5Al powder instead of foil.The phase composition of the reaction layer after bonding was almost the same as that shown in the third open case), and the high temperature strength of the bonded body was also excellent.
以上述べた本発明によれば、金属材の強度劣化が問題に
なるような高温としなくてもセラミックと金属の接合が
可能となり、しかも得られる接合体は６００〜７５０℃
という高温度領域で使用し得る強度を有するものである
。According to the present invention described above, it is possible to bond ceramic and metal without the need for high temperatures that would cause strength deterioration of the metal material, and the resulting bonded body can be heated to temperatures of 600 to 750°C.
It has the strength to be used in a high temperature range.
このようなことから９本発明は、６００〜７５０℃の温
度で、しかも金属材料では耐えられないような腐食環境
、例えばバナジウムアタックや硫酸ナトリウムなどの低
融点酸化物ζこよる高温腐食が問題になるような環境で
使われる構造物１部品等や、高温の摩耗が問題となるよ
うな機械部品等化セラミックを使用することを実質的に
可能ならしめるものである。For these reasons, 9 the present invention is designed to handle corrosion environments at temperatures of 600 to 750°C that metal materials cannot withstand, such as vanadium attack and high-temperature corrosion caused by low-melting-point oxides such as sodium sulfate. This makes it practically possible to use equalizing ceramic for parts of structures that are used in environments where high temperature wear is a problem, or for mechanical parts where high-temperature wear is a problem.
第１図は本発明法の工程例を示す説明図である・第２図
は本発明法により得られた接合体の層高方向における成
分分布を示す説明図である。第３図（＆）及び（ｂ）は
実施側番こおいて得られた接合体の断面構造を示すもの
で、同図（ａ）は固相拡散接合後の構造、同図（ｂ）は
拡散熱処理後の構造を示す。第４図は同じ〈実施例で得
られた接合体の引張り強さを従来法により得られたもの
と比較して示すものである。
特許出願人 日本鋼管株式会社
第 ２ 図
距離
第３閃
（ａ） （ｂ）第
４ 図
１友（０Ｃ）
第５図
託難FIG. 1 is an explanatory diagram showing a process example of the method of the present invention. FIG. 2 is an explanatory diagram showing the component distribution in the layer height direction of a bonded body obtained by the method of the present invention. Figures 3 (&) and (b) show the cross-sectional structure of the bonded body obtained in the actual process. Figure 3 (a) is the structure after solid-phase diffusion bonding, and Figure 3 (b) is The structure after diffusion heat treatment is shown. FIG. 4 shows the tensile strength of the bonded body obtained in the same Example in comparison with that obtained by the conventional method. Patent applicant Nippon Kokan Co., Ltd. Figure 2 Distance 3rd flash (a) (b)
4 Figure 1 Friend (0C) Figure 5 Entrustment
Claims (2)
らなる接合用インサート部材を介在させて接合するセラ
ミックと金属の接合方法において、接合用インサート部
材と金属材との間に、Ｎｉ、Ｔｉ、Ｃｏ、Ｖ、またはＷ
若しくはこれら金属の１種または２種以上を含む合金か
らなる中間部材を介在させ、固相拡散接合及びその後必
要に応じて行われる拡散熱処理により接合用インサート
部材のＡｌの少なくとも一部と中間部材を構成するＮｉ
、Ｔｉ、Ｃｏ、Ｖ及びＷの１種または２種以上とにより
金属間化合物を形成させることを特徴とするセラミック
と金属の接合方法。(1) In a ceramic-to-metal joining method in which a metal material and a ceramic are joined by interposing a joining insert member made of Al or an Al alloy, Ni, Ti, Co, V, or W
Alternatively, an intermediate member made of an alloy containing one or more of these metals is interposed, and at least a portion of the Al of the joining insert member and the intermediate member are bonded by solid-phase diffusion bonding and subsequent diffusion heat treatment as necessary. Constituent Ni
, Ti, Co, V and W to form an intermetallic compound.
を施した部材を用い、該ＡｌまたはＡｌ合金コーティン
グ層を接合用インサート部材とすることを特徴とする特
許請求の範囲（１）記載のセラミックと金属の接合方法
。(2) A ceramic-metal bonding method according to claim (1), characterized in that a member coated with Al or Al alloy is used as the intermediate member, and the Al or Al alloy coating layer is used as a bonding insert member. Joining method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2783586A JPS62187183A (en) | 1986-02-13 | 1986-02-13 | Method of joining ceramic to metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2783586A JPS62187183A (en) | 1986-02-13 | 1986-02-13 | Method of joining ceramic to metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62187183A true JPS62187183A (en) | 1987-08-15 |
Family
ID=12231990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2783586A Pending JPS62187183A (en) | 1986-02-13 | 1986-02-13 | Method of joining ceramic to metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62187183A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115879A (en) * | 1987-10-27 | 1989-05-09 | Yasuhide Minonishi | Conjugate form made from ceramics and metal |
| US10184877B2 (en) | 2012-05-17 | 2019-01-22 | Sony Corporation | Sample feeding apparatus, flow cytometer, and sample feeding method |
-
1986
- 1986-02-13 JP JP2783586A patent/JPS62187183A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115879A (en) * | 1987-10-27 | 1989-05-09 | Yasuhide Minonishi | Conjugate form made from ceramics and metal |
| US10184877B2 (en) | 2012-05-17 | 2019-01-22 | Sony Corporation | Sample feeding apparatus, flow cytometer, and sample feeding method |
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