JPS62213957A - デイスク基板の研摩装置 - Google Patents

デイスク基板の研摩装置

Info

Publication number
JPS62213957A
JPS62213957A JP5608286A JP5608286A JPS62213957A JP S62213957 A JPS62213957 A JP S62213957A JP 5608286 A JP5608286 A JP 5608286A JP 5608286 A JP5608286 A JP 5608286A JP S62213957 A JPS62213957 A JP S62213957A
Authority
JP
Japan
Prior art keywords
disk substrate
tape
polishing
grinding
pressure head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5608286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558868B2 (enrdf_load_stackoverflow
Inventor
Tsuneo Morita
森田　宜夫
Yasunori Fukuyama
福山　保則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP5608286A priority Critical patent/JPS62213957A/ja
Publication of JPS62213957A publication Critical patent/JPS62213957A/ja
Publication of JPH0558868B2 publication Critical patent/JPH0558868B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Optical Record Carriers (AREA)
JP5608286A 1986-03-15 1986-03-15 デイスク基板の研摩装置 Granted JPS62213957A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5608286A JPS62213957A (ja) 1986-03-15 1986-03-15 デイスク基板の研摩装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5608286A JPS62213957A (ja) 1986-03-15 1986-03-15 デイスク基板の研摩装置

Publications (2)

Publication Number Publication Date
JPS62213957A true JPS62213957A (ja) 1987-09-19
JPH0558868B2 JPH0558868B2 (enrdf_load_stackoverflow) 1993-08-27

Family

ID=13017161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5608286A Granted JPS62213957A (ja) 1986-03-15 1986-03-15 デイスク基板の研摩装置

Country Status (1)

Country Link
JP (1) JPS62213957A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632547B2 (en) * 2000-03-02 2003-10-14 Fuji Electric Co., Ltd. Substrate for magnetic recording medium, manufacturing method thereof, and magnetic recording medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632547B2 (en) * 2000-03-02 2003-10-14 Fuji Electric Co., Ltd. Substrate for magnetic recording medium, manufacturing method thereof, and magnetic recording medium

Also Published As

Publication number Publication date
JPH0558868B2 (enrdf_load_stackoverflow) 1993-08-27

Similar Documents

Publication Publication Date Title
JP2674730B2 (ja) 半導体ウエハを平面化する装置及び方法、及び研磨パッド
US8152598B2 (en) Substrate treating method and substrate treating apparatus
JPH0221420A (ja) 磁気ディスク基板研磨組立体
JPH081494A (ja) ウエハー材縁端部研磨装置
JPS62213957A (ja) デイスク基板の研摩装置
JP2004114164A (ja) 基板の表面平滑化装置および方法
JP4289764B2 (ja) テープ研磨装置
JPH04214223A (ja) ディスク形ワークに円形パターンを付ける仕上げ装置
WO2021044735A1 (ja) 研磨装置
JP2001155331A (ja) 磁気ディスク用基板およびその研磨方法
JPS60151838A (ja) 磁気記録媒体の製造方法
JPH0615557A (ja) スタンパーの研磨方法
JP4289763B2 (ja) テープ研磨装置
JPH09155728A (ja) 平面研磨方法
JPS61203259A (ja) 微小突起研磨方法
JPS62213955A (ja) デイスク基板の研摩装置
JPS58181561A (ja) 研磨装置
JP3139075B2 (ja) ディスク研磨装置
JP2001347445A (ja) テープ研磨装置
JPH06246621A (ja) 両面研磨装置
JPH02131854A (ja) 磁気ヘッドラッピング装置
JP2568276B2 (ja) 磁気ヘッドテープ摺動面の研磨方法及び装置
JPS59110546A (ja) 研磨ヘツド
JPH1177497A (ja) 半導体ウエハの両面研削方法及び両面研削装置
WO2023171312A1 (ja) 基板研磨方法