JPS62212390A - 新規なポリイミド - Google Patents

新規なポリイミド

Info

Publication number
JPS62212390A
JPS62212390A JP5330286A JP5330286A JPS62212390A JP S62212390 A JPS62212390 A JP S62212390A JP 5330286 A JP5330286 A JP 5330286A JP 5330286 A JP5330286 A JP 5330286A JP S62212390 A JPS62212390 A JP S62212390A
Authority
JP
Japan
Prior art keywords
polyimide
resins
formulas
tables
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5330286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0586793B2 (enrdf_load_stackoverflow
Inventor
Kaoru Kanayama
薫 金山
Shoji Yoshino
吉野　昭治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP5330286A priority Critical patent/JPS62212390A/ja
Publication of JPS62212390A publication Critical patent/JPS62212390A/ja
Publication of JPH0586793B2 publication Critical patent/JPH0586793B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP5330286A 1986-03-11 1986-03-11 新規なポリイミド Granted JPS62212390A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5330286A JPS62212390A (ja) 1986-03-11 1986-03-11 新規なポリイミド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5330286A JPS62212390A (ja) 1986-03-11 1986-03-11 新規なポリイミド

Publications (2)

Publication Number Publication Date
JPS62212390A true JPS62212390A (ja) 1987-09-18
JPH0586793B2 JPH0586793B2 (enrdf_load_stackoverflow) 1993-12-14

Family

ID=12938930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5330286A Granted JPS62212390A (ja) 1986-03-11 1986-03-11 新規なポリイミド

Country Status (1)

Country Link
JP (1) JPS62212390A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01252634A (ja) * 1987-12-10 1989-10-09 Toshiba Corp ポリイミド樹脂及びその製造方法
JPH02238023A (ja) * 1989-03-13 1990-09-20 Mitsubishi Petrochem Co Ltd 熱硬化性樹脂溶液
JP2006526014A (ja) * 2003-05-05 2006-11-16 アドバンスト アプライド アドヘッシブズ イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
JP2009544768A (ja) * 2006-07-21 2009-12-17 スリーエム イノベイティブ プロパティズ カンパニー 異方性の導電性接着剤組成物
US9278909B2 (en) 2003-05-05 2016-03-08 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
WO2018016530A1 (ja) * 2016-07-20 2018-01-25 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01252634A (ja) * 1987-12-10 1989-10-09 Toshiba Corp ポリイミド樹脂及びその製造方法
JPH02238023A (ja) * 1989-03-13 1990-09-20 Mitsubishi Petrochem Co Ltd 熱硬化性樹脂溶液
JP2006526014A (ja) * 2003-05-05 2006-11-16 アドバンスト アプライド アドヘッシブズ イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
JP2014194021A (ja) * 2003-05-05 2014-10-09 Designer Molecules Inc イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
US9278909B2 (en) 2003-05-05 2016-03-08 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
JP2009544768A (ja) * 2006-07-21 2009-12-17 スリーエム イノベイティブ プロパティズ カンパニー 異方性の導電性接着剤組成物
WO2018016530A1 (ja) * 2016-07-20 2018-01-25 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
CN109476901A (zh) * 2016-07-20 2019-03-15 日立化成株式会社 树脂组合物、带树脂层的支撑体、预浸渍体、层叠板、多层印刷线路板及毫米波雷达用印刷线路板
JPWO2018016530A1 (ja) * 2016-07-20 2019-05-09 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
EP3489300A4 (en) * 2016-07-20 2020-02-26 Hitachi Chemical Company, Ltd. RESIN COMPOSITION, MEDIUM WITH RESIN LAYER, PRE-IMPREGNATED, LAMINATE PLATE, MULTI-LAYER PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD FOR MILLIMETER WAVE RADAR
US10907029B2 (en) 2016-07-20 2021-02-02 Showa Denko Materials Co., Ltd. Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
TWI733861B (zh) * 2016-07-20 2021-07-21 日商昭和電工材料股份有限公司 樹脂組成物、帶樹脂層支撐體、預浸體、積層板、多層印刷配線板及其應用、毫米波雷達用印刷配線板
CN113337117A (zh) * 2016-07-20 2021-09-03 昭和电工材料株式会社 树脂组合物、支撑体、预浸渍体、层叠板、多层印刷线路板及毫米波雷达用印刷线路板
JP2022140464A (ja) * 2016-07-20 2022-09-26 昭和電工マテリアルズ株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
TWI790649B (zh) * 2016-07-20 2023-01-21 日商昭和電工材料股份有限公司 樹脂組成物、帶樹脂層支撐體、預浸體、積層板、多層印刷配線板及其應用、毫米波雷達用印刷配線板

Also Published As

Publication number Publication date
JPH0586793B2 (enrdf_load_stackoverflow) 1993-12-14

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