JPS62211990A - Structure of land for soldering parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] This is a structure of a land for soldering components in a thick film hybrid integrated circuit, in which a plurality of dielectric protrusions are provided on a substrate and a conductive layer is formed on the protrusions. , the film thickness of the conductor layer is ensured, and reliable soldering is possible.

[Industrial application field]

The present invention relates to improvements in lands for soldering components in thick film hybrid integrated circuits.

[Conventional technology]

Conventionally, lands for soldering components in thick film hybrid integrated circuits are formed by printing and drying a thick film paste on a substrate (for example, an alumina substrate), and then baking it.

[Problem that the invention seeks to solve]

In general, the relationship between pattern width and film thickness for thick films is as shown in Figure 3. The film thickness has its maximum value when the pattern width is approximately 0.5 scale, and if the pattern width is narrow, If the ink does not flow well and the pattern width is wide, the ink will be scraped off by the squeegee and both will become thin. For this reason, a wide pattern used as a component soldering land will have a thin film thickness if it is formed simultaneously with a wiring pattern. On the other hand, the diffusion phenomenon between the solder and the conductor during soldering is a well-known phenomenon, and as this diffusion progresses, the strength of the adhesion decreases. For these reasons, conventional lands for soldering components, especially those with large land dimensions, have a drawback in that the film thickness is thin and the connection reliability is low.

The present invention was created in view of these points Kfi, and an object of the present invention is to provide a structure of a component soldering land that has a simple configuration and high reliability.

[Means for solving problems]

Therefore, in the present invention, in the structure of a component soldering land in a thick film hybrid integrated circuit, a conductor layer 3 is formed on a plurality of dielectric protrusions 2 provided on the substrate 1. It is characterized by being formed.

[For production]

Since the screen is held by the protrusions of the dielectric during screen printing, ink scraping and smearing caused by the squeegee is prevented, and the thickness of the conductor layer can be ensured.

〔Example〕

FIG. 1 is a diagram showing an embodiment of the present invention. In the figure, 1 is a substrate, 2 is a protrusion made of dielectric material, and 3 is a conductor.

In this embodiment, as shown in FIG. 1, a plurality of dielectric protrusions 2 are provided on a portion of a substrate 1 that will become a land, and a conductive layer 3 is formed on the protrusions 2. In this embodiment configured as described above, the presence of the dielectric projections 2 allows the screen to be held by the projections 2 during thick film paste printing, so there is less scraping of ink by the squeegee. Also, the thickness of the conductor layer 3 is ensured. Therefore, the reduction in adhesion strength between the substrate 1 and the conductor layer 3 due to the diffusion of the solder and the conductor during soldering is reduced, and the connection reliability of the soldered parts of the component is increased.

The relationship between the distance from the dielectric protrusion 2 of the conductor layer 3 and the film thickness is as shown in Fig. 2. Since the distance j can be up to about 0.5 mm, the interval between the protrusions 2 should be 1 tap root degree or less. good.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to ensure the film thickness of the conductor layer of the soldering land in a thick film hybrid integrated circuit with an extremely simple configuration, and it is extremely useful in practice. be.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a diagram showing the relationship between the distance from the dielectric protrusion of the conductor layer and the film thickness, and FIG. 3 is a diagram showing the relationship between the pattern width and the film thickness of the conductor layer. FIG. In FIG. 1, 1 is a substrate, 2 is a dielectric projection, and 3 is a conductor layer. Figure 1 illustrating an embodiment of the present invention Figure 1: Substrate 3: Distance B (mm) from the conductor layer dielectric Figure showing the relationship between the distance from the dielectric protrusion of the conductor layer and the film thickness

Claims (1)

[Claims] 1. Structure of a land for soldering components in a thick film hybrid integrated circuit, wherein the land is formed on a plurality of dielectric protrusions (2) provided on a substrate (1). A structure of a land for soldering components, characterized in that a conductor layer (3) is formed on the land.