JPS6220695B2 - - Google Patents

Info

Publication number
JPS6220695B2
JPS6220695B2 JP7864182A JP7864182A JPS6220695B2 JP S6220695 B2 JPS6220695 B2 JP S6220695B2 JP 7864182 A JP7864182 A JP 7864182A JP 7864182 A JP7864182 A JP 7864182A JP S6220695 B2 JPS6220695 B2 JP S6220695B2
Authority
JP
Japan
Prior art keywords
probe card
adapter
probe
prober
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7864182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58196029A (ja
Inventor
Toshimi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7864182A priority Critical patent/JPS58196029A/ja
Publication of JPS58196029A publication Critical patent/JPS58196029A/ja
Publication of JPS6220695B2 publication Critical patent/JPS6220695B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP7864182A 1982-05-11 1982-05-11 プロ−ブカ−ド切替装置 Granted JPS58196029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7864182A JPS58196029A (ja) 1982-05-11 1982-05-11 プロ−ブカ−ド切替装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7864182A JPS58196029A (ja) 1982-05-11 1982-05-11 プロ−ブカ−ド切替装置

Publications (2)

Publication Number Publication Date
JPS58196029A JPS58196029A (ja) 1983-11-15
JPS6220695B2 true JPS6220695B2 (enrdf_load_stackoverflow) 1987-05-08

Family

ID=13667485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7864182A Granted JPS58196029A (ja) 1982-05-11 1982-05-11 プロ−ブカ−ド切替装置

Country Status (1)

Country Link
JP (1) JPS58196029A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263647A (ja) * 1986-05-12 1987-11-16 Tokyo Electron Ltd ウエハプロ−バ
JP2547406B2 (ja) * 1987-01-21 1996-10-23 東京エレクトロン株式会社 多品種測定装置
JPS63185038A (ja) * 1987-01-27 1988-07-30 Nec Yamagata Ltd 半導体用プロ−ビング装置
JP2726899B2 (ja) * 1988-06-27 1998-03-11 東京エレクトロン株式会社 プローブ装置
US5621313A (en) * 1993-09-09 1997-04-15 Tokyo Seimitsu Co., Ltd. Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers

Also Published As

Publication number Publication date
JPS58196029A (ja) 1983-11-15

Similar Documents

Publication Publication Date Title
JP3135378B2 (ja) 半導体試験装置
US6072325A (en) Probe device
US3723867A (en) Apparatus having a plurality of multi-position switches for automatically testing electronic circuit boards
JPH09321102A (ja) 検査装置
US4052793A (en) Method of obtaining proper probe alignment in a multiple contact environment
US20050046412A1 (en) Apparatus for the automated testing, calibration and characterization of test adapters
JPS6220695B2 (enrdf_load_stackoverflow)
JPH06151531A (ja) プローブ装置
JPH09107011A (ja) 半導体装置、およびこの半導体装置の位置合わせ方法
JPH05218150A (ja) プローブカード
US6011405A (en) Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer
JP3169900B2 (ja) プローバ
JP2735859B2 (ja) プローバ及びプロービング方法
CN115598493A (zh) 集成电路装置的检测系统、信号源及电源供应装置
JPH0755885A (ja) 電気回路基板の電気特性検査装置
JP2767291B2 (ja) 検査装置
JPS63110744A (ja) プロ−ブ装置
JP2965174B2 (ja) 半導体素子検査装置
JPH03290940A (ja) プロービングマシンのウエハ載置台
JPH02119235A (ja) プローブ装置
JPS59225538A (ja) 半導体装置の検査方法
JPH0399450A (ja) 半導体試験装置
JP2827355B2 (ja) 半導体集積装置およびその検査方法
JPS63292639A (ja) 半導体集積回路装置の測定・検査装置
JP2000183119A (ja) 触針クリーニング機構を備えたプローバ