JPS58196029A - プロ−ブカ−ド切替装置 - Google Patents
プロ−ブカ−ド切替装置Info
- Publication number
- JPS58196029A JPS58196029A JP7864182A JP7864182A JPS58196029A JP S58196029 A JPS58196029 A JP S58196029A JP 7864182 A JP7864182 A JP 7864182A JP 7864182 A JP7864182 A JP 7864182A JP S58196029 A JPS58196029 A JP S58196029A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- cards
- probe card
- adapter
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 235000012431 wafers Nutrition 0.000 abstract description 18
- 238000007689 inspection Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- 241000257465 Echinoidea Species 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7864182A JPS58196029A (ja) | 1982-05-11 | 1982-05-11 | プロ−ブカ−ド切替装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7864182A JPS58196029A (ja) | 1982-05-11 | 1982-05-11 | プロ−ブカ−ド切替装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58196029A true JPS58196029A (ja) | 1983-11-15 |
JPS6220695B2 JPS6220695B2 (enrdf_load_stackoverflow) | 1987-05-08 |
Family
ID=13667485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7864182A Granted JPS58196029A (ja) | 1982-05-11 | 1982-05-11 | プロ−ブカ−ド切替装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58196029A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62263647A (ja) * | 1986-05-12 | 1987-11-16 | Tokyo Electron Ltd | ウエハプロ−バ |
JPS63179267A (ja) * | 1987-01-21 | 1988-07-23 | Tokyo Electron Ltd | 多品種測定装置 |
JPS63185038A (ja) * | 1987-01-27 | 1988-07-30 | Nec Yamagata Ltd | 半導体用プロ−ビング装置 |
JPH028757A (ja) * | 1988-06-27 | 1990-01-12 | Tokyo Electron Ltd | プローブ装置 |
US5621313A (en) * | 1993-09-09 | 1997-04-15 | Tokyo Seimitsu Co., Ltd. | Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers |
-
1982
- 1982-05-11 JP JP7864182A patent/JPS58196029A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62263647A (ja) * | 1986-05-12 | 1987-11-16 | Tokyo Electron Ltd | ウエハプロ−バ |
JPS63179267A (ja) * | 1987-01-21 | 1988-07-23 | Tokyo Electron Ltd | 多品種測定装置 |
JPS63185038A (ja) * | 1987-01-27 | 1988-07-30 | Nec Yamagata Ltd | 半導体用プロ−ビング装置 |
JPH028757A (ja) * | 1988-06-27 | 1990-01-12 | Tokyo Electron Ltd | プローブ装置 |
US5621313A (en) * | 1993-09-09 | 1997-04-15 | Tokyo Seimitsu Co., Ltd. | Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers |
Also Published As
Publication number | Publication date |
---|---|
JPS6220695B2 (enrdf_load_stackoverflow) | 1987-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI432734B (zh) | 於用以測試半導體裝置之系統中分享資源之技術 | |
US3723867A (en) | Apparatus having a plurality of multi-position switches for automatically testing electronic circuit boards | |
JPH09321102A (ja) | 検査装置 | |
US5736850A (en) | Configurable probe card for automatic test equipment | |
JP3135378B2 (ja) | 半導体試験装置 | |
CA2455818C (en) | Testing vias and contacts in integrated circuit fabrication | |
US3848188A (en) | Multiplexer control system for a multi-array test probe assembly | |
JP5613333B2 (ja) | モジュール式プローバおよびこのプローバの運転方法 | |
EP1864145A1 (en) | Active diagnostic interface for wafer probe applications | |
IE970253A1 (en) | Method for testing a plurality of integrated circuits on a¹semiconductor wafer | |
JP3215475B2 (ja) | プローブ装置 | |
US5751151A (en) | Integrated circuit test apparatus | |
JPS58196029A (ja) | プロ−ブカ−ド切替装置 | |
JPH06151531A (ja) | プローブ装置 | |
US6011405A (en) | Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer | |
CN221039309U (zh) | 一种晶圆的测试装置及半导体机台 | |
EP1411363A2 (en) | Prober | |
JP2000097985A (ja) | 間隔が密な試験場所用走査試験機 | |
US6753688B2 (en) | Interconnect package cluster probe short removal apparatus and method | |
CN115598493A (zh) | 集成电路装置的检测系统、信号源及电源供应装置 | |
US20010027547A1 (en) | Automated system for estimating ring oscillator reliability and testing AC response and method of operation thereof | |
WO2005106510A2 (en) | Apparatus for high speed probing of flat panel displays | |
JP2735859B2 (ja) | プローバ及びプロービング方法 | |
JP2000114323A (ja) | 静電破壊試験装置 | |
JP3107798B2 (ja) | 半導体デバイスの検査装置 |