JPS6220692B2 - - Google Patents
Info
- Publication number
- JPS6220692B2 JPS6220692B2 JP56007749A JP774981A JPS6220692B2 JP S6220692 B2 JPS6220692 B2 JP S6220692B2 JP 56007749 A JP56007749 A JP 56007749A JP 774981 A JP774981 A JP 774981A JP S6220692 B2 JPS6220692 B2 JP S6220692B2
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- block
- bonding
- motor
- head frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56007749A JPS57121241A (en) | 1981-01-21 | 1981-01-21 | Capillary up-and-down motion mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56007749A JPS57121241A (en) | 1981-01-21 | 1981-01-21 | Capillary up-and-down motion mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121241A JPS57121241A (en) | 1982-07-28 |
| JPS6220692B2 true JPS6220692B2 (cs) | 1987-05-08 |
Family
ID=11674339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56007749A Granted JPS57121241A (en) | 1981-01-21 | 1981-01-21 | Capillary up-and-down motion mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121241A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01124280U (cs) * | 1988-02-16 | 1989-08-24 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823743B2 (ja) * | 1973-04-02 | 1983-05-17 | 株式会社日立製作所 | ワイヤボンデイングソウチ |
| JPS5329475B2 (cs) * | 1973-09-12 | 1978-08-21 |
-
1981
- 1981-01-21 JP JP56007749A patent/JPS57121241A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01124280U (cs) * | 1988-02-16 | 1989-08-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121241A (en) | 1982-07-28 |
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