JPS62202534A - ワイヤボンデイング用キヤピラリ− - Google Patents
ワイヤボンデイング用キヤピラリ−Info
- Publication number
- JPS62202534A JPS62202534A JP61044964A JP4496486A JPS62202534A JP S62202534 A JPS62202534 A JP S62202534A JP 61044964 A JP61044964 A JP 61044964A JP 4496486 A JP4496486 A JP 4496486A JP S62202534 A JPS62202534 A JP S62202534A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- alumina
- purity
- wire
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61044964A JPS62202534A (ja) | 1986-02-28 | 1986-02-28 | ワイヤボンデイング用キヤピラリ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61044964A JPS62202534A (ja) | 1986-02-28 | 1986-02-28 | ワイヤボンデイング用キヤピラリ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62202534A true JPS62202534A (ja) | 1987-09-07 |
| JPH0316779B2 JPH0316779B2 (enExample) | 1991-03-06 |
Family
ID=12706169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61044964A Granted JPS62202534A (ja) | 1986-02-28 | 1986-02-28 | ワイヤボンデイング用キヤピラリ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62202534A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101754A (ja) * | 1988-10-11 | 1990-04-13 | Hitachi Ltd | ボンディング方法及びボンディング装置 |
-
1986
- 1986-02-28 JP JP61044964A patent/JPS62202534A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101754A (ja) * | 1988-10-11 | 1990-04-13 | Hitachi Ltd | ボンディング方法及びボンディング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0316779B2 (enExample) | 1991-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |