JPS62202528A - 半導体基板の製造方法 - Google Patents

半導体基板の製造方法

Info

Publication number
JPS62202528A
JPS62202528A JP4407986A JP4407986A JPS62202528A JP S62202528 A JPS62202528 A JP S62202528A JP 4407986 A JP4407986 A JP 4407986A JP 4407986 A JP4407986 A JP 4407986A JP S62202528 A JPS62202528 A JP S62202528A
Authority
JP
Japan
Prior art keywords
substrate
resistance
heat treatment
semiconductor substrate
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4407986A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523494B2 (enExample
Inventor
Makiko Wakatsuki
若槻　真紀子
Yoshiaki Matsushita
松下　嘉明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4407986A priority Critical patent/JPS62202528A/ja
Publication of JPS62202528A publication Critical patent/JPS62202528A/ja
Publication of JPH0523494B2 publication Critical patent/JPH0523494B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
JP4407986A 1986-03-03 1986-03-03 半導体基板の製造方法 Granted JPS62202528A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4407986A JPS62202528A (ja) 1986-03-03 1986-03-03 半導体基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4407986A JPS62202528A (ja) 1986-03-03 1986-03-03 半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JPS62202528A true JPS62202528A (ja) 1987-09-07
JPH0523494B2 JPH0523494B2 (enExample) 1993-04-02

Family

ID=12681614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4407986A Granted JPS62202528A (ja) 1986-03-03 1986-03-03 半導体基板の製造方法

Country Status (1)

Country Link
JP (1) JPS62202528A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257723A (ja) * 1986-04-30 1987-11-10 Toshiba Ceramics Co Ltd シリコンウエ−ハの製造方法
JPH04192338A (ja) * 1990-11-22 1992-07-10 Toshiba Corp 絶縁ゲート電界効果トランジスタ
WO1998059347A1 (en) * 1997-06-19 1998-12-30 European Organization For Nuclear Research Neutron-driven element transmuter
KR20010070619A (ko) * 2001-05-28 2001-07-27 류근걸 중성자 변환 도핑을 위한 저항 안정화 열처리 기술
WO2002025716A1 (fr) * 2000-09-20 2002-03-28 Shin-Etsu Handotai Co.,Ltd. Tranche de silicium et son procede de fabrication
WO2002025717A1 (en) * 2000-09-20 2002-03-28 Shin-Etsu Handotai Co.,Ltd. Silicon wafer and silicon epitaxial wafer and production methods therefor
WO2002080277A1 (en) * 2001-03-28 2002-10-10 Nippon Steel Corporation Simox substrate production process and simox substrate
JP2006344823A (ja) * 2005-06-09 2006-12-21 Sumco Corp Ｉｇｂｔ用のシリコンウェーハ及びその製造方法
US8617311B2 (en) 2006-02-21 2013-12-31 Sumco Corporation Silicon single crystal wafer for IGBT and method for manufacturing silicon single crystal wafer for IGBT

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874594A (ja) * 1981-10-26 1983-05-06 Sony Corp 結晶成長方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874594A (ja) * 1981-10-26 1983-05-06 Sony Corp 結晶成長方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257723A (ja) * 1986-04-30 1987-11-10 Toshiba Ceramics Co Ltd シリコンウエ−ハの製造方法
JPH04192338A (ja) * 1990-11-22 1992-07-10 Toshiba Corp 絶縁ゲート電界効果トランジスタ
WO1998059347A1 (en) * 1997-06-19 1998-12-30 European Organization For Nuclear Research Neutron-driven element transmuter
EP1326270A4 (en) * 2000-09-20 2007-07-18 Shinetsu Handotai Kk SILICON WAFER AND SILICON EPITAXIAL WAFER AND METHOD OF MANUFACTURING THEREOF
WO2002025716A1 (fr) * 2000-09-20 2002-03-28 Shin-Etsu Handotai Co.,Ltd. Tranche de silicium et son procede de fabrication
WO2002025717A1 (en) * 2000-09-20 2002-03-28 Shin-Etsu Handotai Co.,Ltd. Silicon wafer and silicon epitaxial wafer and production methods therefor
JP2002100631A (ja) * 2000-09-20 2002-04-05 Shin Etsu Handotai Co Ltd シリコンウエーハおよびシリコンエピタキシャルウエーハならびにこれらの製造方法
US6858094B2 (en) 2000-09-20 2005-02-22 Shin-Etsu Handotai Co., Ltd. Silicon wafer and silicon epitaxial wafer and production methods therefor
US7147711B2 (en) 2000-09-20 2006-12-12 Shin-Etsu Handotai Co., Ltd. Method of producing silicon wafer and silicon wafer
KR100786881B1 (ko) * 2000-09-20 2007-12-20 신에쯔 한도타이 가부시키가이샤 실리콘 웨이퍼의 제조방법 및 실리콘 웨이퍼
KR100841062B1 (ko) * 2000-09-20 2008-06-25 신에쯔 한도타이 가부시키가이샤 실리콘 웨이퍼와 실리콘 에피택셜 웨이퍼 및 이들의 제조방법
WO2002080277A1 (en) * 2001-03-28 2002-10-10 Nippon Steel Corporation Simox substrate production process and simox substrate
US6740565B2 (en) 2001-03-28 2004-05-25 Nippon Steel Corporation Process for fabrication of a SIMOX substrate
KR20010070619A (ko) * 2001-05-28 2001-07-27 류근걸 중성자 변환 도핑을 위한 저항 안정화 열처리 기술
JP2006344823A (ja) * 2005-06-09 2006-12-21 Sumco Corp Ｉｇｂｔ用のシリコンウェーハ及びその製造方法
US8617311B2 (en) 2006-02-21 2013-12-31 Sumco Corporation Silicon single crystal wafer for IGBT and method for manufacturing silicon single crystal wafer for IGBT

Also Published As

Publication number Publication date
JPH0523494B2 (enExample) 1993-04-02

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