JPS62192641U - - Google Patents
Info
- Publication number
- JPS62192641U JPS62192641U JP1986081292U JP8129286U JPS62192641U JP S62192641 U JPS62192641 U JP S62192641U JP 1986081292 U JP1986081292 U JP 1986081292U JP 8129286 U JP8129286 U JP 8129286U JP S62192641 U JPS62192641 U JP S62192641U
- Authority
- JP
- Japan
- Prior art keywords
- drain
- pad
- field effect
- effect transistor
- drain electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986081292U JPS62192641U (enExample) | 1986-05-29 | 1986-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986081292U JPS62192641U (enExample) | 1986-05-29 | 1986-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192641U true JPS62192641U (enExample) | 1987-12-08 |
Family
ID=30932896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986081292U Pending JPS62192641U (enExample) | 1986-05-29 | 1986-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192641U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0231438A (ja) * | 1988-07-20 | 1990-02-01 | Hitachi Ltd | 半導体装置の製造方法。 |
| JPH03152944A (ja) * | 1989-11-10 | 1991-06-28 | Oki Electric Ind Co Ltd | 電界効果型トランジスタのワイヤボンディング方法 |
| JP2005303137A (ja) * | 2004-04-14 | 2005-10-27 | Sumitomo Electric Ind Ltd | 横型半導体デバイスの配線構造 |
| JP2010080877A (ja) * | 2008-09-29 | 2010-04-08 | Oki Electric Ind Co Ltd | 半導体装置 |
-
1986
- 1986-05-29 JP JP1986081292U patent/JPS62192641U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0231438A (ja) * | 1988-07-20 | 1990-02-01 | Hitachi Ltd | 半導体装置の製造方法。 |
| JPH03152944A (ja) * | 1989-11-10 | 1991-06-28 | Oki Electric Ind Co Ltd | 電界効果型トランジスタのワイヤボンディング方法 |
| JP2005303137A (ja) * | 2004-04-14 | 2005-10-27 | Sumitomo Electric Ind Ltd | 横型半導体デバイスの配線構造 |
| JP2010080877A (ja) * | 2008-09-29 | 2010-04-08 | Oki Electric Ind Co Ltd | 半導体装置 |