JPH033737U - - Google Patents
Info
- Publication number
- JPH033737U JPH033737U JP1989065136U JP6513689U JPH033737U JP H033737 U JPH033737 U JP H033737U JP 1989065136 U JP1989065136 U JP 1989065136U JP 6513689 U JP6513689 U JP 6513689U JP H033737 U JPH033737 U JP H033737U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- die
- semiconductor chip
- bonded
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989065136U JPH033737U (enExample) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989065136U JPH033737U (enExample) | 1989-06-02 | 1989-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033737U true JPH033737U (enExample) | 1991-01-16 |
Family
ID=31596698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989065136U Pending JPH033737U (enExample) | 1989-06-02 | 1989-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033737U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011080796A (ja) * | 2009-10-05 | 2011-04-21 | Mitsubishi Electric Corp | 半導体素子のパッケージおよびそのテストソケット |
-
1989
- 1989-06-02 JP JP1989065136U patent/JPH033737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011080796A (ja) * | 2009-10-05 | 2011-04-21 | Mitsubishi Electric Corp | 半導体素子のパッケージおよびそのテストソケット |