JPS62192460A - Molding material for sealing - Google Patents
Molding material for sealingInfo
- Publication number
- JPS62192460A JPS62192460A JP3443686A JP3443686A JPS62192460A JP S62192460 A JPS62192460 A JP S62192460A JP 3443686 A JP3443686 A JP 3443686A JP 3443686 A JP3443686 A JP 3443686A JP S62192460 A JPS62192460 A JP S62192460A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing
- molding material
- carbon black
- dye
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 13
- 239000012778 molding material Substances 0.000 title claims abstract description 12
- 239000006229 carbon black Substances 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 239000000945 filler Substances 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000003431 cross linking reagent Substances 0.000 abstract description 2
- 238000000354 decomposition reaction Methods 0.000 abstract description 2
- 238000004455 differential thermal analysis Methods 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000005350 fused silica glass Substances 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 230000000977 initiatory effect Effects 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 239000000975 dye Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- -1 polyphenylene Polymers 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- POFFJVRXOKDESI-UHFFFAOYSA-N 1,3,5,7-tetraoxa-4-silaspiro[3.3]heptane-2,6-dione Chemical compound O1C(=O)O[Si]21OC(=O)O2 POFFJVRXOKDESI-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明の１気部品や゛磁子部品を封止する樹脂モールド
品に主として用いられる封止用成形材料に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a molding material for sealing which is mainly used for resin molded products for sealing single-chip components and magnetic components.
［背景技術］
嘔気、−ｍ子部品を外部環境から保護し、部品の高性能
化、信頼性向上を計るため樹脂による被覆、封止が施さ
れており、近年その生産量は増加しつつある。これらの
部品１ｄ注型、含浸、シール、成形等の方法で封止した
後、製品名、番号等を必要に応じてマーキングすること
が通常行なわれて−る。従来この方法にはインクを用い
た印刷が採用され、近年はＶ−ザービームによるマーキ
ングが採用されつつある。前者の方法１ｄ印刷方法やイ
ンクの乾燥性等からみて能率がやや悪く、特に注型。[Background technology] In order to protect child parts from the external environment and improve their performance and reliability, they are coated and sealed with resin, and the production volume has been increasing in recent years. . After these parts 1d are sealed by methods such as casting, impregnation, sealing, and molding, they are usually marked with product names, numbers, etc., as necessary. Conventionally, printing using ink has been employed for this method, and in recent years, marking using a V-zer beam has been increasingly employed. The former method 1d is somewhat inefficient in terms of printing method and ink drying properties, especially casting.
含浸等で封止された樹脂封止型１子部品の表面１は必ず
しも表面が平滑でなく特に印刷に手［」がかかったりマ
ークが消滅することもあった。後者の方決はマーキング
動車が高すため近年益々研究が盛んである。しかしマー
キングが不鮮明で識別が困難な場合が多かった。史てレ
ーザービームには炭酸ガスレーザーとＹＡＧレーザーの
２種があり、両方のレーザービーム疋対応できる材料が
求められてＡた。The surface 1 of a resin-sealed single-child component sealed by impregnation or the like is not necessarily smooth, and printing may require special care or marks may disappear. The latter option has been increasingly researched in recent years because of the need for marking vehicles. However, the markings were often unclear and difficult to identify. Historically, there have been two types of laser beams: carbon dioxide lasers and YAG lasers, and there has been a need for materials that can handle both types of laser beams.
本発明の目的とするところはマーキング後の識別が容易
で且つ炭酸力゛スレーザーとＹＡＧレーザーの両方に対
応できる樹脂封止型５ｕ子部品の祷られる封止用成形材
料を提供することにある。The purpose of the present invention is to provide a molding material for sealing resin-sealed 5U child parts that is easy to identify after marking and is compatible with both carbon dioxide laser and YAG laser. .
本発明は、カーボンブラックと有機染料とを含有したこ
とを特徴とする封止用成形材料のため、マーキング後の
識別が容易で且つ炭酸ガスレーザー及びＹＡＧレーザー
の両方に対応することができたもので、以下本発明の詳
細な説明する。The present invention is a sealing molding material characterized by containing carbon black and organic dye, which is easy to identify after marking and is compatible with both carbon dioxide laser and YAG laser. The present invention will now be described in detail.
本発明に用いるカーボンブラックと有機染料は特に限定
するものではないが、好ましくけ示差熱分析における分
解開始点が３００℃以上のものであることが識別の明確
さ及びレーザ一対応性の点で望ましく、更にカーボンブ
ラックと有機染料の改が全体量の０．０１〜１０重１ｔ
４（以下朧に憾と記す）であることが好ましす、即ち０
．＋１１１１未満では識別の明確さが不充分となる傾向
にあり、ｔｏ ４をこえると封止用成形材料としての・
慮気絶縁性、容着性、耐湿性等が低下する傾向にあるか
らである。カーボンブラックと有機染料との併用比率は
特に限定するものではない。封止用成形材料の樹脂とし
ては、フェノール樹脂、エポキシ樹脂、不飽和ポリエス
テル樹脂、ジアリルフタレート樹脂、アクリル樹脂、ポ
リイミＦ樹脂、ポリ丁ミド樹脂、ポリアミドイミド樹脂
、ポリスルフォン樹脂、ポリフェニレンサルファイド樹
脂、ポリフェニレンオキサイド樹脂、ポリブチレンテレ
フタレート樹脂、ポリエチレンテレフタレート樹脂、弗
ｉ樹脂、シリコン樹脂等の抛独、混合物、変性物のよう
に合成樹脂全般を剛固ることができる。充填剤としては
溶融シリカ、結晶シリカ、ガラス繊維、硅酸カルシウム
、炭酸カルシウム、アルミナ、クレー、二酸化アン千モ
ン、硫酸バリウム、窒化ホウ素、炭酸ケイ素等の熱伝導
性のよい無機充填剤全般を用することができ特に限定す
るものではなりが好ましくは粒子径２００ミクロン以下
であることが望ましい、樹脂、カーボンブラック、染料
、充填剤以外の添加剤としては離型剤、カップリング剤
等に加え、更に必要に応じて架橋剤、硬化剤、硬化促進
剤等を添加し混合、混線、粉砕し更に必要に応じて造粒
して封止用成形材料を得るものである。The carbon black and organic dye used in the present invention are not particularly limited, but it is preferable that the decomposition starting point in differential thermal analysis is 300°C or higher in terms of clarity of identification and laser compatibility. In addition, the amount of carbon black and organic dye added is 0.01 to 10 tons of the total amount.
4 (hereinafter referred to as "Oboro ni wa") is preferable, that is, 0.
．． If it is less than +1111, the clarity of identification tends to be insufficient, and if it exceeds to 4, it cannot be used as a molding material for sealing.
This is because insulation properties, adhesion properties, moisture resistance, etc. tend to deteriorate. The ratio of carbon black and organic dye used in combination is not particularly limited. Resins for molding materials for sealing include phenol resin, epoxy resin, unsaturated polyester resin, diallyl phthalate resin, acrylic resin, polyimide resin, polyimide resin, polyamideimide resin, polysulfone resin, polyphenylene sulfide resin, and polyphenylene. It is possible to harden all synthetic resins such as oxide resins, polybutylene terephthalate resins, polyethylene terephthalate resins, fluorocarbon resins, silicone resins, mixtures, and modified products. As fillers, inorganic fillers with good thermal conductivity such as fused silica, crystalline silica, glass fiber, calcium silicate, calcium carbonate, alumina, clay, ammonium dioxide, barium sulfate, boron nitride, and silicon carbonate are used. Additives other than resins, carbon black, dyes, and fillers, although not particularly limited, preferably have a particle size of 200 microns or less, in addition to mold release agents, coupling agents, etc. Furthermore, a crosslinking agent, a curing agent, a curing accelerator, etc. are added as necessary, and the mixture is mixed, mixed, crushed, and further granulated as necessary to obtain a molding material for sealing.
更に該成形材料の成形につ込ては、トランスファー成形
、射出成形等１（よるトランジスター、ダイオード、コ
ンデンサー、フィルター、整流器、抵抗体、コイル等の
４子部品の多数個取り成形に適することは勿論、圧縮成
形等にも適用できるものである。以下本発明を実施列に
もとづいて詳細に説明する。Furthermore, regarding the molding of the molding material, transfer molding, injection molding, etc.1 (of course, it is suitable for multi-cavity molding of four-piece parts such as transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc.) , compression molding, etc. The present invention will be described in detail below based on examples of implementation.
実施例１乃至３と比較例１及び２
第１表の配合表に従って材料を配合、混合、混練して封
止用成形材料を得、トランスファー成形機を用Ａて金型
温度１７５℃、成形圧力ｓ ｏ ’ｖ’ｄ−硬化時間３
分の条件で電子部品を射出成形した後、レーザービーム
で品名をレーザーマーキングした。Examples 1 to 3 and Comparative Examples 1 and 2 The materials were blended, mixed, and kneaded according to the recipe in Table 1 to obtain a sealing molding material, which was then molded using a transfer molding machine at a mold temperature of 175°C and a molding pressure. s o 'v'd - curing time 3
After injection molding the electronic parts under the following conditions, the product name was marked with a laser beam.
実施例１乃至３と比較例１及び２の成形品のマーキング
後の識別の容易さとレーザ一対応性及び１６ Ｄ Ｉ
Ｐモデル素子封止成形品の耐湿信頼性は第２表で明白な
ように本発明の封止用成形材料から得られた封止成形品
の性能はよく本発明の優れていることを確認したーEase of identification after marking of molded products of Examples 1 to 3 and Comparative Examples 1 and 2, laser compatibility, and 16 D I
As clearly shown in Table 2, the moisture resistance reliability of the P model element encapsulation molded product was confirmed to be superior to that of the present invention. -
Claims (2)
特徴とする封止用成形材料。(1) A molding material for sealing characterized by containing carbon black and an organic dye.
０１〜１０重量％であることを特徴とする特許請求の範
囲第１項記載の封止用成形材料。(2) The amount of carbon black and organic dye is 0.0% of the total amount.
The molding material for sealing according to claim 1, characterized in that the amount is 01 to 10% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3443686A JPS62192460A (en) | 1986-02-18 | 1986-02-18 | Molding material for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3443686A JPS62192460A (en) | 1986-02-18 | 1986-02-18 | Molding material for sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192460A true JPS62192460A (en) | 1987-08-24 |
Family
ID=12414173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3443686A Pending JPS62192460A (en) | 1986-02-18 | 1986-02-18 | Molding material for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192460A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977514A (en) * | 1997-06-13 | 1999-11-02 | M.A. Hannacolor | Controlled color laser marking of plastics |
| KR20000031972A (en) * | 1998-11-11 | 2000-06-05 | 유현식 | Epoxy resin composition for sealing semiconductor element |
| US6118096A (en) * | 1997-12-16 | 2000-09-12 | M. A. Hannacolor, A Division Of M. A. Hanna Company | Laser marking of phosphorescent plastic articles |
| JP2004156050A (en) * | 1999-09-17 | 2004-06-03 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
| JP2005187787A (en) * | 2003-12-05 | 2005-07-14 | Mitsubishi Engineering Plastics Corp | Black polyamide resin composition for laser beam decoration and black molded article |
| JP2006156674A (en) * | 2004-11-29 | 2006-06-15 | Asahi Kasei Electronics Co Ltd | Semiconductor device and its manufacturing method |
| JP2008081621A (en) * | 2006-09-28 | 2008-04-10 | Mitsubishi Engineering Plastics Corp | Black polybutylene terephthalate resin composition for laser beam decoration, molded article comprised of the same, and laser beam decoration method |
-
1986
- 1986-02-18 JP JP3443686A patent/JPS62192460A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977514A (en) * | 1997-06-13 | 1999-11-02 | M.A. Hannacolor | Controlled color laser marking of plastics |
| US6627299B1 (en) | 1997-06-13 | 2003-09-30 | Polycne Corporation | Controlled color laser marking of plastics |
| US6118096A (en) * | 1997-12-16 | 2000-09-12 | M. A. Hannacolor, A Division Of M. A. Hanna Company | Laser marking of phosphorescent plastic articles |
| US6168853B1 (en) | 1997-12-16 | 2001-01-02 | M.A.Hannacolor, A Division Of M.A. Hanna Company | Laser marking of phosphorescent plastic articles |
| KR20000031972A (en) * | 1998-11-11 | 2000-06-05 | 유현식 | Epoxy resin composition for sealing semiconductor element |
| JP2004156050A (en) * | 1999-09-17 | 2004-06-03 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
| JP2004156052A (en) * | 1999-09-17 | 2004-06-03 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
| JP2004156051A (en) * | 1999-09-17 | 2004-06-03 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
| JP2004211100A (en) * | 1999-09-17 | 2004-07-29 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic component device |
| JP2005187787A (en) * | 2003-12-05 | 2005-07-14 | Mitsubishi Engineering Plastics Corp | Black polyamide resin composition for laser beam decoration and black molded article |
| JP2006156674A (en) * | 2004-11-29 | 2006-06-15 | Asahi Kasei Electronics Co Ltd | Semiconductor device and its manufacturing method |
| JP2008081621A (en) * | 2006-09-28 | 2008-04-10 | Mitsubishi Engineering Plastics Corp | Black polybutylene terephthalate resin composition for laser beam decoration, molded article comprised of the same, and laser beam decoration method |
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