JPS6047065A - Molding resin composition - Google Patents

Abstract

PURPOSE:To obtain a resin compsn. which gives moldings whose surface can be clearly marked by laser beam, by incorporating a specified quantity of an org. black dye in a molding resin compsn. CONSTITUTION:0.05-3.0wt% (based on the quantity of the entire compsn.) org. black dye is incorporated in a resin comp. for use in producing moldings whose surface is to be marked by laser beam. Examples of the resins are thermosetting resins, particularly epoxy resins. Preferred org. black dyes include metal-contg. azo dyes, among which monoazo dyes are particularly preferred. When the compsn. is a thermosetting resin compsn., particularly epoxy resin compsn., it contains usually a hardener, a curing accelerator, a filler and optionally a flame retarder, a pigment, a silane coupling agent, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin composition which provides a resin molding whose surface is clearly marked by a laser.

In recent years, electronic products such as semiconductor devices are sealed with epoxy resin J resin, etc. When marking the surface of a molded product of a secondary CIS device, laser light generated from a laser oscillator is used. In some cases, it has been put into practical use to pass through a die-cutting mask, place the original material on the molded product, and then apply markings according to J')'r. This marking method uses the energy of Ray → No-Heam to destroy the surface roti JFl to a depth of Vμ, roughen the surface, and roughen the surface. It is electrophilically recognized as a marking by the contrast of the surface properties of L-'jJ' L1 In conventional molded products, the contrast between this l Therefore, there is a problem that the markings are not clearly visible.This tendency is particularly noticeable when the molded product is colored such as white, gray, or black, and in a relatively dark atmosphere.

The present invention is a Noh novel based on the above,
It is an object of the present invention to provide a thermosetting resin composition for molding that can produce resin molded articles in which markings according to Ray→F'=ljl are clearly visible even in a relatively dark atmosphere.

That is, the present invention is characterized in that a resin composition for a resin molded article whose surface is marked with a laser contains 0.05 to 3.0% by weight of a black organic dye based on the total composition. This invention relates to resin compositions for molding.

The resins constituting the resinous acid include thermosetting resins,
Particular mention may be made of epoxy resins.

Contains fillers and mold release agents, and if necessary, flame retardants,
Contains pigments, Shirishika tumbling agents, etc.

Conventionally, epoxy resin compositions contain metal oxides and pigments as pigments.
Inorganic pigments such as ferrocyanide and carbon black were used to cause damage, but in molded products obtained from such compositions, there was no contrast between the fractured and non-destructed parts of the surface of the molded product caused by the racer, and markings were caused. However, according to the present invention, when the resin composition contains 0.05 to 3.0% by weight of a black organic dye, the surface properties of the destroyed part and the non-destructed part of the marking by Ray →) Knee can be clearly seen. The contrast becomes clearer, and -king is clearly recognized. The marking is particularly attractive and clear when the black organic dye accounts for 0.1 to 1.0% by weight based on the total composition.

When the black organic dye is less than 0.05%, the contrast between the destroyed and non-destructive parts is not clear, whereas when it is contained more than 3-0%, the reliability of the encapsulated UJ manufactured by the Electronics Department increases. B. Ignore drawbacks such as reduced soil (moisture resistance).

The black organic dye used in the present invention 3 [as a binder (d is preferably an aso-based metal-containing dye; as an azo dye [vL is preferably a monoazo-based dye] 1; as the metal component contained in the dye; Copper, potassium, sodium, chromium, cobalt, etc. can be used, but button and chromium are particularly preferred.

The content of the above-mentioned dyes is 1 to 0.001 to 20%.

Furthermore, the melting point of the dye is over 100°C, and the decomposition temperature is 200°C.
The above is desirable. Moreover, as the black organic dye, an oil-soluble dye is preferable.

In addition, in the present invention, nu is black 1'! - When using a dye, carbon black, titanium white (titanium oxide), etc., which are conventionally added to resin compositions, may be used.

When preparing the pine resin composition for molding of the present invention, especially an epoxy resin composition, the inorganic filler is contained in an amount of 50 to 50% based on the total composition.
Examples of the O2-free 4XA filler, which is generally used in an amount of 85% by weight, include crystalline silica, amorphous silica, alumina, glass fiber, mica, talc, clay, and the like.

The inorganic filler preferably has a particle size of 149 μm.
0.5 gravity t% or less, 46μ or less is 60-95
It has a particle size distribution in which the particle size is 40 to 70%, 10 μm or less, and 15 to 40 3 μm or less.

In addition to the curing agent and curing accelerator as described above, the composition of the present invention may also contain a flame retardant, a mold release agent, a pigment, a silane coupling agent, etc., as necessary.

In the present invention, as the resin, epoxy resin is preferably used, but phenol resin, original resin, melamine resin, polyester resin, diallyl phthalate resin,
Polyphenylene sulfide and the like are also used.4 It goes without saying that compositions containing these resins contain necessary additives depending on the resin.

Examples of the laser include a carbon dioxide gas laser, a semiconductor laser, and a YAG laser.

In the present invention, the intensity of the laser irradiated to the resin molded article is usually an energy density of 0.2 to 0.5 joule/c.
It is J.

The present invention will be explained below with reference to Examples.

Examples 1 to 7, Comparative Examples 1 and 2 16.0 parts of epoxy resin (220 per epoxy, cresol noholic type IJA resin with a softening point of 77°C) Brominated epoxy resin (275 g per epoxy, with a softening point of 80°C) Flame retardant resin) 2.5 parts Phenol novolac resin (phenol 105% softening point 75°C) 8.0 parts Curing agent (2-'methylimidazole) 0.4 parts Flame retardant (
Antimony trioxide), 1.8 parts Mold release agent (carnauba wax) 0.5 parts Silane coupling agent (Igl A-187, manufactured by Unicar) 0.5 parts Black organic dye (shown in Table 1 below) Inorganic filler (shown in Table 1 below) When preparing the epoxy resin composition for molding with the above composition, the flame retardant and inorganic filler are treated with a silane coupling agent, and then the remaining material is treated with the silane coupling agent. In addition, the mixture was ground and mixed, then mixed for 10 minutes using a mixing roll heated to 80°C, formed into a sheet, cooled, and ground to obtain a resin powder. This molding powder was molded into a disk with a diameter of 50 mm and a thickness of 5 mm with a matte finish with a surface roughness of 12 μm using a transfer machine to prepare a molded product sample for marking (molding conditions: 175°C, 2 minutes). , transfer pressure 90 kg/cti and post-curing 175°C, 1011 ju)
Type laser mark, energy density maximum 0.4 Jou
The surface of the molded product was marked by irradiating the laser with a predetermined mask 311j for 1/1 millionth of a second.

The results are also listed in Table 1.

Examples 8 to 14 and Comparative Example 3 Bisphenol type epoxy a fat 25.7 parts (Epoxy 450, softening point 45°C) Diaminodiphenylmethane 3.0 parts Mold release agent (stearic acid) 0.5 parts Silane coupling agent 0.5 parts (KBM403 manufactured by Shin-Etsu Silicone Co., Ltd.) W color organic dye
(Showed in Table 2) Inorganic filler (Showed in Table 2) Using the composition shown in Table 2 above, a molded article sample for marking was prepared according to the method of Example 1, and a molded article sample was further prepared according to the same method. Markings were applied to the surface.

The results are also listed in Table 2.

As is clear from Tables 1 and 2, the molded articles obtained using the molding resin composition of the present invention were as follows.

Both the brightness and color difference of markings measured using an 8M color computer (Suga Test Instruments Co., Ltd.) are superior to conventional products.

As described above, molded products obtained using the resin composition of the present invention have excellent marking properties with a laser. Therefore, this resin composition can be used to produce resin-sealed semiconductor devices, resistive element molded bodies, etc. that require marking. resin-sealed capacitor,
It can be advantageously used in manufacturing capacitors and the like.

patent applicant Nitto Electric Industry Co., Ltd. Representative: 3rd Department

Claims (1)

[Scope of Claims] (1) In a resin composition for a resin molded article whose surface is marked by dyeing and dyeing, a black organic dye is added in an amount of 0.05 to 3.0% based on the entire composition. Claim 1, characterized in that the resin (2) for nM type &1 resin composition is an epoxy resin, characterized in that it contains % heavy air.
The molding resin composition described in . (3) Claim No. 1 in which the black organic dye is an azo yarn-containing compound] Ji!叉i':, L l'52 ],
Ll hg%: ノLjk, JP,? , resin composition for use.