JPS621656B2 - - Google Patents
Info
- Publication number
- JPS621656B2 JPS621656B2 JP58156057A JP15605783A JPS621656B2 JP S621656 B2 JPS621656 B2 JP S621656B2 JP 58156057 A JP58156057 A JP 58156057A JP 15605783 A JP15605783 A JP 15605783A JP S621656 B2 JPS621656 B2 JP S621656B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- laser
- resin
- resin composition
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 239000011256 inorganic filler Substances 0.000 claims description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000000975 dye Substances 0.000 description 19
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
本発明は樹脂組成物に関し、詳しくは、レーザ
ーによりその表面に鮮明にマーキングされる樹脂
成形物を与える樹脂組成物に関する。
近年、半導体素子等の電子部品をエポキシ樹脂
等で封止してなる電子部品装置の成形物表面にマ
ーキングする場合に、レーザー発振器から発生す
るレーザー光を、型抜きしたマスクを通し、その
光像を前記成形物上に集束して、所定のマーキン
グを施すことが一部で実用化されている。このマ
ーキング方式はレーザービームのエネルギーによ
り成形物表面層を数μの深さに破壊して、表面を
粗面化し、この破壊部と非破壊部の表面性状の対
比によつてマーキングとして視覚的に認識させる
ものである。しかし、従来の成形物においては、
この破壊部と非破壊部の対比が必ずしも良好でな
く、従つて、マーキングが鮮明に見えない問題が
ある。特に、成形品が白色、灰色、黒色等の有色
の場合、及び比較的暗い雰囲気下でこの傾向が著
しい。
本発明は上記に鑑みてなされたものであつて、
比較的暗い雰囲気下でも、レーザーによるマーキ
ングが明瞭に見える樹脂成形品を与える成形用熱
硬化性樹脂組成物を提供することを目的とする。
即ち本発明は、レーザーによりその表面にマー
キングが施される樹脂成形物用のエポキシ樹脂組
成物において、全組成物基準で無機質充填剤を50
〜85重量%、アゾ系の含金属化合物からなる黒色
有機染料を0.05〜3.0重量%含有することを特徴
とする成形用樹脂組成物に関するものである。
本発明の樹脂組成物には、エポキシ樹脂ととも
に無機質充填剤および前記特定の黒色有機染料を
含むほか、通常硬化剤や硬化促進剤が含まれ、さ
らに必要に応じて離型剤、難燃剤、顔料、シラン
カツプリング剤などが含有されている。従来、エ
ポキシ樹脂組成物には顔料として金属酸化物、フ
エロシアン化物等の無機顔料、カーボンブラツク
が用いられていたが、かかる組成物から得られる
成形品ではレーザーによる成形品表面の破壊部と
非破壊部との対比が鮮明でなく、マーキングが明
瞭に見えない。
しかし、本発明に従つて、樹脂組成物が前記特
定の黒色有機染料を0.05〜3.0重量%含有すると
き、レーザーによるマーキングの破壊部と非破壊
部との表面性状の対比が鮮明となり、マーキング
が明瞭に認められる。特に黒色有機染料が全組成
物基準で0.1〜1.0重量%を占めるときにマーキン
グが著しく鮮明である。
黒色有機染料が0.5重量%以下のときには破壊
部と非破壊部の対比が鮮明でなく、一方3.0重量
%以上含有すると樹脂封止された電子部品装置の
信頼性(耐湿性)が低下する等の欠点を有する。
本発明で用いる黒色有機染料とは、アゾ系の含
金属化合物からなるもの、つまりアゾ系含金属染
料である。アゾ系の染料としてはモノアゾ系の染
料が好適である。
前記染料中に含まれる金属成分としては、銅、
カリウム、ナトリウム、クロム、コバルト等を挙
げることができるが、特には銅、クロムが好適で
ある。
また前記染料の金属含有率は0.01〜20重重%と
される。
さらに染料の融点は100℃以上、分解温度200℃
以上のものが望ましい。また黒色有機染料として
は、油溶性染料が好ましい。
なお本発明においては前記黒色有機染料を用い
る場合、カーボンブラツク、チタン白(酸化チタ
ン)等従来樹脂組成物中に添加される顔料を併用
してもよい。
本発明の成形用樹脂組成物は、無機質充填剤
を、全組成物基準で50〜85重量%含有している。
無機質充填剤としては、結晶性シリカ、非晶質
シリカ、アルミナ、ガラス繊維、マイカ、タル
ク、クレー等を挙げることができる。
無機質充填剤としては、好ましくは、粒子径
149μm以上が0.5重量%以下、46μm以下が60〜
95重量%、10μm以下が40〜70重量%及び3μm
以下が15〜40重量%である粒度分布を有する。
また本発明の組成物中には、前記した如く硬化
剤や、硬化促進剤のほかに、必要に応じて難燃
剤、離型剤、顔料、シランカツプリング剤等を含
有してもよい。
またレーザーとしては炭酸ガスレーザー、半導
体レーザー、YAGレーザー等を挙げることがで
きる。
本発明において樹脂成形物に照射されるレーザ
ーの強さは、通常エネルギー密度0.2〜0.5ジユー
ル/cm2である。
以下に実施例を挙げて本発明を説明する。
実施例1〜7、比較例1および2
エポキシ樹脂(エポキシ当量220、
軟化点77℃のクレゾール
ノボラツク型樹脂) 16.0部
ブロム化エポキシ樹脂(エポキシ
当量275、軟化点80℃の
難燃化樹脂) 2.5部
フエノールノボラツク樹脂(フエノール
当量105、軟化点75℃) 8.0部
軟化剤(2−メチルイミダゾール) 0.4部
難燃剤(三酸化アンチモン) 1.8部
離型剤(カルナウバワツクス) 0.5部
シランカツプリング剤(日本ユニカー
社製A−187) 0.5部
黒色有機染料 (下記第1表に示す)
無機質充填剤 (下記第1表に示す)
The present invention relates to a resin composition, and more particularly to a resin composition that provides a resin molded article whose surface can be clearly marked with a laser. In recent years, when marking the surface of a molded product of an electronic component device made by sealing an electronic component such as a semiconductor element with epoxy resin, etc., a laser beam generated from a laser oscillator is passed through a die-cut mask and its optical image is In some cases, it has been put into practical use to focus the above-mentioned molded materials onto the molded product and apply predetermined markings thereon. This marking method uses the energy of a laser beam to destroy the surface layer of the molded product to a depth of several micrometers, roughening the surface, and visually marking it by contrasting the surface texture of the destroyed and undestructed parts. It is something that makes you aware. However, in conventional molded products,
There is a problem that the contrast between the destroyed part and the non-destructed part is not necessarily good, and therefore the marking cannot be clearly seen. This tendency is particularly noticeable when the molded product is colored such as white, gray, or black, and in a relatively dark atmosphere. The present invention has been made in view of the above, and includes:
An object of the present invention is to provide a thermosetting resin composition for molding that provides a resin molded article with clearly visible laser markings even in a relatively dark atmosphere. That is, the present invention provides an epoxy resin composition for a resin molded article whose surface is marked with a laser, containing an inorganic filler of 50% on the basis of the entire composition.
The present invention relates to a molding resin composition characterized in that it contains ~85% by weight and 0.05~3.0% by weight of a black organic dye consisting of an azo metal-containing compound. The resin composition of the present invention contains an inorganic filler and the above-mentioned specific black organic dye together with an epoxy resin, and also usually contains a curing agent and a curing accelerator, and if necessary, a mold release agent, a flame retardant, and a pigment. , silane coupling agent, etc. Conventionally, inorganic pigments such as metal oxides and ferrocyanides, and carbon black have been used as pigments in epoxy resin compositions, but in molded products obtained from such compositions, the laser can cause damage to the surface of the molded product, and The contrast with the parts is not clear and the markings are not clearly visible. However, according to the present invention, when the resin composition contains 0.05 to 3.0% by weight of the above-mentioned specific black organic dye, the contrast between the surface properties of the destroyed part and the non-destructed part of laser marking becomes clear, and the marking becomes clearly recognized. The marking is particularly clear when the black organic dye accounts for 0.1 to 1.0% by weight based on the total composition. When the black organic dye is less than 0.5% by weight, the contrast between the destroyed and non-destructive parts is not clear, while when it is contained more than 3.0% by weight, the reliability (moisture resistance) of the resin-sealed electronic component device is reduced, etc. It has its drawbacks. The black organic dye used in the present invention is one made of an azo metal-containing compound, that is, an azo metal-containing dye. As the azo dye, a monoazo dye is suitable. The metal components contained in the dye include copper,
Examples include potassium, sodium, chromium, cobalt, etc., with copper and chromium being particularly preferred. Further, the metal content of the dye is 0.01 to 20% by weight. Furthermore, the melting point of the dye is over 100℃, and the decomposition temperature is 200℃.
The above is desirable. Moreover, as the black organic dye, an oil-soluble dye is preferable. In the present invention, when the black organic dye is used, pigments conventionally added to resin compositions such as carbon black and titanium white (titanium oxide) may also be used together. The molding resin composition of the present invention contains an inorganic filler in an amount of 50 to 85% by weight based on the total composition. Examples of the inorganic filler include crystalline silica, amorphous silica, alumina, glass fiber, mica, talc, and clay. The inorganic filler preferably has a particle size of
149μm or more is 0.5% by weight or less, 46μm or less is 60~
95% by weight, 40-70% by weight below 10μm, and 3μm
It has a particle size distribution of 15-40% by weight. In addition to the curing agent and curing accelerator as described above, the composition of the present invention may also contain a flame retardant, a mold release agent, a pigment, a silane coupling agent, etc., as necessary. Examples of lasers include carbon dioxide lasers, semiconductor lasers, and YAG lasers. In the present invention, the intensity of the laser irradiated onto the resin molded article is usually an energy density of 0.2 to 0.5 joule/cm 2 . The present invention will be explained below with reference to Examples. Examples 1 to 7, Comparative Examples 1 and 2 Epoxy resin (cresol novolak type resin with epoxy equivalent of 220 and softening point of 77°C) 16.0 parts Brominated epoxy resin (flame-retardant resin with epoxy equivalent of 275 and softening point of 80°C) 2.5 parts phenol novolak resin (phenol equivalent 105, softening point 75°C) 8.0 parts softener (2-methylimidazole) 0.4 parts flame retardant (antimony trioxide) 1.8 parts mold release agent (carnauba wax) 0.5 parts silane cup Ring agent (A-187 manufactured by Nippon Unicar Co., Ltd.) 0.5 parts Black organic dye (shown in Table 1 below) Inorganic filler (shown in Table 1 below)
【表】【table】
【表】
上記の組成の成形用エポキシ樹脂組成物を調製
するに際して、難燃剤と無機質充填剤とをシラン
カツプリング剤で処理した後、残余の材料をこれ
に加えて粉砕混合し、次に80℃に加熱したミキシ
ングロールにて10分間混合し、シート状に成形
し、冷却、粉砕して、樹脂粉末を得た。樹脂粉末
を得た。なお、第1表中、チバガイギー社製の商
品名で表わされる各有機染料は、“MAPICO
BLACK”がフタロシアニン系である以外はすべ
てアゾ系含金属染料である。この成形用粉末をト
ランスフアープレスにて、表面粗さ12μの梨地仕
上げされた径50mm、厚み5mmの円板に成形し、マ
ーキング用成形品試料とした(成形条件−175
℃、2分間、トランスフア圧力90Kg/cm2と後硬化
175℃、10時間)。
この試料に炭酸ガスレーザー(渋谷工業(株)製
920型レーザーマーク、エネルギー密度最大
0.4Joul/cm2)を用いて、100万分の1秒間所定の
マスクを通してレーザーを照射して、成形品表面
にマーキングを施した。
その結果を第1表に併記する。
実施例8〜14および比較例3
ビスフエノール型エポキシ樹脂
(エポキシ当量450、軟化点45℃) 25.7部
ジアミノジフエニルメタン 3.0部
離型剤(ステアリン酸) 0.5部
シランカツプリング剤
(信越シリコーン社製KBM403) 0.5部
黒色有機染料 (第2表に示す)
無機質充填剤 (第2表に示す)[Table] When preparing the epoxy resin composition for molding with the above composition, the flame retardant and inorganic filler are treated with a silane coupling agent, the remaining materials are added thereto, pulverized and mixed, and then 80% The mixture was mixed for 10 minutes using a mixing roll heated to .degree. C., formed into a sheet, cooled, and pulverized to obtain a resin powder. A resin powder was obtained. In addition, in Table 1, each organic dye represented by the product name manufactured by Ciba Geigy is “MAPICO
All dyes are azo-based metal-containing dyes, except for ``BLACK'' which is phthalocyanine-based. This molding powder was molded into a disk with a matte finish of 12 μm in diameter and 5 mm in thickness using a transfer press. Molded product sample for marking (molding conditions −175
℃, 2 minutes, transfer pressure 90Kg/cm 2 and post-curing
175℃, 10 hours). A carbon dioxide laser (manufactured by Shibuya Kogyo Co., Ltd.) was applied to this sample.
920 type laser mark, maximum energy density
0.4 Joul/cm 2 ), the surface of the molded product was marked by irradiating a laser through a predetermined mask for 1/1,000,000 seconds. The results are also listed in Table 1. Examples 8 to 14 and Comparative Example 3 Bisphenol type epoxy resin (epoxy equivalent 450, softening point 45°C) 25.7 parts Diaminodiphenylmethane 3.0 parts Mold release agent (stearic acid) 0.5 parts Silane coupling agent (manufactured by Shin-Etsu Silicone Co., Ltd.) KBM403) 0.5 part black organic dye (shown in Table 2) Inorganic filler (shown in Table 2)
【表】【table】
【表】
上記第2表の組成物より実施例1の方法に準じ
てマーキング用成形品試料を作成し、さらに同例
に準じて成形品表面にマーキングを施した。
その結果を第2表に併記する。
第1表および第2表から明らかなように、本発
明の成形用樹脂組成物を用いて得られた成形品
は、SMカラーコンピユーター(スガ試験機社
製)を用いて測定したマーキングの明度および色
差共に従来品より優れていることが判る。
以上の如く本発明の樹脂組成物を用いて得られ
る成形品はレーザーによるマーキング性に優れる
ので、この樹脂組成物を用い、マーキングを必要
とする、樹脂封止半導体装置、抵抗素子モールド
体、樹脂封止コンデンサ、キヤパシター等の製造
に有益に用いることができる。[Table] Molded product samples for marking were prepared from the compositions in Table 2 above according to the method of Example 1, and markings were applied to the surface of the molded products according to the same example. The results are also listed in Table 2. As is clear from Tables 1 and 2, the molded products obtained using the molding resin composition of the present invention have a brightness of markings measured using an SM color computer (manufactured by Suga Test Instruments Co., Ltd.) It can be seen that both color difference is superior to conventional products. As described above, molded products obtained using the resin composition of the present invention have excellent laser marking properties. It can be advantageously used in manufacturing sealed capacitors, capacitors, etc.
Claims (1)
れる樹脂成形物用のエポキシ樹脂組成物におい
て、全組成物基準で無機質充填剤を50〜85重量
%、アゾ系の含金属化合物からなる黒色有機染料
を0.05〜3.0重量%含有することを特徴とする成
形用樹脂組成物。1. In an epoxy resin composition for resin moldings whose surface is marked with a laser, 50 to 85% by weight of an inorganic filler and 0.05% of a black organic dye consisting of an azo metal-containing compound are added to the entire composition. A molding resin composition characterized by containing ~3.0% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15605783A JPS6047065A (en) | 1983-08-25 | 1983-08-25 | Molding resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15605783A JPS6047065A (en) | 1983-08-25 | 1983-08-25 | Molding resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6047065A JPS6047065A (en) | 1985-03-14 |
JPS621656B2 true JPS621656B2 (en) | 1987-01-14 |
Family
ID=15619356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15605783A Granted JPS6047065A (en) | 1983-08-25 | 1983-08-25 | Molding resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6047065A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60152522A (en) * | 1984-01-23 | 1985-08-10 | Toshiba Chem Corp | Sealing resin composition |
JPS6143621A (en) * | 1984-08-08 | 1986-03-03 | Toshiba Chem Corp | Sealing resin composition |
JPS6222823A (en) * | 1985-07-23 | 1987-01-31 | Toshiba Chem Corp | Sealing resin composition |
JPS62169846A (en) * | 1986-01-22 | 1987-07-27 | Matsushita Electric Works Ltd | Sealing resin composition |
CN1103649A (en) * | 1993-04-22 | 1995-06-14 | 苏马吕株式会社 | Laser beam absorbing resin composition, coloring material therefor and laser beam marking method |
DE4411067A1 (en) * | 1994-03-30 | 1995-10-05 | Bayer Ag | Polymer molding compounds for partial color changes by laser energy, in particular for the production of colored characters |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5255520A (en) * | 1975-10-31 | 1977-05-07 | Asahi Chemical Ind | Image forming element |
JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
JPS5711090A (en) * | 1980-06-26 | 1982-01-20 | Mitsui Toatsu Chem Inc | Laser beam recording-reading medium |
JPS5867496A (en) * | 1981-10-19 | 1983-04-22 | Toshiba Corp | Marking method |
-
1983
- 1983-08-25 JP JP15605783A patent/JPS6047065A/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5255520A (en) * | 1975-10-31 | 1977-05-07 | Asahi Chemical Ind | Image forming element |
JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
JPS5711090A (en) * | 1980-06-26 | 1982-01-20 | Mitsui Toatsu Chem Inc | Laser beam recording-reading medium |
JPS5867496A (en) * | 1981-10-19 | 1983-04-22 | Toshiba Corp | Marking method |
Also Published As
Publication number | Publication date |
---|---|
JPS6047065A (en) | 1985-03-14 |
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