JPH10158479A - Semiconductor-sealing resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition which is excellent with respect to YAG laser marking properties. SOLUTION: This composition comprises a crystalline epoxy compound, a phenol resin curing agent, a spherical fused silica containing a particle having a particle diameter of 5μm or less in an amount of 15wt.% or more, a curing accelerator and a carbon black having an average particle diameter of 15 to 100nm. The contents of the spherical fused silica and the carbon black are 84 to 92wt.% and 0.2 to 0.6wt.%, respectively, based on the total weight of the resin composition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin composition for encapsulating a semiconductor having excellent YAG laser marking properties.

[0002]

2. Description of the Related Art Conventionally, semiconductor devices mainly sealed with an epoxy resin composition are marked with a product name or a lot number using a special thermosetting or UV curing type ink. It takes a lot of time and the handling of ink is not easy. YA
Since the marking of the epoxy resin composition on the surface of the molded article by short-time irradiation of a laser beam of G or carbon dioxide is more excellent in workability than the marking by ink and is completed in a short time, it is difficult for an electronic component maker. This is a method with many advantages.

However, when laser marking is performed on the surface of a semiconductor molded article sealed with a conventional epoxy resin composition (hereinafter, referred to as a resin composition), a marked portion and a non-marked portion are formed. Since the contrast was unclear and the print was yellow, it was difficult to read the print. Regarding the carbon dioxide laser mark, an effective coloring agent has already been developed, and a resin composition for semiconductor encapsulation capable of obtaining clear printing has been put on the market. On the other hand, regarding the YAG laser mark, for example,
According to JP-A-127449, "the carbon content is 9
Carbon black having a content of not less than 9.5% by weight and a content of hydrogen of not more than 0.3% by weight "is described as being effective for the same purpose, and various other studies have been conducted. The marking contrast after volatilization is still insufficient, clear printing has not been obtained, and a resin composition for semiconductor encapsulation having excellent laser mark properties has been required.

[0004]

SUMMARY OF THE INVENTION The present invention provides a resin composition for semiconductor encapsulation having excellent laser mark properties.

[0005]

The present invention comprises (A) a crystalline epoxy compound, (B) a phenolic resin curing agent, and (C)
Spherical fused silica containing 15% by weight or more of particles having a particle size of 5 μm or less, (D) a curing accelerator, and (E) an average particle size of 15 to 1
In a resin composition containing carbon black of an essential component of 00 nm, spherical fused silica (C) is contained in the entire resin composition in an amount of 84 to 92% by weight and carbon black (E) in an amount of 0.2 to 0.6% by weight. This is an epoxy resin composition for semiconductor encapsulation, and a molded article using the same exhibits excellent laser marking properties and can obtain clear marking.

Hereinafter, each component will be described. The structure of the crystalline epoxy compound used in the present invention is not particularly limited as long as it has two or more epoxy groups in a molecule and is crystalline and solid at normal temperature. Examples of the crystalline epoxy compound include a biphenyl type epoxy compound, a bisphenol type epoxy compound, a stilbene type epoxy compound, and the like. In consideration of the moisture resistance reliability of the resin composition for semiconductor encapsulation, it is preferable that the amount of ionic impurities such as Na ions and Cl ions is as small as possible. From the viewpoint of curability, the epoxy equivalent is preferably 150 to 300 g / eq. Furthermore, as long as the properties of the crystalline epoxy compound are not impaired,
You may use together with other epoxy resins, such as an orthocresol novolak type epoxy resin. The phenolic resin curing agent used in the present invention is not particularly limited as long as it has a phenolic hydroxyl group in the molecule, for example, a phenol novolak resin, a xylene-modified phenol resin,
Triphenolmethane-type resins and their modified resins, and the like. From the viewpoint of curability, the hydroxyl equivalent is 80 to 250 g.
/ Eq is preferred.

The spherical fused silica used in the present invention has a particle size of 5
This is a first point of the present invention, in which particles containing not more than 15 μm of particles of not more than μm are contained. The ratio of particles having a particle size of 5 μm or less is determined by a laser diffraction particle size distribution analyzer (Cirrus Co., Ltd.).
Manufactured by Model 715). By using this spherical fused silica, when laser masking is performed on the surface of the molded article of the resin composition, the deep depressions caused by the falling off of the filler are reduced, and the shade formed on the printing surface is reduced. Further, irregular reflection of light by the fine particles is effectively obtained, and the contrast of printing is improved, so that clear marking can be obtained. In addition, the presence of 15% by weight or more of fine particles having a particle size of 5 μm or less provides an effect that the jagged edges of the marked characters are smooth, and that the characters are clear and easy to recognize. In this way, it is possible to suppress chipping and blurring of characters caused by the above, and it is possible to realize excellent marking properties. The addition amount of the spherical fused silica is 84 to 92% by weight in the whole resin composition, and if it is less than 84% by weight, the influence of coloring of the print by the resin is large, and in order to obtain a sufficient laser marking property, Another means such as prevention of thermal discoloration of the resin is required. On the other hand, if the content exceeds 92% by weight, the fluidity of the resin is impaired, and sufficient fluidity cannot be obtained as a resin composition. Further, particles having a particle size of 5 μm or less
When the content is less than the weight%, diffused light cannot be effectively obtained,
Since it becomes impossible to suppress the jaggedness, chipping, blurring, and the like of the edge portion, sufficient marking properties cannot be obtained. The production method and particle size distribution of the spherical fused silica are not particularly limited, but the maximum particle size is preferably 150 μm or less from the viewpoint of filling in the details of a mold at the time of molding.

The curing accelerator used in the present invention may be any one which promotes the reaction between an epoxy group and a hydroxyl group, and may be any of those generally used in a sealing resin composition. For example, there are 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, benzyldimethylamine, 2-methylimidazole and the like, and these may be used alone or as a mixture. The carbon black having an average particle size of 15 to 100 nm used in the present invention is contained in the entire resin composition in an amount of 0.2 to 0.6% by weight. Is the point. The average particle size of the carbon can be measured by microscopic observation. If the added amount of carbon is less than 0.2% by weight, the coloring power of the molded article becomes insufficient, and the color of the molded article itself becomes light gray, so that sufficient printing and black-and-white contrast cannot be obtained. On the other hand, if the content exceeds 0.6% by weight, soot remaining on the printing surface after burning off the carbon increases and the printing becomes gray, which leads to a decrease in the contrast between the printing and the surroundings. The form of aggregation of the carbon black to be used is not particularly limited as long as the level of impurities and the like can be applied to the sealing resin composition. However, when the average particle size is less than 15 nm, the volatilizing power when receiving a YAG laser beam becomes weak, and sufficient marking properties cannot be obtained. On the other hand, when the average particle size exceeds 100 nm, the coloring power as a coloring agent is reduced, the black-and-white contrast with printing deteriorates, and sufficient marking properties cannot be obtained.

In the present invention, the components (A) to (E) are essential components. In addition, additives such as a coupling agent, a flame retardant, a mold release agent, and a low stress additive are appropriately added as necessary. You may mix. In addition, the sealing resin composition of the present invention is manufactured by uniformly mixing predetermined amounts of the respective components with a mixer or the like, melt-kneading with a heating roll or a kneader, an extruder, or the like, cooling, and then pulverizing. can do.

Hereinafter, the present invention will be described specifically with reference to examples. Example 1 Crystalline epoxy compound (YX4000H, Yuka Shell Epoxy Co., Ltd., melting point 105 ° C) 9.1 parts by weight Phenol novolak resin (softening point 65 ° C, hydroxyl equivalent 104) 4.9 parts by weight Spherical melting Silica (Ratio of particles having a size of 15 μm or less in silica: 20% by weight) 84 parts by weight Carbon black (average particle size: 22 nm, specific surface area: 110 m ² / g) 0.2 part by weight Triphenylphosphine 0.2 part by weight Carnauba wax 0 0.4 parts by weight Silicone oil 0.2 parts by weight Antimony trioxide 1.0 part by weight was mixed at room temperature with a mixer, melt-kneaded with a heating roll at 80 to 100 ° C., cooled and pulverized to obtain a resin composition. .

Spiral flow: The resin composition was molded by a low-pressure transfer molding machine using a mold conforming to EMMI-I-66 under the conditions of 175 ° C., injection pressure of 70 kgf / cm ² , and holding time of 120 seconds. , Measure spiral flow. The spiral flow criterion was rejected if it was less than 70 cm and passed if it was 70 cm or more. Marking property: Using a tableted resin composition, 8
0pQFP (2.7 mm thickness) was molded with a low-pressure transfer molding machine under the conditions of 175 ° C., injection pressure of 70 kgf / cm ² , and dwelling time of 120 seconds.
Post-curing was performed at 5 ° C. for 8 hours to obtain a sample for imprinting. The obtained sample was stamped with a mask type YAG laser stamping machine manufactured by NEC Corporation (applied voltage: 2.4 kV, pulse width: 120 μs), and the visibility (marking property) of printing was evaluated. Table 1 shows the evaluation results. Examples 2 to 7, Comparative Examples 1 to 7 Resin compositions were produced in the same manner as in Example 1, and evaluated in the same manner. The evaluation results are shown in Tables 1 and 2.

Table 1 Example 1 2 3 4 5 6 7 Epoxy compound 8.5 6.8 5.9 6.8 6.8 6.6 6.8 Phenol novolak resin 4.5 3.7 3.1 3.7 3.7 3.5 3.7 Spherical fused silica 85 88 90 88 88 88 88 (weight of particles of 15 μm or less) (Ratio) (20) (20) (20) (15) (35) (20) (20) Carbon black (22 nm) 0.2 0.2 0.2 0.2 0.2 0.6 Carbon black (85 nm) 0.2 Triphenylphosphine 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Carnauba wax 0.4 0.4 0.4 0.4 0.4 0.4 0.4 Silicone oil 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Antimony trioxide 1 0.5 0 0.5 0.5 0.5 0.5 Spiral flow 150 115 85 105 125 110 115 Marking ○ ○ ○ ○ ○ ○ ○ Joint joint joint

Table 2 Comparative Example 1 2 3 4 5 6 7 Epoxy compound 10.4 3.9 6.8 6.9 6.5 6.7 6.7 Phenol novolak resin 5.6 2.1 3.7 3.7 3.4 3.6 3.6 Spherical fused silica 82 93 88 88 88 88 88 (weight of particles of 15 μm or less) (Ratio) (20) (20) (10) (20) (20) (20) (20) Carbon black (22 nm) 0.2 0.2 0.2 0.1 0.8 Carbon black (10 nm) 0.4 Carbon black (120 nm) 0.4 Triphenylphosphine 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Carnauba wax 0.4 0.4 0.4 0.4 0.4 0.4 0.4 Silicone oil 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Antimony trioxide 1 0 0.5 0.5 0.5 0.5 0.5 Spiral flow 170 45 110 115 110 110 110 Markability △ ○ △ × × × × Comprehensive judgment No No No No No

[0014]

According to the present invention, YAG having a white print and good contrast, which cannot be obtained by the prior art, can be obtained.
A resin composition having excellent laser masking properties can be obtained. Therefore, when used for sealing electric and electronic components,
Good printing with a YAG laser can be obtained at high speed and at low voltage.

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Claims (1)

[Claims] (A) a crystalline epoxy compound, (B) a phenol resin curing agent, and (C) particles having a particle size of 5 μm or less.
In a resin composition containing 5% by weight or more of spherical fused silica, (D) a curing accelerator and (E) carbon black having an average particle size of 15 to 100 nm as essential components, spherical fused silica ( An epoxy resin composition for semiconductor encapsulation comprising 84 to 92% by weight of C) and 0.2 to 0.6% by weight of carbon black (E).