JP2001114989A - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor deviceInfo
- Publication number
- JP2001114989A JP2001114989A JP29778299A JP29778299A JP2001114989A JP 2001114989 A JP2001114989 A JP 2001114989A JP 29778299 A JP29778299 A JP 29778299A JP 29778299 A JP29778299 A JP 29778299A JP 2001114989 A JP2001114989 A JP 2001114989A
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- epoxy resin
- resin composition
- weight
- organic dye
- present
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、レーザーマーキン
グ性を有する半導体封止用エポキシ樹脂組成物、及びこ
れを用いた半導体装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation having laser marking properties, and a semiconductor device using the same.
【０００２】[0002]
【従来の技術】従来、主にエポキシ樹脂組成物で封止さ
れた半導体装置は、熱硬化型もしくはＵＶ硬化型の特殊
なインクで品名やロット番号等をマーキングしていた
が、マーキングやインクの硬化に時間がかかり、更にイ
ンクの取り扱いも容易でないため、最近はレーザーマー
キングを採用する電子部品メーカーが増加している。Ｙ
ＡＧ、又は炭酸ガスのレーザー光の短時間照射によるエ
ポキシ樹脂組成物の硬化物表面へのマーキングは、イン
クによるマーキングよりも作業性に優れ、しかも短時間
で終了するために、電子部品メーカーにとっては利点の
多い方法である。2. Description of the Related Art Conventionally, semiconductor devices mainly sealed with an epoxy resin composition are marked with a product name or a lot number using a special thermosetting or UV curing ink. Since it takes a long time to cure the ink and it is not easy to handle the ink, electronic component manufacturers adopting laser marking are increasing recently. Y
Marking on the surface of a cured epoxy resin composition by short-time irradiation of a laser beam of AG or carbon dioxide gas is more workable than marking with ink, and is completed in a shorter time. This is a method with many advantages.
【０００３】しかし、従来のエポキシ樹脂組成物を用い
て封止された半導体装置の表面にレーザーマーキングし
た場合、マーキングした部分とマーキングしていない部
分とのコントラストが不鮮明であり、しかも印字が黄色
であるために、印字の読みとりが困難である。炭酸ガス
レーザーマーキングに関しては、既に効果的な着色剤が
開発され、鮮明な印字が得られるエポキシ樹脂組成物が
上市されている。一方、ＹＡＧレーザーマーキングに関
しては、例えば特開平２−１２７４４９号公報には、
「カーボン含有量が９９．５重量％以上、水素含有量が
０．３重量％以下であるカーボンブラック」が同目的に
効果的であることが開示されており、又、その他の種々
の研究がなされている。しかし、最近の半導体装置のフ
ァインピッチ化に伴い、導電性着色剤であるカーボンブ
ラックによる配線のショート不良のおそれがあり、カー
ボンブラック等の導電性の着色剤を用いずに、鮮明なＹ
ＡＧレーザーマーキングが可能なエポキシ樹脂組成物の
開発が望まれている。しかしながら、このようなエポキ
シ樹脂組成物は未だ報告された例がなく、開発が強く望
まれている。[0003] However, when laser marking is performed on the surface of a semiconductor device sealed with a conventional epoxy resin composition, the contrast between the marked portion and the unmarked portion is unclear, and the printing is yellow. This makes it difficult to read the print. Regarding the carbon dioxide laser marking, an effective coloring agent has already been developed, and an epoxy resin composition capable of obtaining clear printing has been put on the market. On the other hand, with respect to YAG laser marking, for example, Japanese Unexamined Patent Publication No.
It is disclosed that "carbon black having a carbon content of 99.5% by weight or more and a hydrogen content of 0.3% by weight or less" is effective for the same purpose, and various other studies have been made. It has been done. However, with the recent trend toward finer pitch of semiconductor devices, there is a risk of short-circuit failure of wiring due to carbon black, which is a conductive colorant, and a sharp Y without using a conductive colorant such as carbon black.
Development of an epoxy resin composition capable of AG laser marking is desired. However, such an epoxy resin composition has not been reported yet, and its development is strongly desired.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、カーボンブ
ラック等の導電性の着色剤を用いずに、優れたＹＡＧレ
ーザーマーキング性を有する半導体封止用エポキシ樹脂
組成物、及びこれを用いた半導体装置を提供するもので
ある。SUMMARY OF THE INVENTION The present invention relates to an epoxy resin composition for semiconductor encapsulation having excellent YAG laser marking properties without using a conductive coloring agent such as carbon black, and a semiconductor using the same. An apparatus is provided.
【０００５】[0005]
【課題を解決するための手段】本発明は、（Ａ）エポキ
シ樹脂、（Ｂ）フェノール樹脂、（Ｃ）無機充填材、
（Ｄ）硬化促進剤、及び（Ｅ）８００〜１２００ｎｍに
吸収スペクトルを有する有機染料を必須成分とするエポ
キシ樹脂組成物において、全エポキシ樹脂組成物中に無
機充填材（Ｃ）を６５〜９２重量％、有機染料（Ｅ）を
０．０５〜３重量％含むことを特徴とする半導体封止用
エポキシ樹脂組成物、及びこれを用いて半導体素子を封
止してなることを特徴とする半導体装置である。The present invention provides (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler,
In the epoxy resin composition containing (D) a curing accelerator and (E) an organic dye having an absorption spectrum at 800 to 1200 nm as an essential component, the inorganic filler (C) is 65 to 92% by weight in the total epoxy resin composition. %, And an epoxy resin composition for encapsulating a semiconductor, comprising 0.05 to 3% by weight of an organic dye (E), and a semiconductor device obtained by encapsulating a semiconductor element using the same. It is.
【０００６】[0006]
【発明の実施の形態】本発明に用いるエポキシ樹脂は、
分子中にエポキシ基を有するものであれば特に限定しな
いが、例えば、オルソクレゾールノボラック型エポキシ
樹脂、フェノールノボラック型エポキシ樹脂、トリフェ
ノールメタン型エポキシ樹脂、ビスフェノール型エポキ
シ樹脂、ビフェニル型エポキシ樹脂、スチルベン型エポ
キシ樹脂、ジシクロペンタジエン変性フェノール型エポ
キシ樹脂、ナフトール型エポキシ樹脂等が挙げられ、こ
れらは単独でも混合して用いてもよい。エポキシ樹脂組
成物の硬化性のためには、エポキシ当量は１５０〜３０
０が望ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS The epoxy resin used in the present invention is:
There is no particular limitation as long as it has an epoxy group in the molecule, for example, orthocresol novolak type epoxy resin, phenol novolak type epoxy resin, triphenolmethane type epoxy resin, bisphenol type epoxy resin, biphenyl type epoxy resin, stilbene type An epoxy resin, a dicyclopentadiene-modified phenol type epoxy resin, a naphthol type epoxy resin and the like can be mentioned, and these may be used alone or in combination. For the curability of the epoxy resin composition, the epoxy equivalent is 150-30.
0 is desirable.
【０００７】本発明に用いるフェノール樹脂は、分子中
にフェノール性水酸基を有するのもであれば特に限定し
ないが、例えば、フェノールノボラック樹脂、フェノー
ルアラルキル樹脂、トリフェノールメタン型樹脂、テル
ペン変性フェノール樹脂等が挙げられ、これらは単独で
も混合して用いてもよい。エポキシ樹脂組成物の硬化性
のためには、水酸基当量は８０〜２５０が望ましい。The phenol resin used in the present invention is not particularly limited as long as it has a phenolic hydroxyl group in the molecule. Examples thereof include a phenol novolak resin, a phenol aralkyl resin, a triphenolmethane resin, a terpene-modified phenol resin and the like. And these may be used alone or as a mixture. For the curability of the epoxy resin composition, the hydroxyl equivalent is preferably from 80 to 250.
【０００８】本発明に用いる無機充填材としては、特に
制限はなく、一般に封止材料に用いられているものを使
用することができる。例えば、溶融破砕シリカ、溶融球
状シリカ、結晶シリカ、アルミナ、チタンホワイト、水
酸化アルミニウム、タルク、クレー、ガラス繊維等が挙
げられる。これらの無機充填材の製法や粒度分布等につ
いては、特に限定するものではないが、成形時の金型の
細部への充填性の点から、最大粒径は１５０μｍ以下の
ものが好ましい。無機充填材の添加量としては、全エポ
キシ樹脂組成物中に６５〜９２重量％が好ましく、６５
重量％未満だと、樹脂成分による印字の着色の影響が大
きく、鮮明なＹＧレーザーマーキング性を得るために
は、樹脂成分の熱変色防止等の別の手段が必要となり、
又エポキシ樹脂組成物の硬化物の吸湿率が高くなるた
め、耐半田クラック性や耐湿性等の特性が不充分となる
ので好ましくない。又、９２重量％を越えると、流動性
が不充分となるので好ましくない。[0008] The inorganic filler used in the present invention is not particularly limited, and those generally used for a sealing material can be used. For example, fused silica, fused spherical silica, crystalline silica, alumina, titanium white, aluminum hydroxide, talc, clay, glass fiber and the like can be mentioned. The production method and particle size distribution of these inorganic fillers are not particularly limited, but the maximum particle size is preferably 150 μm or less from the viewpoint of filling into the details of a mold during molding. The amount of the inorganic filler to be added is preferably 65 to 92% by weight in the total epoxy resin composition, and 65 to 92% by weight.
If the amount is less than 10% by weight, the influence of coloring of the print by the resin component is large, and in order to obtain a clear YG laser marking property, another means such as thermal discoloration prevention of the resin component is required.
Further, since the moisture absorption of the cured product of the epoxy resin composition becomes high, characteristics such as solder crack resistance and moisture resistance become insufficient, which is not preferable. On the other hand, if it exceeds 92% by weight, the fluidity becomes insufficient, which is not preferable.
【０００９】本発明に用いる硬化促進剤としては、エポ
キシ基とフェノール性水酸基の反応を促進するものであ
ればよく、一般に封止材料に使用されているものを利用
することができる。例えば、１，８−ジアザビシクロ
（５，４，０）ウンデセン−７、トリフェニルホスフィ
ン、ベンジルジメチルアミン、２−メチルイミダゾール
等が挙げられ、これらは単独でも混合して用いてもよ
い。As the curing accelerator used in the present invention, any one can be used as long as it promotes the reaction between the epoxy group and the phenolic hydroxyl group, and those generally used for a sealing material can be used. For example, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, benzyldimethylamine, 2-methylimidazole and the like can be mentioned, and these may be used alone or as a mixture.
【００１０】本発明に用いる有機染料としては、有機化
合物、有機金属錯体、有機金属塩等が挙げられ、これら
の内では、８００〜１２００ｎｍに吸収スペクトルを有
するものが好ましく、これらは単独でも混合して用いて
も良い。吸収スペクトルが８００〜１２００ｎｍの範囲
を外れると、印字が不鮮明となり好ましくない。本発明
の有機染料の凝集形態等は、特に限定するものではな
く、又不純物等のレベルが半導体封止エポキシ樹脂組成
物用に適用できるものであればよい。吸収スペクトル
は、自記分光光度計（（株）日立製作所・製、Ｕ−３５
００）を用いて測定する。有機染料の添加量としては、
全エポキシ樹脂組成物中に０．０５〜３重量％が好まし
く、０．０５重量％未満だと硬化物の着色が不足し、硬
化物自体の色が淡灰色になってしまうため、鮮明な印字
との白黒のコントラストが得られないので好ましくな
い。又、３重量％を越えると、染料を焼き飛ばした後に
印字表面に残るススが増加し、印字が灰色になってしま
うため、印字と周囲のコントラストが低下し、又硬化物
の吸水量が増え、耐半田クラック信頼性が低下するする
ので好ましくない。The organic dyes used in the present invention include organic compounds, organometallic complexes, organometallic salts, and the like. Among them, those having an absorption spectrum at 800 to 1200 nm are preferable. May be used. If the absorption spectrum is out of the range of 800 to 1200 nm, the printing becomes unclear, which is not preferable. The form of aggregation of the organic dye of the present invention is not particularly limited, and may be any as long as the level of impurities and the like can be applied to the epoxy resin composition for semiconductor encapsulation. The absorption spectrum was measured by a self-recording spectrophotometer (U-35, manufactured by Hitachi, Ltd.).
00). As the addition amount of the organic dye,
0.05 to 3% by weight of the total epoxy resin composition is preferable, and if it is less than 0.05% by weight, the color of the cured product is insufficient, and the color of the cured product itself becomes light gray, so that clear printing is performed. It is not preferable because a black-and-white contrast cannot be obtained. On the other hand, if it exceeds 3% by weight, soot remaining on the print surface after burning out the dye increases, and the print becomes gray, so that the contrast between the print and the surroundings decreases, and the water absorption of the cured product increases. However, it is not preferable because reliability of solder cracking resistance is reduced.
【００１１】本発明のエポキシ樹脂組成物は、（Ａ）〜
（Ｅ）成分の他、必要に応じてカップリング剤、難燃
剤、離型剤、低応力剤、酸化防止剤等の各種添加剤を適
宜配合してもよい。本発明のエポキシ樹脂組成物は、
（Ａ）〜（Ｅ）成分、及びその他の添加剤等をミキサー
等で均一に常温混合した後、加熱ロール又はニーダー、
押出機等の混練機で溶融混練し、冷却後粉砕して得られ
る。本発明のエポキシ樹脂組成物を用いて、半導体等の
電子部品を封止し、半導体装置を製造するには、トラン
スファーモールド、コンプレッションモールド、インジ
ェクションモールド等の成形方法で硬化成形すればよ
い。The epoxy resin composition of the present invention comprises (A)
In addition to the component (E), various additives such as a coupling agent, a flame retardant, a release agent, a low-stress agent, and an antioxidant may be appropriately compounded as necessary. The epoxy resin composition of the present invention,
After the components (A) to (E) and other additives are uniformly mixed at room temperature with a mixer or the like, a heating roll or kneader is used.
It is obtained by melt-kneading with a kneader such as an extruder, cooling and pulverizing. In order to manufacture a semiconductor device by encapsulating an electronic component such as a semiconductor using the epoxy resin composition of the present invention, it is sufficient to cure and mold by a molding method such as transfer molding, compression molding, and injection molding.
【００１２】[0012]
【実施例】以下、本発明を実施例で具体的に説明する。
配合割合は重量部とする。 実施例１ ビフェニル型エポキシ樹脂（油化シェルエポキシ（株）・製、ＹＸ４０００Ｈ 、融点１０５℃、エポキシ当量１９５ｇ／ｅｑ） ８．５重量 部 フェノールノボラック樹脂（軟化点６５℃、水酸基当量１０４ｇ／ｅｑ） ４．５重量部 球状溶融シリカ（最大粒径７５μｍ） ８５重量部 有機染料Ａ（８００〜１１００ｎｍに吸収スペクトルを有する）０．２重量部 トリフェニルホスフィン ０．２重量部 三酸化アンチモン １．０重量部 カルナバワックス ０．４重量部 シリコーンオイル ０．２重量部 をミキサーで常温混合し、８０〜１００℃の加熱ロール
で溶融混練し、冷却後粉砕し、エポキシ樹脂組成物を得
た。The present invention will be specifically described below with reference to examples.
The mixing ratio is by weight. Example 1 Biphenyl epoxy resin (YX4000H, manufactured by Yuka Shell Epoxy Co., Ltd., melting point: 105 ° C, epoxy equivalent: 195 g / eq) 8.5 parts by weight Phenol novolak resin (softening point: 65 ° C, hydroxyl equivalent: 104 g / eq) 4.5 parts by weight Spherical fused silica (maximum particle size: 75 μm) 85 parts by weight Organic dye A (having an absorption spectrum at 800 to 1100 nm) 0.2 part by weight Triphenylphosphine 0.2 part by weight Antimony trioxide 1.0 part by weight Part Carnauba wax 0.4 part by weight Silicone oil 0.2 part by weight was mixed at room temperature with a mixer, melt-kneaded with a heating roll at 80 to 100 ° C., cooled and pulverized to obtain an epoxy resin composition.
【００１３】評価方法 スパイラルフロー：ＥＭＭＩ−１−６６に準じた金型を
用いて、金型温度１７５℃、射出圧力７０ｋｇｆ／ｃｍ
2、保圧時間１２０秒で測定した。単位はｃｍ。スパイ
ラルフロー判定の基準は、７０ｃｍ未満を不合格、７０
ｃｍ以上を合格とした。 ＹＡＧレーザーマーキング性：低圧トランスファー成形
機を用いて、金型温度１７５℃、射出圧力７０ｋｇｆ／
ｃｍ2、保圧時間１２０秒で８０ｐＱＦＰ（２．７ｍｍ
厚）を成形し、更に１７５℃、８時間でポストキュアし
た。次に、日本電気（株）・製のマスクタイプのＹＡＧ
レーザー捺印機（印加電圧２．４ｋＶ、パルス幅１２０
μｓの条件）でマーキングし、印字の視認性（ＹＡＧレ
ーザーマーキング性）を評価した。 耐半田クラック性：低圧トランスファー成形機を用い
て、金型温度１７５℃、射出圧力７０ｋｇｆ／ｃｍ2、
保圧時間１２０秒で８０ｐＱＦＰ（２．７ｍｍ厚）８個
を成形し、更に１７５℃、８時間でポストキュアした。
次に、１５０℃で２０時間乾燥させた後、恒温恒湿槽
（８５℃、相対湿度６０％）に１６８時間放置後、ＩＲ
リフロー後、外部クラックの有無を光学顕微鏡にて観察
した。不良品の個数がｎ個であるとき、ｎ／８と表示し
た。又吸湿前後の重量変化から吸湿率を算出した。単位
は重量％。Evaluation method Spiral flow: Using a mold according to EMMI-1-66, mold temperature 175 ° C., injection pressure 70 kgf / cm
2. Measured with a dwell time of 120 seconds. The unit is cm. The criteria for spiral flow determination are:
cm or more was accepted. YAG laser marking property: using a low-pressure transfer molding machine, mold temperature 175 ° C, injection pressure 70kgf /
cm 2, 80pQFP 120 seconds dwell time (2.7 mm
Was molded and post-cured at 175 ° C. for 8 hours. Next, a mask type YAG manufactured by NEC Corporation
Laser marking machine (applied voltage 2.4 kV, pulse width 120
μs), and the visibility of printing (YAG laser marking property) was evaluated. Solder crack resistance: Using a low-pressure transfer molding machine, mold temperature 175 ° C, injection pressure 70kgf / cm 2 ,
Eight 80 pQFPs (2.7 mm thick) were molded with a dwell time of 120 seconds, and post-cured at 175 ° C. for 8 hours.
Next, after drying at 150 ° C. for 20 hours, it was left in a thermo-hygrostat (85 ° C., relative humidity 60%) for 168 hours, and then IR
After reflow, the presence or absence of external cracks was observed with an optical microscope. When the number of defective products was n, it was indicated as n / 8. The moisture absorption was calculated from the change in weight before and after moisture absorption. The unit is% by weight.
【００１４】実施例２〜５、比較例１〜６ 実施例１と同様にしてエポキシ樹脂組成物を製造し、実
施例１と同様にして評価した。結果を表１、表２に示
す。なお、比較例５、６では有機染料Ｂとして、吸収ス
ペクトル４００〜６００ｎｍのものを用いた。◎Examples 2 to 5, Comparative Examples 1 to 6 Epoxy resin compositions were produced in the same manner as in Example 1, and evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2. In Comparative Examples 5 and 6, organic dye B having an absorption spectrum of 400 to 600 nm was used. ◎
【表１】 [Table 1]
【００１５】◎◎
【表２】 [Table 2]
【００１６】[0016]
【発明の効果】本発明に従うと、印字が白く、且つコン
トラストが鮮明なＹＡＧレーザーマーキング性に優れた
エポキシ樹脂組成物を得ることができる。従って電気、
電子部品の封止用に用いた場合、ＹＡＧレーザーによる
良好な印字が高速、かつ低電圧で得られるので、工程短
縮に大きな効果がある。又着色剤としてカーボンブラッ
ク等の導電性粒子を用いる必要がないため、最近の半導
体装置のファインピッチ化に伴い、導電性粒子が配線間
に詰まることによる配線のショート、リーク不良等の不
良原因を回避することができる。According to the present invention, it is possible to obtain an epoxy resin composition which is white and has a clear contrast and is excellent in YAG laser marking property. Therefore electricity,
When used for sealing electronic components, good printing with a YAG laser can be obtained at a high speed and at a low voltage, which is very effective in shortening the process. In addition, since it is not necessary to use conductive particles such as carbon black as a coloring agent, with the recent trend toward finer pitch in semiconductor devices, the cause of defects such as wiring short-circuits and leak failure due to conductive particles clogging between wirings. Can be avoided.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 23/31 Ｆターム(参考） 4J002 CC03X CD00W CD02W CD03W CD05W CD06W CD07W DE136 DE146 DJ016 DJ036 DJ046 DL006 EN087 EU117 EU137 EW017 EZ008 FA046 FD016 FD098 FD14X FD157 GJ02 4J036 AC02 AD07 AD08 AD10 AE07 AF05 AF06 AF08 DC05 DC10 DC40 DC46 DD07 FA03 FA05 FB08 JA07 4M109 AA01 BA01 CA21 EA02 EB03 EB04 EB06 EB07 EB08 EB09 EB12 EB19 EC13 GA08 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 23/31 F-term (Reference) 4J002 CC03X CD00W CD02W CD03W CD05W CD06W CD07W DE136 DE146 DJ016 DJ036 DJ046 DL006 EN087 EU117 EU137 EW017 EZ008 FA046 FD016 FD098 FD14X FD157 GJ02 4J036 AC02 AD07 AD08 AD10 AE07 AF05 AF06 AF08 DC05 DC10 DC40 DC46 DD07 FA03 FA05 FB08 JA07 4M109 AA01 BA01 CA21 EA02 EB03 EB04 EB06 EB07 EB08 EB09 EB08 EB09 EB08
Claims (2)
樹脂、（Ｃ）無機充填材、（Ｄ）硬化促進剤、及び
（Ｅ）８００〜１２００ｎｍに吸収スペクトルを有する
有機染料を必須成分とするエポキシ樹脂組成物におい
て、全エポキシ樹脂組成物中に無機充填材（Ｃ）を６５
〜９２重量％、有機染料（Ｅ）を０．０５〜３重量％含
むことを特徴とする半導体封止用エポキシ樹脂組成物。1. Essential components are (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler, (D) a curing accelerator, and (E) an organic dye having an absorption spectrum at 800 to 1200 nm. In the epoxy resin composition, the inorganic filler (C) was added to the total epoxy resin composition in an amount of 65%.
An epoxy resin composition for encapsulating a semiconductor, comprising -92% by weight and 0.05-3% by weight of an organic dye (E).
脂組成物を用いて半導体素子を封止してなることを特徴
とする半導体装置。2. A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29778299A JP2001114989A (en) | 1999-10-20 | 1999-10-20 | Epoxy resin composition and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29778299A JP2001114989A (en) | 1999-10-20 | 1999-10-20 | Epoxy resin composition and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001114989A true JP2001114989A (en) | 2001-04-24 |
Family
ID=17851115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29778299A Pending JP2001114989A (en) | 1999-10-20 | 1999-10-20 | Epoxy resin composition and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001114989A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009127011A (en) * | 2007-11-27 | 2009-06-11 | Panasonic Electric Works Co Ltd | Epoxy resin composition for sealing and semiconductor device |
| JP2017011304A (en) * | 2009-01-30 | 2017-01-12 | 日東電工株式会社 | Dicing tape-integrated wafer back surface protective film |
| JP2017038061A (en) * | 2014-01-22 | 2017-02-16 | リンテック株式会社 | Film for forming protective film, sheet for forming protective film, composite sheet for forming protective film, and inspection method |
-
1999
- 1999-10-20 JP JP29778299A patent/JP2001114989A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009127011A (en) * | 2007-11-27 | 2009-06-11 | Panasonic Electric Works Co Ltd | Epoxy resin composition for sealing and semiconductor device |
| JP2017011304A (en) * | 2009-01-30 | 2017-01-12 | 日東電工株式会社 | Dicing tape-integrated wafer back surface protective film |
| JP2017038061A (en) * | 2014-01-22 | 2017-02-16 | リンテック株式会社 | Film for forming protective film, sheet for forming protective film, composite sheet for forming protective film, and inspection method |
| US10559505B2 (en) | 2014-01-22 | 2020-02-11 | Lintec Corporation | Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and inspection method |
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