JP4385885B2 - Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same - Google Patents

Description

  The present invention relates to an epoxy resin composition for semiconductor encapsulation. More specifically, the present invention relates to an epoxy resin composition for semiconductor encapsulation that emits fluorescence when irradiated with black light.

  Epoxy resin has excellent adhesiveness and low absorbency and is inexpensive, so it can be used as a sealing agent in place of hermetic sealing methods using conventional glass, metal, ceramics, etc., for sealing electrical and electronic parts and semiconductor devices. It has become mainstream. As a sealing agent using such an epoxy resin, an epoxy resin composition in which an o-cresol novolak type epoxy resin is blended as a resin component and a phenol novolak resin is blended as a curing agent component is mainly used.

On the other hand, the product surface of a semiconductor device sealed with such an epoxy resin composition is usually marked with a product name, a manufacturer name, etc. A method of imprinting resin ink has been common. However, since the ink mark has a problem that it easily disappears due to an organic solvent or friction, in recent years, laser marking that writes characters and symbols by irradiating the surface of a semiconductor device with a CO ₂ laser or the like has been performed. It has become.

  However, in laser marking, there is a problem that the mark is often unclear due to defective marking. In an integrated circuit (IC), a large scale integrated circuit (LSI), a very large scale integrated circuit (VLSI), etc. With the integration, the sealing agent is becoming thinner, and in such a semiconductor device, the sealing effect of the semiconductor device to which laser marking is applied becomes insufficient, and transmission of visible light or infrared light is caused. There was a case where trouble occurred.

In order to solve such problems, the semiconductor is encapsulated with an epoxy resin composition that contains an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as the main components and contains carbon black and an azo organic dye. A method for preventing transmission of visible light or infrared light in a semiconductor device by performing laser marking has been proposed (Patent Document 1). However, even in such laser marking, it is not easy to reduce marking defects. In addition, although contrivances for laser marking have been studied, conventionally, most of the sealed packages for semiconductor devices have been black, which has made it difficult to identify the type of semiconductor device and the manufacturer. It was.
JP-A-11-060904

  Therefore, the present invention has been made in view of the circumstances as described above, solves the problems of the prior art, and clearly identifies the type of the semiconductor device, the manufacturer, etc. in good laser marking properties. It is an object of the present invention to provide a new epoxy resin composition for semiconductor encapsulation that can be used.

（ただし、ＸおよびＹは同一又は別異にヒドロキシル基またはフェニルアミノ基を表し、Ｒは水素原子またはアルカリ金属原子を表す）
で表されるものであることを特徴としている。 The epoxy resin composition for semiconductor encapsulation of the present invention is a resin composition for semiconductor encapsulation that emits fluorescence upon irradiation with black light, and solves the above problems. A fluorescent agent is contained together with a curing agent, an inorganic filler and a curing accelerator , and the fluorescent agent has the following formula (I)

(However, X and Y are the same or different and each represents a hydroxyl group or a phenylamino group, and R represents a hydrogen atom or an alkali metal atom.)
It is characterized by being expressed by .

Further, the semiconductor encapsulating epoxy resin composition of the present invention, the first 2, WB value obtained by the color difference meter measurements of the cured product surface (whiteness) is characterized in that 5 to 30, the third the color difference meter L value obtained by measurement of the cured product surface (brightness) is characterized in that 10 to 50.

Then, in the fourth, also provides a semiconductor device characterized by comprising sealed by the one of the semiconductor encapsulating epoxy resin composition.

The epoxy resin composition for semiconductor encapsulation of the first invention contains a fluorescent agent together with at least an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, and thus emits fluorescence when irradiated with black light. . Therefore, in a semiconductor device encapsulated with such an epoxy resin composition for encapsulating a semiconductor, it is simple and reliable by irradiation with black light (near ultraviolet light) without affecting the performance and operation of the semiconductor device. Identification is possible. Moreover, since the compound of formula (I) is used as a fluorescent agent, it is usually colorless, but when irradiated with black light, it emits fluorescence in blue-violet or blue-green, and can be clearly identified. Become.
When carbon black is contained, a semiconductor device encapsulated using such an epoxy resin composition for encapsulating a semiconductor usually has a color tone equivalent to that of a conventional epoxy resin composition for encapsulating a semiconductor. In the case of irradiating with black light, it is possible to identify by emitting fluorescence.

Furthermore, in the epoxy resin composition for semiconductor encapsulation according to the second aspect of the present invention, the WB value (whiteness) obtained by color difference measurement on the surface of the cured product is 5 to 30, so that the light emission is good.

Moreover, in the epoxy resin composition for semiconductor encapsulation of said 3rd invention, since L value (lightness) obtained by the color difference meter measurement of hardened | cured material surface is 10-50, luminescent property becomes favorable.

In the semiconductor device according to the fourth aspect of the invention, the semiconductor device encapsulated with the epoxy resin composition for encapsulating a semiconductor can be easily identified by irradiation with black light such as black light. Become.

  As described above, the epoxy resin composition for semiconductor encapsulation of the present invention contains a fluorescent agent together with at least an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator.

  In the semiconductor sealing resin composition of the present invention, the epoxy resin may be various epoxy resins generally used for semiconductor sealing, and is not particularly limited. For example, o-cresol novolac type epoxy resin, phenol novolac type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, bromine-containing epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy Examples thereof include resins and naphthalene ring-containing epoxy resins. These are not limited to one type, and a plurality of types may be used in combination.

  Moreover, as a hardening | curing agent, the various things generally used for semiconductor sealing can be applied. Specifically, phenol novolac resins, dicyclopentadiene type phenol resins, phenol aralkyl resins, cresol novolac resins, naphthol aralkyl resins and other naphthalene skeleton-containing phenol resins, polyphenol compounds, those having a triphenylmethane skeleton, dicyclo skeletons The thing etc. which have are illustrated. These are not limited to one type, and a plurality of types may be used in combination. At this time, although content of an epoxy resin and a hardening | curing agent is not specifically limited, For example, it can mix | blend so that the equivalent ratio of an epoxy resin and a hardening | curing agent may be 0.5-1.5.

  Furthermore, the inorganic filler is not particularly limited as long as it is generally used for semiconductor sealing. Examples thereof include fused silica, crystalline silica, alumina, silicon nitride, and aluminum nitride. Although content of an inorganic filler is not specifically limited, For example, it can be 60 to 93 weight% with respect to the resin composition for semiconductor sealing. The content of the inorganic filler is particularly preferably 65 to 85% by weight with respect to the total amount of the semiconductor sealing resin composition.

Further, fluorescent agent contained as an essential component in the resin composition for semiconductor encapsulation of the present invention is state, and are not fluoresce when irradiated with near-ultraviolet light from black light, as such a fluorescent agent And those having a continuous conjugated double bond chain in the molecule, particularly those having an aromatic group, a heterocyclic group, and a condensed ring group . More specifically , the following formula (I)

（ただし、ＸおよびＹは同一又は別異にヒドロキシル基またはフェニルアミノ基を表し、Ｒは水素原子またはアルカリ金属原子を表す）
で表されるスチルベン誘導体である。

(However, X and Y are the same or different and each represents a hydroxyl group or a phenylamino group, and R represents a hydrogen atom or an alkali metal atom.)
In a stilbene derivative represented.

  The epoxy resin composition for semiconductor encapsulation as described above has a WB value obtained by color difference measurement on the surface of the cured product of 5 to 30. In the present invention, when the WB value is less than 5, the light emission is not sufficient, and when it is greater than 30, the light emission does not contribute much. Moreover, the L value obtained by the color difference meter measurement of the hardened | cured material surface is 10-50 for the epoxy resin composition for semiconductor sealing of this invention. The L value represents lightness, and represents the brightness of the color, that is, “brightness”. When the brightness is the maximum (100%), the color is white. When the brightness is the minimum (0%), the color is black. However, in the epoxy resin composition for semiconductor encapsulation, when the L value is 10 to 50, Identification is easy and preferable.

  When identifying semiconductor devices using such an epoxy resin composition for encapsulating semiconductors, near ultraviolet rays (300 to 450 nm) generated from mercury lamps, hafnium fluorescent lamps, etc. are extracted with a special ultraviolet filter. Lighting, ie black light.

  In the resin composition for semiconductor encapsulation of the present invention, the content of the fluorescent agent is preferably 0.02 to 2.0% by weight with respect to the total amount of the resin composition. When the content of the fluorescent agent is less than 0.02% by weight and more than 2.0% by weight, it is difficult to obtain sufficient light-emitting properties and laser marking properties. The tendency to influence will become stronger.

  As described above, the resin composition for semiconductor encapsulation of the present invention contains an epoxy resin, a curing agent, an inorganic filler, a curing accelerator, and a fluorescent agent as essential components. In addition, various additives used for semiconductor sealing may be contained.

  Specifically, mold release agents such as carnauba wax, polyethylene wax, stearic acid, montanic acid, carboxyl group-containing polyolefin, silane coupling agents such as γ-glycidoxypropyltriethoxysilane, triphenylphosphine (TPP), Organophosphorus compounds such as trimethylphosphine, imidazoles such as 2-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenylimidazole, 1,8-diazabicyclo (5,4,0) undecene-7, tri Curing accelerators such as tertiary amines such as ethanolamine and benzyldimethylamine, phosphorus flame retardants, flame retardants such as bromine compounds and antimony trioxide, colorants such as carbon black and organic dyes, and the surface is made of silicone resin Modifiers such as coated silicone rubber powder It can be mentioned.

  The resin composition for semiconductor encapsulation of the present invention as described above is blended with the above epoxy resin, curing agent, inorganic filler, curing accelerator, fluorescent agent, and various additives as necessary. It can be prepared by uniformly mixing with a mixer or blender and then kneading with a heating roll or kneader. Here, the blending order of the above components is not particularly limited, and the kneaded product can be cooled and solidified as necessary, pulverized into pellets or powder, or used as a tablet. it can.

  And a semiconductor device can be produced by carrying out sealing molding using the resin composition for semiconductor sealing prepared in this way. For example, a semiconductor device in which a semiconductor element is sealed with a sealing resin composition can be manufactured by setting a lead frame on which a semiconductor element such as an IC is mounted in a transfer molding die and performing transfer molding. It is.

  In the semiconductor device thus obtained, the encapsulant is the resin composition for encapsulating a semiconductor containing the above-mentioned fluorescent agent, and therefore emits fluorescence by irradiation with black light while having high adhesive strength. Therefore, the semiconductor device surface can be easily and clearly identified without marking it with ink or laser.

  Hereinafter, examples will be shown, and the embodiments of the present invention will be described in more detail. Of course, the present invention is not limited to the following examples, and it goes without saying that various aspects are possible in detail.

<Examples 1 to 5, Comparative Example 1>
(1) Preparation of resin composition for semiconductor encapsulation After blending each component in the blending amounts shown in Table 1, mixing with a blender for 30 minutes and homogenizing, kneading and melting with a kneader heated to 80 ° C, extrusion, After cooling, the mixture was pulverized to a predetermined particle size with a pulverizer to obtain a granular semiconductor sealing resin composition.

  As an epoxy resin, an o-cresol novolac type epoxy resin (“ESCN-195XL-3” epoxy equivalent 195 manufactured by Sumitomo Chemical Co., Ltd.) was used.

  In addition, a phenol novolac resin (“Tamanol 752” hydroxyl group equivalent 104 manufactured by Arakawa Chemical Industries, Ltd.) was used as a curing agent, and 2-phenylimidazole (manufacturer name “model number etc.”) was used as a curing accelerator.

  Further, fused silica (average particle size 20 μm) was used as the inorganic filler, and a fluorescent agent represented by the above formula (I) was used.

  Furthermore, γ-glycidoxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. “KBM403”) is used as a silane coupling agent, and brominated epoxy resin (“ESB400T” manufactured by Sumitomo Chemical Co., Ltd. “epoxy equivalent 400” as a flame retardant. ), Antimony trioxide as a flame retardant aid, natural carnauba wax as a release agent, and carbon black as a colorant.

(2) Color difference meter evaluation Using a spectroscopic color meter manufactured by Nippon Denshoku Industries Co., Ltd., the color difference of the chip surface was measured by comparison with a standard substance. Next, the molded product was cured at 125 ° C. for 24 hours, and then the same measurement was performed.

  The results are shown in Table 1.

(3) Luminescent evaluation The obtained molded article for evaluation was irradiated with black light in a dark room, and the presence or absence of light emission was confirmed visually.

  The results are shown in Table 1.

表１にみられるように、エポキシ樹脂、硬化剤、無機充填材、硬化促進剤および蛍光剤を含有する半導体封止用エポキシ樹脂組成物では、ブラックライトの照射により蛍光発光することが確認された。

As seen in Table 1, it was confirmed that the epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a curing agent, an inorganic filler, a curing accelerator and a fluorescent agent emits fluorescence when irradiated with black light. .

  On the other hand, fluorescence emission was not seen in the epoxy resin composition containing no fluorescent agent.

  From the above, it was confirmed that the present invention provides an epoxy resin composition for semiconductor encapsulation for a new marking method that enables easy and clear identification.

Claims (4)

A resin composition for encapsulating a semiconductor that emits fluorescence upon irradiation with black light, and contains at least an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, and contains a fluorescent agent, and the fluorescent agent has the following formula (I)

(However, X and Y are the same or different and each represents a hydroxyl group or a phenylamino group, and R represents a hydrogen atom or an alkali metal atom.)
An epoxy resin composition for encapsulating a semiconductor, characterized in that: Cured color difference meter WB value obtained by measurement of surface (whiteness) is a semiconductor encapsulating epoxy resin composition according to claim 1, wherein 5-30 der Rukoto. 2. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the L value (brightness) obtained by color difference measurement on the surface of the cured product is 10 to 50 . The semiconductor device characterized by comprising sealed with claims 1 to one of the semiconductor encapsulating epoxy resin composition 3.