JP2008186886A - Resin-sealed semiconductor device having anti-imitation function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device including a semiconductor element sealed with a sealing resin composition, to which an anti-imitation function for making imitation difficult is applied. <P>SOLUTION: The resin-sealed semiconductor device includes the semiconductor element sealed with the sealing resin composition, which at least contains a luminous material. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an encapsulating resin composition, and more particularly to a resin-encapsulated semiconductor device provided with an anti-counterfeit function.

  Conventionally, semiconductor devices have been mainly used for industrial purposes, and imitation of them has been less profitable for the time it takes. However, for applications other than industrial applications, such as bank cards, transportation cards, game cards and other payment cards used by the general public, there are many benefits due to imitation and a large amount. In particular, there is an extraordinary profit for imitation of a RAM device for game management in the pachinko industry for games.

  For the counterfeit prevention means in such a semiconductor device, the counterfeit prevention means in the banknote is a reference. Originally, the banknote is a convertible banknote and can be exchanged for an equivalent gold coin or silver coin of the face value. Therefore, it can be said that the banknote has fate imitated from the time it is issued. In the original banknotes, forgery prevention means such as printed patterns, signatures, printing, etc. were employed. Thereafter, forgery prevention means such as the use of special paper, fine printing, watermarks, and printing of hidden characters have been adopted. Furthermore, in recent years, anti-counterfeiting means has been adopted, such as scavenging of metal pieces, partial holography, and the use of special inks that respond to specific wavelengths.

As a means for preventing imitation in an actual semiconductor device, in a semiconductor device using a ceramic package, there is a means for irradiating the surface of the ceramic package with a laser beam to display a manufacturer name, a user name, and other information as marks. Can be mentioned. Moreover, since the contrast of the mark display with respect to the ceramic surface is low simply by irradiating the laser beam, for example, a heat resistant white paint is arranged on the surface of the ceramic package, and then the laser beam is irradiated to the heat resistant white paint. The contrast is increased by exposing the ceramic surface that is the base (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 08-213495

  At present, in order to cope with the imitation of semiconductor devices, various anti-counterfeiting means such as the mark display by laser beam irradiation as described above are being studied. However, the fact is that no anti-counterfeit means that can reliably prevent imitation of a semiconductor device has been found. The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a resin-encapsulated semiconductor device provided with an anti-counterfeit function that makes imitation difficult.

  A resin-encapsulated semiconductor device having a counterfeit prevention function of the present invention is obtained by encapsulating a semiconductor element with an encapsulating resin composition, and the encapsulating resin composition contains at least a phosphorescent material. It is characterized by this.

  Another resin-encapsulated semiconductor device having an anti-counterfeit function of the present invention is obtained by encapsulating a semiconductor element with an encapsulating resin composition, and the encapsulating resin composition is colored other than black. The laser marking is given to the surface.

  Still another resin-encapsulated semiconductor device having an anti-counterfeit function of the present invention is obtained by encapsulating a semiconductor element with an encapsulating resin composition, and (1) the encapsulating resin composition is (2) The sealing resin composition contains a phosphorescent material, (3) The specific surface of the sealing resin composition is satin or peculiar. The remaining surface other than the specific surface is a glossy surface or a specific surface different from the specific surface, and (4) a molding metal in which a concave portion or a convex portion is formed at a specific portion on the inner surface. The sealing resin composition is sealed using a mold, (5) the surface of the sealing resin composition is laser-marked, and ( 6) The sealing resin composition is cut or polished. It cut surface or polished surface is what is exposed, is characterized in that at least three of imitation preventing means selected are subjected from the.

  According to the present invention, in the resin-encapsulated semiconductor device in which the semiconductor element is encapsulated with the encapsulating resin composition, by applying anti-counterfeiting means for containing the phosphorescent material in the encapsulating resin composition, or By applying anti-counterfeiting means for performing laser marking on the sealing resin composition colored other than black, or applying at least three anti-counterfeiting means selected from seven specific types of anti-counterfeiting means Therefore, it is difficult to imitate the resin-encapsulated semiconductor device, and the resin-sealed semiconductor device can be suitably used for a payment card or the like.

  Hereinafter, the present invention will be described in detail. First, individual forgery preventing means applied to the resin-encapsulated semiconductor device having the forgery preventing function of the present invention will be described. In the following, first, the anti-counterfeiting means (1) to (2) related mainly to the composition of the sealing resin composition will be described, and then the other anti-counterfeiting means (3) to (6) will be described.

(1) Imitation preventing means for coloring the sealing resin composition other than black.
This imitation prevention means makes imitation difficult by coloring the sealing resin composition to a color other than black. That is, normally, the sealing resin composition used for sealing the semiconductor element is black because it contains carbon or the like. In addition, those other than black are used for special purposes. For example, a white material is used for sealing the photocoupler, a green material is used to distinguish between the positive and negative electrodes of the transistor, and a brown material is used for the capacitor. Since the use other than these is black, by coloring the sealing resin composition other than black, imitation becomes difficult, and discrimination between the genuine product and the imitation product becomes easy. In addition, by using together the anti-counterfeiting means for applying laser marking to the surface of the sealing resin composition of (5) described later, the laser marking portion is unique due to the component of the colorant used for coloring. Due to the color development, imitation can be made more difficult.

  FIG. 1 schematically shows an example of a resin-encapsulated semiconductor device in which the encapsulating resin composition is colored other than black. A resin-encapsulated semiconductor device 1 shown in FIG. 1 shows a SIP (Single Inline Package) as an example, and a semiconductor chip 3 is mounted on a die pad 2, and external connection electrodes and leads (not shown) of the semiconductor chip 3. The frame 4 is electrically connected by a bonding wire 5. Further, the die pad 2, the semiconductor chip 3, the lead frame 4, and the bonding wire 5 are sealed with a sealing resin composition 10. And this resin composition 10 for sealing is colored other than black.

  The sealing resin composition 10 can be colored by adding a colorant, and known dyes and pigments can be used as the colorant. The dye and the pigment may be contained alone or both in the encapsulating resin composition.

  Examples of the dye include azo dyes, anthraquinone dyes, indigoid dyes, sulfur dyes, triphenylmethane dyes, pyrazolone dyes, stilbene dyes, diphenylmethane dyes, xanthene dyes, alizarin dyes, acridine dyes, quinoneimine dyes (azine dyes, oxazine dyes, thiazines) Dyes), thiazole dyes, methine dyes, nitro dyes, nitroso dyes and the like.

  Examples of the pigment include organic pigments and inorganic pigments, and examples of the organic pigment include natural organic pigments and synthetic organic pigments. Examples of natural organic pigments include vegetable pigments, animal pigments, and mineral pigments. Synthetic organic pigments include dyed lake pigments, soluble azo pigments, insoluble azo pigments, condensed azo pigments, azo complex salt pigments, and phthalocyanine pigments. And condensed multiple-reduced pigments and fluorescent pigments. Examples of inorganic pigments include natural inorganic pigments and synthetic inorganic pigments, and examples of natural inorganic pigments include earth-based pigments, calcined soil, and mineral pigments. Examples of the synthetic inorganic pigment include oxide pigments, hydroxide pigments, sulfide pigments, silicate pigments, phosphate pigments, carbonate pigments, metal powder pigments, and carbon pigments.

  Specific examples of the colorant used in the present invention include carbon black, titanium white, and iron oxide. The preferable content of these materials is 0.1% by weight or less of carbon black, 3% by weight to 15% by weight of titanium white, and 0.5% by weight or more of iron oxide in the entire sealing resin composition. % By weight or less.

(2) Counterfeit prevention means for containing a phosphorescent material in the sealing resin composition.
This forgery prevention means contains a phosphorescent material in the sealing resin composition in the resin-encapsulated semiconductor device. By including a phosphorescent material in the encapsulating resin composition, imitation becomes difficult, and since light is emitted in the dark place, discrimination between the genuine product and the imitation product is facilitated.

  FIG. 2 schematically shows an example of a resin-encapsulated semiconductor device in which a phosphorescent material is contained in the encapsulating resin composition. The basic structure of the resin-encapsulated semiconductor device 1 shown in FIG. 2 is the same as that of the resin-encapsulated semiconductor device 1 shown in FIG. 1, but the phosphorescent material 21 is contained in the encapsulating resin composition 10. Is different.

  As the phosphorescent material 21, a known phosphorescent material can be used, and examples thereof include strontium aluminate, calcium aluminate, zinc sulfide, calcium sulfide and the like. The average particle diameter of the phosphorescent material is not particularly limited, but for example, those having an average particle diameter of 2 μm or more and 60 μm or less are preferable. As such a phosphorescent material 21, a commercially available material can be used, for example, trade names G-300, GLL-300, V-300 (manufactured by Nemoto Special Chemical Co., Ltd.), and the like.

  In order to apply the anti-counterfeiting means of (1) to (2) to the encapsulating resin composition, the imitation of (1) to (2) above is prepared during the preparation of the encapsulating resin composition before curing. What is necessary is just to mix | blend the colorant other than black about the component which concerns on a prevention means, ie, the anti-counterfeiting means of (1), and the luminous material about the anti-counterfeiting means of (2), respectively.

  The blending amount of the colorant and the phosphorescent material is not necessarily limited, but in the whole sealing resin composition, the colorant is 0.1% by weight in the case of carbon black as described above. Hereinafter, in the case of titanium white, 3 to 15% by weight, in the case of iron oxide, 0.5 to 5% by weight, and generally other than 0.1 to 5% % Or less, and the phosphorescent material is preferably 2% by weight or more and 30% by weight or less. When the blending amount of the colorant or the phosphorescent material is less than the above lower limit value, there is a possibility that a sufficient anti-counterfeit function, that is, coloring or light emission cannot be obtained.

  Moreover, as components other than the component which concerns on the forgery prevention means of said (1)-(2) used for preparation of the resin composition for sealing, well-known for sealing used for sealing of a general semiconductor element The same components as those used for preparing the resin composition can be used. Examples of such components include epoxy resins, phenol resin curing agents, curing accelerators, and inorganic fillers.

  Epoxy resins include phenol novolac type epoxy resins, cresol novolac type epoxy resins, triphenolmethane type epoxy resins, alkyl-modified triphenolmethane type epoxy resins, triazine nucleus-containing epoxy resins, dicyclopentadiene type epoxy resins, and stilbene type epoxy resins. Biphenyl type epoxy resin, heterocyclic type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, condensed ring aromatic hydrocarbon-modified epoxy resin, alicyclic type epoxy resin and the like. These epoxy resins may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  Any phenolic resin curing agent can be used without particular limitation as long as it has two or more phenolic hydroxyl groups in the molecule that can react with the epoxy group of the epoxy resin. Specifically, novolak-type phenol resins obtained by reacting phenols such as phenol and alkylphenol with formaldehyde or paraformaldehyde, such as phenol novolak resins and cresol novolak resins, these modified resins such as epoxidation or butylated Novolak-type phenol resins, dicyclopentadiene-modified phenol resins, para-xylene-modified phenol resins, condensates of phenols with benzaldehyde, naphthyl aldehyde, and the like, triphenolmethane compounds, polyfunctional phenol resins, and the like. These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  The phenol resin curing agent usually has a ratio (a) / (b) between the number of epoxy groups (a) of the epoxy resin and the number of phenolic hydroxyl groups (b) of the phenol resin curing agent of 0.65 to 1. It is preferable to mix | blend in the range used as 5, and it is more preferable to mix | blend in the range used as 0.8-1.2.

  Curing accelerators include trimethylphosphine, triethylphosphine, tributylphosphine, triphenylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, methyldiphenylphosphine, dibutylphenylphosphine, tricyclohexylphosphine, bis (diphenyl). Organic phosphine compounds such as phosphino) methane, 1,2-bis (diphenylphosphino) ethane, tetraphenylphosphonium tetraphenylborate, triphenylphosphinetetraphenylborate, triphenylphosphinetriphenylborane, 1,8-diazabicyclo [5 , 4,0] undecene-7 (DBU), triethylamine, triethylenediamine, benzyldimethylamine, α-methylbenzyldimethylamido , Amine compounds such as triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, 2-heptadecylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole 4-methylimidazole, 4-ethylimidazole, 2-phenyl-4-hydroxymethylimidazole, 2-enyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 2-phenyl-4-methyl-5-hydroxy Examples thereof include imidazole compounds such as methylimidazole and 2-phenyl-4,5-dihydroxymethylimidazole.

  As the inorganic filler, although not necessarily limited, fused silica and crystalline silica are preferable. Further, such fused silica and crystalline silica preferably have a low impurity concentration, and those having an average particle diameter of about 1 to 40 μm are preferable. This inorganic filler is preferably blended in an amount of 80 to 95% by weight in the sealing resin composition. Generally, if the blending amount of the inorganic filler is less than 80% by weight of the entire composition, the flame retardancy and moisture resistance reliability are lowered. On the other hand, when it exceeds 95% by weight, the fluidity of the composition is remarkably lowered, and the moldability and fillability become poor.

  In addition to the above-described components, the sealing resin composition is prepared by using a silane coupling agent, a synthetic wax, a natural wax, a linear aliphatic metal salt, an acid amide, Release agents such as esters, colorants such as carbon black, low stress imparting agents such as rubber and silicone polymers, antioxidants such as 2,6-dibutyl-4-methylphenol, etc., as necessary Can be used.

Below, the preparation example of the resin composition for sealing in the case of employ | adopting the forgery prevention means which contains the luminous material of said (2) is shown.
・ Epoxy resin 100 g (10 wt%); EDCN195XL (Sumitomo Chemical Co., Ltd.)
・ Phenolic resin 50g (5wt%); BRG577 (Showa High Polymer Co., Ltd.)
・ Imidazole catalyst 10g (1wt%); 244MZ (Shikoku Chemicals)
・ Carnauba wax 30g (3wt%)
・ Fused silica 780 g (78 wt%); spherical fused silica (average particle size 20 μm)
・ Luminescent material 25g (2.5wt%); G300 (manufactured by Nemoto Special Industrial Chemical Co., Ltd.)
・ Carbon 5g (0.5wt%)

  In preparing such a sealing resin composition as a molding material, in addition to the above-described epoxy resin, phenol resin curing agent, curing accelerator, inorganic filler, etc., the above (1) to (2) The components relating to the anti-counterfeiting means are blended and sufficiently mixed with a mixer or the like, then melt-kneaded with a hot roll or a kneader, etc., cooled and pulverized to an appropriate size. Then, by using a low-pressure transfer method or the like and sealing the semiconductor element with this molding material, it is possible to obtain a resin-encapsulated semiconductor device to which each of the anti-counterfeiting means (1) to (2) is applied. .

  Next, the forgery prevention means other than the forgery prevention means (1) to (2) related to the composition of the sealing resin composition will be described.

(3) Counterfeit prevention means in which the specific surface of the sealing resin composition is a satin surface or a peculiar place, and the remaining surface other than the specific surface is a glossy place or a peculiar place different from the peculiar place.
This imitation prevention means uses a specific surface of the resin composition for sealing in a resin-encapsulated semiconductor device as a satin surface or a specific surface, and a remaining surface other than the specific surface as a glossy surface or a specific surface different from the specific surface Thus, it is possible to make imitation difficult as compared with a conventional resin-encapsulated semiconductor device in which substantially the entire surface of the encapsulating resin composition has the same surface state. The pear texture refers to a surface treated to have a rough texture such as the surface of a pear, and the peculiar texture refers to a texture other than a glossy or pear texture.

  FIG. 3 schematically shows an example in which the specific surface of the encapsulating resin composition in the resin-encapsulated semiconductor device is a satin surface and the remaining surface is a glossy surface. In the resin-encapsulated semiconductor device 1 shown in FIG. 3, the upper surface 11 and the inclined surface 12 of the encapsulating resin composition 10 are used as a specific surface, and the other front surface 13, back surface 14, and left and right side surfaces 15 are the remaining surface. As a glossy place.

  In the example shown in FIG. 3, the upper surface 11 and the inclined surface 12 are used as the pear surface, but the specific surface that is used as the pear surface is not limited to the upper surface 11 and the inclined surface 12, and the front surface 13, the back surface 14, A surface selected from the left and right side surfaces 15 may be a specific surface. In the example shown in FIG. 3, the two surfaces of the upper surface 11 and the inclined surface 12 are specified surfaces. However, for example, only one surface such as only the upper surface 11 or only the inclined surface 12 may be specified surfaces. Two or more surfaces may be specified surfaces. Further, in the example shown in FIG. 3, the entire upper surface 11 and the inclined surface 12 are specified surfaces, but only a part of each surface such as only a part of the upper surface 11 or only a part of the inclined surface 12 is used. Can also be a specific surface.

  As a method of setting the specific surface of the sealing resin composition 10 to a satin surface or the like and making the other remaining surface a glossy surface or the like, for example, it is used when the semiconductor element 3 or the like is sealed with the sealing resin composition 10. Examples of the molding die include a method in which a contact portion with a specific surface, such as a satin surface of the resin-encapsulated semiconductor device 1, of the inner surface is used as a satin pattern. By filling the sealing resin composition 10 in such a molding die and sealing the semiconductor element 3 or the like, a ground pattern such as a satin on the inner surface of the molding die is sealed. It can be transferred to a specific surface of the composition 10. As another method, after sealing the semiconductor element 3 or the like with the sealing resin composition 10 using a normal molding die in which a ground pattern such as satin is not formed on the inner surface, A method of forming a ground pattern such as satin using a known surface treatment method on the specific surface of the encapsulating resin composition 10 after sealing is exemplified.

(4) Imitation preventing means for sealing with a sealing resin composition using a molding die in which a concave portion or a convex portion is formed at a specific portion.
This forgery prevention means seals using a molding die used when sealing a semiconductor element or the like with a sealing resin composition, with a concave or convex portion formed in a specific portion of the inner surface. Is to do. The sealing resin composition corresponding to the concave portion or the convex portion of the molding die is sealed by using the molding die in which the concave portion or the convex portion is formed in a specific portion of the inner surface in this way. A convex part or a concave part can be formed in this part. Thus, the entire surface of the sealing resin composition as in the conventional resin-encapsulated semiconductor device is formed by forming a convex portion or a concave portion in the portion of the encapsulating resin composition in the resin-encapsulated semiconductor device. As compared with a flat plate, imitation can be made difficult.

  FIG. 4 schematically shows an example of a resin-encapsulated semiconductor device in which a recess is formed on the surface of the encapsulating resin composition in the resin-encapsulated semiconductor device. The resin-encapsulated semiconductor device 1 shown in FIG. 4 is provided with a groove-like recess 23 extending in the vertical direction on the front surface 13 of the encapsulating resin composition 10. Here, the groove-like recess 23 has a depth reaching from the surface of the front surface 13 to an intersection line where the upper surface 11 and the inclined surface 12 intersect. In addition, such a recessed part 23 can change a shape, a magnitude | size, a depth, etc. suitably in the range which does not impair the function of the resin-sealed semiconductor device 1.

  The concave portion 23 in such a resin-encapsulated semiconductor device 1 is a predetermined mold on its inner surface as a molding die used when the semiconductor element 3 or the like is encapsulated with the encapsulating resin composition 10 as described above. It can manufacture by using the thing in which the convex part was formed in the position.

(5) Counterfeit prevention means for applying laser marking to the surface of the sealing resin composition.
This forgery prevention means makes imitation difficult by applying laser marking to the surface of the sealing resin composition in the resin-encapsulated semiconductor device and displaying characters, symbols, and the like. This anti-counterfeiting means is further effective in preventing counterfeiting when used in combination with the anti-counterfeiting means for coloring the sealing resin composition of (1) other than black. That is, it can be said that the color matching itself of the encapsulating resin composition can be costly and time consuming. However, by performing laser marking on the sealing resin composition colored other than black, the part where the laser marking has been performed is derived from the components of the colorant used for coloring. Therefore, in the case of imitation, in addition to the color matching of the sealing resin composition, color matching by laser marking must be performed, and imitation can be extremely difficult.

  FIG. 5 schematically shows an example in which laser marking is performed on the surface of the encapsulating resin composition in the resin-encapsulated semiconductor device. In the resin-encapsulated semiconductor device 1 shown in FIG. 5, a mark display 24 by laser marking is performed on the end portion of the upper surface 11. The mark display 24 by such laser marking is desired to perform the mark display 24 in the encapsulating resin composition 10 after encapsulating the semiconductor element 3 and the like with the encapsulating resin composition 10. This portion can be performed by irradiating a known laser beam such as a YAG laser to this portion.

(6) Imitation preventing means for cutting or polishing the sealing resin composition and exposing the cut surface or the polished surface.
This imitation preventing means is for sealing a semiconductor element with a sealing resin composition and then cutting or polishing a part of the sealing resin composition to expose the cut surface or the polished surface. It is extremely difficult to imitate a cut surface or a polished surface obtained by cutting or polishing a sealing resin composition after sealing a semiconductor element, which makes it difficult to imitate.

  FIG. 6 schematically shows a state in which the sealing resin composition in the resin-encapsulated semiconductor device is cut and the cut surface is exposed. The resin-encapsulated semiconductor device 1 shown in FIG. 6 is obtained by cutting the upper side of the encapsulating resin composition 10 and exposing the cut surface 16. In the figure, the portion indicated by a dotted line is a portion removed by cutting.

  The location where the sealing resin composition 10 is cut and polished is not necessarily limited, and the die pad 2, the semiconductor chip 3, and the lead frame located inside depending on the shape and size of the sealing resin composition 10. 4 and the bonding wire 5 can be selected as appropriate as long as the functions of the bonding wire 5 and the like are not impaired.

  Such cutting of the sealing resin composition 10 can be performed by using a rotating blade or the like after the semiconductor element 3 or the like is sealed with the sealing resin composition 10. Further, the polishing of the sealing resin composition 10 can also be performed using a known device polishing apparatus after the semiconductor element 3 and the like are sealed with the sealing resin composition 10.

  Next, a resin-encapsulated semiconductor device having the anti-counterfeit function of the present invention, to which the anti-counterfeit means (1) to (6) are applied, will be described.

  The resin-encapsulated semiconductor device having the first anti-counterfeit function of the present invention is one in which an anti-counterfeit means for containing a phosphorescent material in the sealing resin composition of (2) above is applied. The resin-encapsulated semiconductor device having the first anti-counterfeit function corresponds to the resin-encapsulated semiconductor device having the anti-counterfeit function described in claim 1 of the claims.

  FIG. 2 schematically shows a resin-encapsulated semiconductor device having a first anti-counterfeit function according to the present invention. The resin-encapsulated semiconductor device 1 shown in FIG. 2 includes a resin composition 10 for encapsulation and a phosphorescent material 21 contained therein. According to such a thing, since the phosphorescent material 21 is contained, imitation is extremely difficult, and since light is emitted in a dark place, it is easy to distinguish between an intrinsic product and an imitation product.

  Moreover, the resin-encapsulated semiconductor device having the second anti-counterfeit function of the present invention includes an anti-counterfeiting means for coloring the sealing resin composition of (1) other than black, and the sealing of (5) above. And imitation preventing means for applying laser marking to the surface of the resin composition. The resin-encapsulated semiconductor device having the second anti-counterfeit function corresponds to the resin-encapsulated semiconductor device having the anti-counterfeit function described in claim 2 of the claims.

  According to the second resin-encapsulated semiconductor device having the anti-counterfeit function of the present invention, since laser marking is performed on the sealing resin composition colored other than black, a portion where the laser marking is performed is performed. In the case of creating a unique color from the components of the colorant used for coloring and imitating it, color matching by laser marking must be performed in addition to color matching of the sealing resin composition. Imitation is extremely difficult.

  Moreover, the resin-encapsulated semiconductor device having the third anti-counterfeit function of the present invention is one in which three or more anti-counterfeit means are applied among the anti-counterfeit means of (1) to (6) above. . According to the third embodiment of the resin-encapsulated semiconductor device having the anti-counterfeit function of the present invention, three or more anti-counterfeit means are provided among the anti-counterfeit means (1) to (6). Is extremely difficult.

  The combination of the anti-counterfeiting means (1) to (6) is not particularly limited, and the kind of anti-counterfeiting means is appropriately selected according to the desired difficulty of imitation and the shape of the resin-encapsulated semiconductor device. , Number etc. can be selected. In general, as the number of counterfeit prevention means applied increases, the counterfeiting becomes more difficult. Therefore, in order to make the counterfeiting difficult, it is preferable to increase the number of counterfeit prevention means.

  The resin-encapsulated semiconductor device shown in FIG. 7 is obtained by combining the anti-counterfeiting means (3), (4) and (5). That is, in the resin-encapsulated semiconductor device 1 shown in FIG. 7, the upper surface 11 and the inclined surface 12 are pear-finished as specific surfaces, and the other front surface 13, back surface 14, and left and right side surfaces 15 are glossy surfaces as remaining surfaces. Thus, the anti-counterfeiting means (3) is applied. Further, the upper surface 11 is provided with a concave portion 25 having a rectangular planar shape, and this concave portion 25 is formed by using a molding die in which a convex portion is formed on a portion corresponding to the concave portion 25 on the inner surface. The anti-counterfeiting means (4) is applied in that it is formed by sealing. Furthermore, the anti-counterfeiting means (5) is applied in that the mark 25 is displayed on the bottom 25b of the recess 25 by laser marking.

  Such a resin-encapsulated semiconductor device 1 can be manufactured, for example, as follows. That is, as a molding die used when the semiconductor element 3 or the like is sealed with the sealing resin composition 10, a portion in contact with the upper surface 11 and the inclined surface 12 of the resin-encapsulated semiconductor device 1 among its inner surface. Is a satin finish, and a convex portion is formed at a portion corresponding to the rectangular concave portion 25. The convex portion provided on the inner surface of the molding die has, for example, a glossy surface.

  By using such a molding die, the semiconductor element 3 and the like are sealed with the sealing resin composition 10, whereby a satin pattern is transferred to the upper surface 11 and the inclined surface 12 of the sealing resin composition 10. At the same time, a rectangular recess 25 is formed in the upper surface 11. At this time, since the surface of the convex part of the molding die is glossy, the bottom 25b of the rectangular concave part 25 of the sealing resin composition 10 corresponding to this is also glossy. Then, the mark display 24 can be performed by irradiating a known laser beam such as a YAG laser to the bottom 25b of the rectangular recess 25 of the sealing resin composition 10 after sealing. it can.

  As described above, the example in which three or more of the anti-counterfeiting means (1) to (6) are combined is described by taking the resin-encapsulated semiconductor device 1 shown in FIG. 7 as an example. The combination of the anti-counterfeiting means (6) is not limited to these. For example, in the one shown in FIG. 7, the sealing resin composition 10 is further colored or the sealing resin composition 10 In addition, the phosphorescent material 21 can be contained in the material, and the combination of the anti-counterfeiting means, the number of combinations, and the like can be appropriately selected according to the desired difficulty of imitation.

  In each of the above explanations, the SIP (Single Inline Package) has been described as an example of the resin-encapsulated semiconductor device, but the resin-encapsulated semiconductor device to which the present invention is applied is not necessarily limited to such a device. For example, DIP (Dual Inline Package), SOP (Small Outline Package), TSOP (Thin Small Outline Package), QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), LQFP (Low Profile Quad Flat Flat) Package) or the like.

The external view which shows typically the resin-sealed semiconductor device to which the forgery prevention means of (1) was applied. External view schematically showing a resin-encapsulated semiconductor device to which the anti-counterfeit means (2) is applied (external view schematically showing a resin-encapsulated semiconductor device having a first anti-counterfeit function of the present invention) . The external view which shows typically the resin-sealed semiconductor device to which the forgery prevention means of (3) was applied. The external view which shows typically the resin-sealed semiconductor device to which the forgery prevention means of (4) was applied. The external view which shows typically the resin-sealed semiconductor device to which the forgery prevention means of (5) was applied. The external view which shows typically the resin-sealed semiconductor device to which the forgery prevention means of (6) was applied. The external view which shows typically the resin sealing type semiconductor device which has the 3rd forgery prevention function of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Resin sealing type semiconductor device, 2 ... Die pad, 3 ... Semiconductor chip, 4 ... Lead frame, 5 ... Bonding wire, 10 ... Resin composition for sealing, 11 ... Upper surface, 12 ... Slope, 13 ... Front surface, 14 ... back, 15 ... side, 21 ... phosphorescent material, 23 ... concave, 24 ... mark display, 25 ... concave (25b ... bottom)

Claims (3)

A resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an encapsulating resin composition,
A resin-encapsulated semiconductor device having a forgery prevention function, wherein the encapsulating resin composition contains at least a phosphorescent material. A resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an encapsulating resin composition,
A resin-encapsulated semiconductor device having an anti-counterfeit function, wherein the encapsulating resin composition is colored other than black, and the surface thereof is laser-marked. A resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an encapsulating resin composition,
(1) The sealing resin composition is colored other than black, (2) the sealing resin composition contains a phosphorescent material, (3) the sealing The specific surface of the resin composition is a satin surface or a specific surface, and the remaining surface other than the specific surface is a glossy surface or a specific surface different from the specific surface, (4) a specific portion of the inner surface The sealing resin composition is sealed using a molding die in which concave or convex portions are formed. (5) Laser marking is on the surface of the sealing resin composition. And (6) at least three imitations selected from the following: (6) the sealing resin composition is cut or polished, and the cut surface or the polished surface is exposed. Imitation characterized by prevention measures Resin-sealed semiconductor device having a stop function.

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