JPH0352944A - Epoxy resin composition suitable for laser printing - Google Patents
Epoxy resin composition suitable for laser printingInfo
- Publication number
- JPH0352944A JPH0352944A JP1185879A JP18587989A JPH0352944A JP H0352944 A JPH0352944 A JP H0352944A JP 1185879 A JP1185879 A JP 1185879A JP 18587989 A JP18587989 A JP 18587989A JP H0352944 A JPH0352944 A JP H0352944A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- laser
- lead
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 37
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 18
- 238000007648 laser printing Methods 0.000 title abstract description 4
- PILZURBRZMGGDO-UHFFFAOYSA-L lead(2+) oxido hydrogen carbonate Chemical compound [Pb+2].OC(=O)O[O-].OC(=O)O[O-] PILZURBRZMGGDO-UHFFFAOYSA-L 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- 239000000945 filler Substances 0.000 claims abstract 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 6
- 238000007639 printing Methods 0.000 abstract description 5
- 239000011342 resin composition Substances 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 abstract description 4
- 229910002026 crystalline silica Inorganic materials 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- LFFJDSRGGLYSKO-UHFFFAOYSA-K C([O-])([O-])=O.O[Pb+2] Chemical compound C([O-])([O-])=O.O[Pb+2] LFFJDSRGGLYSKO-UHFFFAOYSA-K 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 229960004887 ferric hydroxide Drugs 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気電子部品の絶縁被覆に用いられ、レーザ
ーの照射によりその絶縁被覆表面に鮮明な印字を施すこ
とのできるレーザー印字に通したエポキシ樹脂組底物に
関するものである．〔従来の技術〕
従来、エポキシ樹脂組底物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクが用いられている
が、工程の合理化を目的としてより短時間で印字できる
方法が要求されている．
この対応方法の１つとして、レーザーの照射による印字
システムが注目されている．このレーザー印字システム
は、文字やパターン状にレーザーを照射された部分が熱
エネルギーにより変色する、あるいは照射された部分が
昇華し表面粗化され、光の散乱によって文字やパターン
が識別できるものであり、この方法の印字時間は０．０
１秒以下であり、従来の熱あるいは紫外線硬化性のイン
クが硬化に数分〜数ＩＯ分を必要とするのに比べ、大幅
に短縮されるものである．
しかし、従来のエポキシ樹脂Ｕ戒物の絶縁被覆にレーザ
ーを照射した場合、単に被覆表面を粗化するのみで、変
色がおこらず、鮮明な文字やパターンを印字することが
できなかった．
最近、従来のエポキシ樹脂組威物に黄色の水酸化第二鉄
を含有させるとレーザー照射によって黄色から褐色に変
色することが見い出された （特開＠６２−５０３６０
公報）．
しかし、水酸化第二鉄は黄色であるため、黄、橙色のよ
うな色相にしか用いることができず、青や緑色の下地、
特に淡色系の下地に黒色のレーザー印字を施すことが、
これからの課題とされてきた．
〔発明が解決しようとする課題〕
本発明は、従来不可能であった青や赤、緑等の明色から
レーザーにより黒色に変色する樹脂＆ｌｌ戒物を得んと
して鋭意検討した結果、ヒドロオキシ炭酸鉛を含有させ
るとレーザーを照射した際白色から黒色に変色すること
を見出し、更にこの知見に基づき種々研究を進めて本発
明を完戒するに至ったものである．
本発明の目的とするところは電気的特性および他の諸特
性を低下させることなく、レーザーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂組成物を提供することにある．
〔諜題を解決するための手段〕
本発明は、ヒドロオキシ炭酸鉛を含有することを特徴と
するレーザー印字に通したエポキシ樹脂組威物に関する
ものである．
本発明のエポキシ樹脂組成物にヒドロオキシ炭酸鉛を用
いる理由を以下述べる．
ヒドロオキシ炭酸鉛は白色の粉末であり、加熱すると２
００〜３５０℃で脱水及び脱炭酸し酸化鉛（ＩＶ）に，
変化し、黒色となる．
従って、ヒドロオキシ炭酸鉛を含有したエポキシ樹脂組
底物に対し文字やパターン状にレーザーを照射すると、
樹脂表面がレーザーの熱エネルギーにより加熱され、樹
脂中に含有されたヒドロオキシ炭酸鉛が上記化学反応を
生じ黒色となる。すなわちレーザーに照射された部分の
み黒色となり、照射されない部分は白色のままのため、
白色の下地に黒色の文字やパターンを鮮明に印字するこ
とができる．
本発明に用いられるヒドロオキシ炭酸鉛の粒度は平均粒
径が１００μｍ以下であることが好ましい．その理由は
エポキシ樹脂組成物にヒドロオキシ炭酸鉛を混合分散さ
せた際、１００μｍ以上の平均粒径では電子電気部品に
被覆させた際表面に斑点状となり、部品の商品価値を低
下させるばかりでなく、分散が不充分となりやすく、レ
ーザーが照射された際、ヒドロオキシ炭酸鉛が存在しな
い部分では変色がおこらず、文字やパターンがとぎれ鮮
明な印字ができなくなる場合がある．なお、この平均粒
径はコールターカウンター（日科機■製）により得られ
る粒度分布を重量平均することにより求めるのが適当で
あるが、コールターカウンター以外の測定方法により求
めてもよい．
ヒドロオキシ炭酸鉛の含有量としては０．５〜２Ｏ重量
％が好ましい．この理由は、含有量が０． ５重量％以
下では、レーザーが照射されても変色する度合が小さく
鮮明な印字とならず、一方、２０重量％を越えると、樹
脂組戒物の電気絶縁性が低下し電子電気部品用絶縁材料
としての本来の性能を満足しにくくなるためである．
本発明に用いられるエポキシ樹脂としては、例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂等のジクリシジルエーテル型エポキシ樹脂、フ
ェノールノボラック型エポキシ樹脂、タレゾールノボラ
ック型エポキシ樹脂等のノボラック型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、グリシジルア竃ン型
エポキシ樹脂、線状脂肪族型エポキシ樹脂、被素環型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂等があげられるが
、これらに限定されるものではない．本発明に用いられ
る硬化剤および硬化促進剤としては、酸無水物、ポリア
ミン、ノボラック型フェノール樹脂、第３級アミン、イ
ミダゾール化合物等があるが、いずれを用いてもよい。[Detailed Description of the Invention] [Industrial Application Field] The present invention is used for insulating coatings of electrical and electronic components, and is capable of clearly marking the surface of the insulating coating by laser irradiation. This article concerns epoxy resin soles. [Prior Art] Conventionally, thermosetting ink or ultraviolet curable ink has been used to mark characteristics and model numbers on electrical and electronic components insulated with epoxy resin bottoms. , there is a need for a method that can print in a shorter time to streamline the process. As one way to address this issue, a printing system that uses laser irradiation is attracting attention. In this laser printing system, the part of the text or pattern that is irradiated with the laser changes color due to thermal energy, or the part that is irradiated sublimates and becomes roughened, and the text or pattern can be identified by the scattering of light. , the printing time of this method is 0.0
The curing time is less than 1 second, which is significantly shorter than conventional heat or ultraviolet curable inks, which require several minutes to several IO minutes to cure. However, when laser irradiation was applied to the conventional epoxy resin insulating coating of U-Kaimono, the coating surface was simply roughened, no discoloration occurred, and clear characters and patterns could not be printed. Recently, it has been discovered that when yellow ferric hydroxide is added to a conventional epoxy resin composite, the color changes from yellow to brown when irradiated with a laser (JP-A-62-50360
Public bulletin). However, since ferric hydroxide is yellow, it can only be used for hues such as yellow and orange;
In particular, black laser printing on a light-colored base is
This has been considered a future issue. [Problems to be Solved by the Invention] The present invention was developed as a result of intensive research aimed at obtaining a resin that changes color from bright colors such as blue, red, and green to black using a laser, which was previously impossible. They discovered that when lead is added, the color changes from white to black when irradiated with a laser, and based on this knowledge, various studies were conducted and the present invention was completed. An object of the present invention is to provide an epoxy resin composition that provides a cured product that can be clearly printed on the resin surface by laser irradiation without degrading electrical properties or other properties. be. [Means for Solving the Problem] The present invention relates to a laser-printed epoxy resin composite characterized by containing lead hydroxy carbonate. The reason for using lead hydroxy carbonate in the epoxy resin composition of the present invention will be described below. Hydroxylead carbonate is a white powder that, when heated, produces 2
Dehydrated and decarboxylated at 00 to 350℃ to lead (IV) oxide,
It changes and becomes black. Therefore, when a laser beam is irradiated on an epoxy resin bottom containing hydroxylead carbonate in the form of letters or patterns,
The resin surface is heated by the thermal energy of the laser, and the hydroxylead carbonate contained in the resin undergoes the above chemical reaction, resulting in a black color. In other words, only the part that is irradiated by the laser becomes black, and the part that is not irradiated remains white.
It is possible to clearly print black characters and patterns on a white background. The average particle size of the hydroxylead carbonate used in the present invention is preferably 100 μm or less. The reason for this is that when hydroxylead carbonate is mixed and dispersed in an epoxy resin composition, if the average particle size is 100 μm or more, it will not only cause spots on the surface when coated on electronic and electrical parts, but also reduce the commercial value of the parts. Dispersion tends to be insufficient, and when irradiated with a laser, discoloration does not occur in areas where hydroxylead carbonate is not present, and characters and patterns may be interrupted and clear printing may not be possible. The average particle diameter is suitably determined by weight-averaging the particle size distribution obtained using a Coulter Counter (manufactured by Nikkaki ■), but it may also be determined by a measuring method other than the Coulter Counter. The content of lead hydroxy carbonate is preferably 0.5 to 20% by weight. The reason for this is that the content is 0. If it is less than 5% by weight, the degree of discoloration will be small even when laser is irradiated, and clear printing will not be possible.On the other hand, if it exceeds 20% by weight, the electrical insulation properties of the resin composite material will decrease, making it difficult to use as an insulating material for electronic and electrical parts. This is because it becomes difficult to satisfy the original performance. Examples of the epoxy resin used in the present invention include dicrycidyl ether type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolac type epoxy resins such as phenol novolac type epoxy resin, and Talesol novolac type epoxy resin; Examples include, but are not limited to, glycidyl ester type epoxy resins, glycidyl ester type epoxy resins, linear aliphatic type epoxy resins, cyclic epoxy resins, and halogenated epoxy resins. As the curing agent and curing accelerator used in the present invention, there are acid anhydrides, polyamines, novolac type phenolic resins, tertiary amines, imidazole compounds, etc., and any of them may be used.
又必要により公知の無機充填剤、たとえばジルコン粉末
、タルク粉末、結晶シリカ粉末、溶融シリカ粉末、炭酸
カルシウム粉末、マグネシア粉末、ケイ酸カルシウム粉
末、水和アル果ナ粉末、アルミナ粉末等を配合してもよ
い．
本発明により得られる樹脂組成物はしドロオキシ炭酸鉛
の色調により通常白色を呈するため、赤、青、緑、黒色
等の顔料を併用できる．
本発明の樹脂組戒物は注型材料等の液状、粉体塗料等の
粉状、戒型材料等の顆粒状、塊状等いずれの状態でもよ
い．
本発明の樹脂組戒物を製造する方法として、例えば粉体
塗料の場合をあげると、所定の割合で秤量した原料威分
をミキサーによって充分混合したのち、エキストルーダ
ー、コニーダーあるいはロール等で溶融混練し、次いで
粉砕機にて粉砕する方法等がある．上記方法により得ら
れた粉体塗料により電子電気部品の絶縁被覆を行う方法
としては、流動浸漬法、静電流動浸漬法、ころがし法、
ふりかけ法、ホットスプレー法、静電スプレー法等一般
の粉体塗装方法が用いられる．
又、注型材料、戒型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる．〔実施例〕
次に本発明を実施例により更に詳しく説明する．実施例
１
ビスフェノールＡ型エポキシ樹脂
（エポキシ当量９５０） ５０重量部ヒド
ロオキシ炭酸鉛（平均粒径ｌ２μｍ）５重量部結晶シリ
カ粉末 ５０重量部２メチルイミダ
ゾール １重量部上記組戒物を配合し、
ヘンシェルミキサーでブレンドし、コニーダーにて溶融
混練した後、粉砕機で粉砕することにより平均粒径６０
〜７０μｍのエポキシ樹脂組成物の粉体塗料を得た．実
施例２
実施例１において、ヒドロオキシ炭酸鉛の添加量を２０
重量部に替え、他は同様にして平均粒径６０〜７０ｕｍ
のエポキシ樹脂組底物の粉体塗料を得た．
比較例１
実施例１において、ヒドロオキシ炭酸鉛の添加量を０．
１重量部に替え、他は同様にして平均粒径６０〜７０μ
ｍのエポキシ樹脂組戒物の粉体塗料を得た．
比較例２
実施桝１において、ヒドロオキシ炭酸鉛の添加量を５０
重量部に替え、他は同様にして平均粒径６０〜７０ｔＩ
ｍのエポキシ樹脂組威物の粉体塗料を得た．
実施例ｌ、２及び比較例１、２の樹脂組戒物について硬
化物を作製した．
この試料に炭酸ガスレーザー（ウシオ電機■製４００型
レーザーマーク、エネルギー密度６ Ｊｏｕｌｅ／Ｃｔ
＆）を用いて、１００万分の１秒間所定のマスクを通し
てレーザーを照射して、硬化物の表面にマーキングを施
した．
また、上記硬化物の絶縁被覆電圧をＪＩＳＫ６９１１に
より測定した．結果を表−１に示す．表
１
〔発明の効果〕If necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder, hydrated alucina powder, alumina powder, etc., may be blended. Good too. Since the resin composition obtained by the present invention usually exhibits a white color due to the color tone of lead oxyhydrocarbonate, pigments such as red, blue, green, and black can be used in combination. The resin composition of the present invention may be in any of the following forms: liquid such as a cast material, powder such as a powder coating, granules or lumps such as a preform material. For example, in the case of powder coatings, the method for manufacturing the resin composition of the present invention is to thoroughly mix raw materials weighed at a predetermined ratio using a mixer, and then melt-knead them using an extruder, co-kneader, roll, etc. There are methods such as first grinding and then pulverizing in a pulverizer. Methods for insulating coating electronic and electrical parts with the powder coating obtained by the above method include fluid dipping method, electrostatic dynamic dipping method, rolling method,
General powder coating methods such as sprinkle method, hot spray method, and electrostatic spray method are used. In addition, cast materials and molded materials can be manufactured using known techniques and used as insulating materials. [Example] Next, the present invention will be explained in more detail with reference to Examples. Example 1 50 parts by weight of bisphenol A type epoxy resin (epoxy equivalent: 950) 5 parts by weight of lead hydroxycarbonate (average particle size 12 μm) 50 parts by weight of crystalline silica powder
After blending with a Henschel mixer, melt-kneading with a co-kneader, and then pulverizing with a pulverizer, the average particle size is 60.
A powder coating of an epoxy resin composition of ~70 μm was obtained. Example 2 In Example 1, the amount of hydroxylead carbonate added was 20
Change the parts by weight and do the same except for the average particle size of 60 to 70 um.
A powder coating with an epoxy resin bottom was obtained. Comparative Example 1 In Example 1, the amount of lead hydroxycarbonate added was 0.
1 part by weight, and do the same except for the average particle size of 60 to 70μ.
A powder coating made of epoxy resin was obtained. Comparative Example 2 In Example 1, the amount of lead hydroxy carbonate added was 50
Change the parts by weight and do the same except for the average particle size of 60 to 70 tI.
A powder coating made of an epoxy resin composition of 1.0 m was obtained. Cured products were prepared from the resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2. A carbon dioxide laser (400 type laser mark manufactured by Ushio Inc., energy density 6 Joule/Ct) was applied to this sample.
&) was used to irradiate a laser through a prescribed mask for 1/1 millionth of a second to mark the surface of the cured product. In addition, the insulation coating voltage of the cured product was measured according to JIS K6911. The results are shown in Table 1. Table 1 [Effects of the invention]
Claims (3)
キシ樹脂組成物において、ヒドロオキシ炭酸鉛を含有す
ることを特徴とするエポキシ樹脂組成物。(1) An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, etc., which is characterized by containing lead hydroxy carbonate.
であることを特徴とする請求項１記載のエポキシ樹脂組
成物。(2) The epoxy resin composition according to claim 1, wherein the average particle size of the lead hydroxycarbonate is 100 μm or less.
０重量部含有することを特徴とする請求項１又は２記載
のエポキシ樹脂組成物。(3) Add 0.5 to 2 of lead hydroxy carbonate to the composition.
The epoxy resin composition according to claim 1 or 2, characterized in that the epoxy resin composition contains 0 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1185879A JPH0352944A (en) | 1989-07-20 | 1989-07-20 | Epoxy resin composition suitable for laser printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1185879A JPH0352944A (en) | 1989-07-20 | 1989-07-20 | Epoxy resin composition suitable for laser printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0352944A true JPH0352944A (en) | 1991-03-07 |
| JPH0575784B2 JPH0575784B2 (en) | 1993-10-21 |
Family
ID=16178477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1185879A Granted JPH0352944A (en) | 1989-07-20 | 1989-07-20 | Epoxy resin composition suitable for laser printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0352944A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6169488A (en) * | 1984-09-13 | 1986-04-10 | Toshiba Corp | Marking on molded resin body |
| JPS6250360A (en) * | 1985-08-30 | 1987-03-05 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for use in laser-beam printing |
| JPH0248984A (en) * | 1988-05-31 | 1990-02-19 | Dainippon Ink & Chem Inc | Laser marking method and resin composition for laser marking |
-
1989
- 1989-07-20 JP JP1185879A patent/JPH0352944A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6169488A (en) * | 1984-09-13 | 1986-04-10 | Toshiba Corp | Marking on molded resin body |
| JPS6250360A (en) * | 1985-08-30 | 1987-03-05 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for use in laser-beam printing |
| JPH0248984A (en) * | 1988-05-31 | 1990-02-19 | Dainippon Ink & Chem Inc | Laser marking method and resin composition for laser marking |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0575784B2 (en) | 1993-10-21 |
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