JPS6257425A - Production of molding material for sealing - Google Patents

Abstract

PURPOSE:To obtain the titled molding material providing resin sealed type electronic parts, absorbing laser beam, marking clearly, easily distinguishable, by premixing a synthetic resin with dye in a molten state under heating, blending the mixture with another component, kneading and grinding. CONSTITUTION:(A) A synthetic resin (e.g., phenolic resin, etc.,) is premixed with (B) at least one dye which contains preferably <=0.1wt% chlorine ion and is selected from azo dye, Nigrosine dye and anthraquinone dye preferably at a temperature >=20 deg.C higher than the softening point of the component A, blended with another component, kneaded, ground and optionally granulated to give the aimed molding material. The amount of the component B is preferably 0.01-20wt% based on the total amounts.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a molding material for sealing, which is mainly used for resin molded crystals for sealing electrical and electronic parts.

[Background Art] Electrical and electronic components are coated and sealed with resin in order to protect them from the external environment and improve their performance and reliability, and their production has been increasing rapidly in recent years. After these parts are encapsulated by methods such as casting, impregnation, sealing, molding, etc.
It is common practice to mark the product name, number, etc. as necessary. Conventionally, printing using ink has been employed for this method, and in recent years, marking using a laser beam has been increasingly employed. The former method is somewhat inefficient in terms of the printing method and drying properties of the ink, and in particular, the surface of resin-sealed electronic components sealed by casting, impregnation, etc. is not necessarily smooth and requires particular effort to print. There were times when the mark would disappear or the mark would disappear. The latter method has been studied more and more in recent years because of its high marking efficiency. However, the markings were often unclear and difficult to identify.

[Object of the Invention] An object of the present invention is to provide a method for manufacturing a molding material for sealing, which allows resin-sealed electronic components to be easily identified after marking.

[Disclosure of the invention]

In the present invention, after heating and melting the synthetic resin and the dye,
Molding for sealing characterized by adding a mold release agent, a coupling agent, a filler, and further a crosslinking agent, a curing agent, and a curing accelerator as necessary, mixing, mixing, crushing, and granulating as necessary. Due to the manufacturing method of the material, the dye is uniformly distributed on the surface of the molded product after molding, absorbing the laser beam, and making the marking clear and easy to identify after marking.The details of the present invention are as follows. explain.

The dye used in the present invention preferably has a chlorine ion content of 0.1 or less and is preferably at least one type of dye selected from azo yarn dyes, nigrosine dyes, and anthraquinone dyes. Theory. This is because when the chlorine ion content exceeds O, tS, the moisture resistance reliability of the resin-sealed electronic component decreases. The required number of dyes can be selected from the above three systems, and can also be used in combination. It is desirable that the amount of the above dye used is 0.01 to 20% of the entire company.In other words, if it is less than 0.01%, the marking tends to become unclear, and if it exceeds 2%, it is used for resin-sealed electronic parts. This is because the moisture resistance reliability of the materials tends to decrease. Resins for molding materials for sealing include phenolic resin, epoxy resin, unsaturated polyester resin, diallyl phthalate resin, acrylic resin, polyimide resin, polyamide resin,
Polyamide-imide resin, polysulfone resin, polyphenylene sulfide resin, polyphenylene oxide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, fluororesin, ylicon resin, etc.
All synthetic resins can be used, such as mixtures and modified products. Fillers include fused silica, crystalline IJ, glass fiber, calcium silicate, calcium carbonate, alumina, RI V+, antimony trioxide, and sulfuric acid. Any type of thermally conductive loaded inorganic filler such as barium, boron nitride, silicon carbide, etc. can be used, and is not particularly limited, but preferably the particle size is 200 microns or less. Additives other than resins, dyes, and fillers include mold release agents, strength and flapping agents, and, if necessary, crosslinking agents, curing agents,
A curing accelerator and the like are added. The manufacturing method is to first heat and melt mix the above resin and the above dye, and then add a mold release agent, a calibrating agent, a filler, and further a crosslinking agent, a curing agent, and a curing accelerator as necessary. A molding material for sealing is obtained by mixing, kneading, pulverizing, and granulating as required. At this time, it is preferable that the temperature of heating and melting mixing is 20° C. or more higher than the softening point of the resin, as this enables more uniform heating and melting mixing.

Furthermore, regarding the molding of the molding material, it is of course suitable for multi-cavity molding of electronic components such as transistors, diodes, capacitors, filters, resistors, coils, etc. by transfer molding, sealing molding, etc.
It can also be applied to compression molding, etc. The present invention will be described in detail below using examples.

Example epoxy & 711 j epoxy k 220 *novolac type epoxy resin with a softening point of 80°C) 115 parts by weight (
(Hereinafter referred to as part) and chlorine ion @f lid 0.04M1J
In a kneader, add 5 parts of azo dye (hereinafter referred to as "Chi").
To 120 parts of the heated and melted mixture obtained by heating and melting at 110°C for 30 minutes, 50 parts of phenol novolac resin (7104 hydroxyl group, softening point 87°C) and fused silica were added. Add 450 parts, 1 part of 2-methyl imidazole, 2 parts of carnauba wax, 20 parts of ammonium trioxide, and 3 parts of calipling agent, mix with heated rolls, knead, and crush to obtain a molding material for sealing. Using a transfer molding machine, the mold temperature was 175°C and the molding pressure was so'v.
The electronic parts were encapsulated and molded under the conditions of 'd% curing time of 3 minutes, and the product name was laser marked with a laser beam.

Comparative Example 1 The epoxy resin, azo dye, phenol novolac 4mM, fd fused fusilica 2mthyl imidazole, carnauba wax, antimony trioxide, and coupling agent were mixed in the same amounts as in the example, The mixture was mixed and kneaded all at once with a roll, and then pulverized to obtain a molding material for sealing. After sealing and molding was carried out in the same manner as in the example, the product name was laser marked with a laser beam.

Comparative Example 2 5 parts of the azo dye of Comparative Example 1 was added to carbon plastic, 4. A molding material for sealing was obtained by processing in the same manner as in Comparative Example 1, except that the amount was changed to 5 parts, and after sealing molding was carried out in the same manner as in Comparative Example 1, the product name was laser marked with a laser beam.

[Effect 1 of the invention] As is clear from Table 2, the ease of identification after marking of the molded products of Example and Comparative Examples 1 and 2 and the moisture resistance reliability of the 16 D I P model element sealed molded products It was confirmed that the performance of the encapsulated molded product obtained from the encapsulating molding material of the present invention was excellent.

Claims (3)

[Claims] (1) After heat-melting and mixing the synthetic resin and dye in advance, a mold release agent, a coupling agent, a filler, and if necessary, a crosslinking agent, a curing agent, and a curing accelerator are added, followed by mixing, kneading, and pulverization. A method for producing a molding material for sealing, characterized in that the molding material is granulated as necessary. (2) The method for producing a molding material for sealing according to claim 1, wherein the temperature of heating and melting and mixing is 20° C. or more higher than the softening point of the resin. (3) Claim 1, characterized in that the dye is at least one type of dye selected from azo dyes, nigrosine dyes, and anthraquinone dyes with a chlorine ion content of 0.1% by weight or less. 2. A method for producing a molding material for resin sealing according to item 2.