JPS6126671A - Sealing molding material and production thereof - Google Patents

Abstract

PURPOSE:A sealing molding material, obtained by adding an inorganic filler and a polybutadiene based polymer which is a solid at ordinary temperature to a thermoplastic resin and various additives, mixing them, and kneading and pulverizing the resultant mixture, and having improved heat conductivity and crack resistance. CONSTITUTION:A sealing molding material obtained by adding (B) preferably 0.05-50wt%, based on the total volume, polybutadiene based polymer which has preferably <=10 mesh particle diameter and is a solid at ordinary temperature and (C) an inorganic filler having preferably <=200mu particle diameter, e.g. fused silica, crystalline silica or glass fibers, to (A) a thermosetting resin, curing agent, coupling agent or colorant, etc., mixing the components, kneading and pulverizing the resultant mixture, and if necessary, granulating the mixture.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a molding material for sealing which is mainly used for resin molded products for sealing electrical and electronic parts, and a method for manufacturing the same.

[Background technology]

In recent years, in order to improve the performance, reliability, and productivity of electrical and electronic equipment, sealing with plastic ink has become popular. These electrical and electronic components include transistors, diodes, capacitors, filters,
There are rectifiers, resistors, coil coils, etc., and due to the recent trend toward higher integration and higher power, electronic components tend to accumulate heat, and packages are also becoming smaller and thinner, making it easier to protect elements from heat and crack resistance. This has become a problem, and molding materials for sealing are required to have high thermal conductivity and crack resistance.

In order to improve the thermal conductivity of the molding material for sealing, it is necessary to use a highly thermally conductive filler and increase the amount of filler, but simply increasing the amount of filler results in a decrease in moldability. was there. Further, in order to improve crack resistance, flexibility imparting agents, flexible thermosetting resins, silicone resins, etc. were used, which caused problems because they lowered heat resistance and moisture resistance.

[Purpose of the invention]

An object of the present invention is to provide a molding material for sealing that has excellent thermal conductivity and "wt crack resistance," and a method for producing the same.

[Disclosure of the Invention] The present invention is a molding material for a tree stopper characterized by containing a polybutadiene-based polymer solid at room temperature and a small amount of an inorganic filler, and a method for producing the same, and the present invention will be described in detail below.

Inorganic fillers used in the present invention include materials with good thermal conductivity such as fused silica, crystalline silica, glass fiber, calcium silicate, calcium carbonate, alumina, clay, antimony trioxide, barium sulfate, boron nitride, and silicon carbide. Any filler can be used, and there are no particular limitations, but preferably the particle size is 200 microns or less. In other words, if the particle size of the inorganic filler exceeds 200 microns, welds are likely to occur in the molded product, and because the mechanical strength of the sea urchin M part is low, it cannot absorb the internal stress that occurs during use, resulting in cracks. This is because it causes Furthermore, in ultra-small and ultra-thin cages, if the gate gets clogged, there is a tendency for filling defects to occur. The polybutadiene-based polymer that is solid at room temperature used in the present invention is DN 20 HA% DN3 manufactured by Japan Synthetic Rubber Co., Ltd.
0A, N220SH Hiker 141 manufactured by Gutsudoritsu
1. HF 01, HF 21 manufactured by Hiki Zeon Co., Ltd.
BR1220, Hiker 07B manufactured by Ube Industries, Ltd.
It is preferable that h of the polybutadiene-based polymer solid at room temperature is 0.05 to 50% (hereinafter simply referred to as "%") based on the total amount, although there is no particular limitation. In addition, it is desirable that the particles be less than 10 mesh. That is, if it is less than 0.05%, it is difficult to improve crack resistance, and if it exceeds 50%, moldability tends to decrease. This is because when the particle size exceeds 1O mesh, it becomes difficult to disperse during the kneading process, causing variations in crack resistance and lowering reliability. Further, thermosetting resins used in the present invention include epoxy resins, unsaturated polyester resins,
Diary V phthalate resin, phenol resin, polyimide resin, polyamideimide resin, silicone resin, etc. alone,
Modifications and mixtures can be used to create B and VII, but are not particularly limited, and the thermosetting resin can be combined with the above-mentioned polybutadiene-based polymer that is solid at room temperature, an inorganic filler, a curing agent, a mold release agent, a coupling agent, and a coloring agent. A molding material for sealing is prepared by adding additives such as additives, mixing, kneading, pulverizing, and granulating as necessary. R) Rungis x-, diode, capacitor filter, rectifier, resistor, coil V
Not only is it suitable for multi-cavity molding of electronic parts such as, but it is also suitable for compression molding and the like. The invention will now be described in detail based on examples.

Examples 1 to 5 and Comparative Examples 1 to 4 A molding material for sealing was obtained by blending, mixing, and kneading the materials according to the recipe in Table 1, and using a transfer molding machine at a mold temperature of 175°C and a molding pressure of 50°C. Hybrid IC'6-sealing molding was carried out under the conditions of Kq/d and curing time of 3 minutes.

〔Effect of the invention〕

The moldability of Examples 1 to 5 and Comparative Examples 1 to 4, the moldability rate of occurrence of sea urchins, cracks and cracks, and thermal conductivity were the second highest.
As is clear from the table, the molding material for sealing according to the present invention has good moldability, and the defect rate of molded products is low, and furthermore, the thermal conductivity is good and the molding material for sealing according to the present invention and the method for producing the same are excellent. It was confirmed.

Claims (3)

[Claims] (1) A molding material for sealing characterized by containing a polybutadiene-based polymer that is solid at room temperature and an inorganic filler. (2) The molding material for sealing according to claim 1, wherein the amount of the polybutadiene-based polymer that is solid at room temperature is 0.05 to 50% by weight based on the total amount. (3) Thermosetting resin, curing agent, mold release agent, coupling agent, coloring agent, etc. contain an inorganic filler with a particle size of 200 microns or less, and a polybutadiene-based polymer that is solid at room temperature and has a particle size of 10 mesh or less. A method for producing a molding material for sealing, which comprises adding, mixing, kneading, pulverizing, and further granulating if necessary.