JP2001234073A - Resin composition for semiconductor sealing and sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing more excellent in respect to a storage stability, a thermal resistance of the hardened material and preventing property to discoloration of a white colored sealing material without damaging formerly dissolved character such as a thermal conductivity or the like and a sealed semiconductor device. SOLUTION: This resin composition for semiconductor sealing includes (A) an inorganic filler, (B) titanium dioxide, (C) 2,2'-methylenebis(4-ethyl-6-tert- butylphenol) and (D) a thermosetting resin as essential component, and includes (A) 30-95 wt.% of the inorganic filler, (B) 1-40 wt.% of the titanium dioxide, (C) 0.01-5 wt.% of the 2,2'-methylenebis(4-ethyl-6-tert-butylphenol) to the resin composition. The sealed semiconductor device comprises a semiconductor tip sealed with the resin composition for semiconductor sealing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin composition for sealing electronic parts such as semiconductors. More specifically, the present invention relates to an epoxy resin composition excellent in discoloration resistance, high reliability, and excellent storage stability used in a semiconductor such as a photocoupler resin-sealed with a white sealing material, and a semiconductor sealing device.

[0002]

2. Description of the Related Art Semiconductor and electronic components are sealed with a ceramic package or a resin package in order to protect them from the external environment. However, this sealing material is not filled with an inorganic material in terms of cost and productivity. The use of a synthetic resin composition containing an agent is widespread.

[0003] This synthetic resin composition is composed of a thermosetting resin such as an epoxy resin and an inorganic filler such as silica. These compositions have a small coefficient of thermal expansion, good thermal conductivity and low thermal conductivity. It is desirable that the material has excellent moisture permeability, excellent mechanical properties, excellent storage stability, and low cost. In particular, in the case of a white sealing material, it is desirable that the cured product after molding and post-curing has a high reflectance and a small discoloration.

However, a resin composition using an epoxy resin as a main component and a phenol resin or an amine-based or acid anhydride-based curing agent as a curing agent is excellent in thermosetting properties, but has poor storage stability. won. Further, the cured product was liable to undergo discoloration due to thermal oxidation, and the white encapsulant was susceptible to discoloration immediately after molding, discoloration after post-cure, and a decrease in reflectance.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned drawbacks, and it has been found that storage stability and heat-resistant oxidation of a cured product can be achieved without deteriorating characteristics which have been conventionally solved, such as thermal conductivity. Another object of the present invention is to provide a sealing resin composition and a semiconductor sealing device which are more excellent in terms of preventing discoloration of a white sealing material.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above-mentioned object, and as a result, the use of a thermosetting resin having a composition described later has achieved the above object. The present invention has been completed.

That is, the present invention provides (A) an inorganic filler,
(B) titanium oxide, (C) 2,2'-methylenebis (4
-Ethyl-6-tert-butylphenol) and (D) a thermosetting resin as essential components, and (A) the inorganic filler in an amount of 30 to 95% by weight based on the resin composition;
(B) 1 to 40% by weight of titanium oxide, (C) 2,2'-
A sealing resin composition comprising methylene bis (4-ethyl-6-tert-butylphenol) at a ratio of 0.01 to 5% by weight. Further, there is provided a semiconductor encapsulating apparatus characterized in that a semiconductor chip is encapsulated with a cured product of the encapsulating resin composition.

Hereinafter, the present invention will be described in detail.

The resin composition of the present invention comprises an inorganic filler, titanium oxide and 2,2'-methylenebis (4-ethyl-
6-tert-butylphenol) in a thermosetting resin.

Examples of the inorganic filler (A) used in the present invention include inorganic compounds such as silica, calcium carbonate, and alumina. These can be used alone or in combination of two or more. The mixing ratio of the inorganic filler is desirably 30 to 90% by weight based on the entire resin composition. If this proportion is less than 30% by weight, the molded article has high moisture absorption and is inferior in moisture resistance after solder immersion. If it exceeds 90% by weight, the fluidity and moldability of the molding material are extremely deteriorated, which is not preferable.

The mixing ratio of titanium oxide (B) used in the present invention is preferably 1 to 40% by weight based on the whole resin composition. If this ratio is less than 1% by weight, the whiteness is not sufficient, and if it exceeds 40% by weight, the characteristics of the semiconductor device may be impaired.

Specific examples of (C) 2,2'-methylenebis (4-ethyl-6-tert-butylphenol) used in the present invention include W-500 manufactured by Kawaguchi Chemical Industry Co., Ltd. '-Methylenebis (4-ethyl-6
-Tert-butylphenol)) is desirably contained in an amount of 0.01 to 5% by weight based on the entire resin composition. If this proportion is less than 0.01% by weight, there is no effect in preventing discoloration, and if it exceeds 5% by weight, bleeding occurs, and both are not preferred.

The thermosetting resin (D) used in the present invention includes, for example, urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, polyurethane resin, vinyl acetate resin, polyvinyl alcohol resin, acrylic resin, vinyl urethane Resin, silicone resin, α
-Olefin maleic anhydride resin, polyamide resin, polyimide resin and the like, and these may be used alone or
A mixture of more than two kinds can be used, and among them, epoxy resins can be used industrially advantageously. The compounding ratio of the thermosetting resin is 5 to the entire resin composition.
It is desirable to contain 50% by weight. The compounding amounts of these thermosetting resins include the compounding amounts of the respective curing agents and catalysts.

In the present invention, the thermosetting resin composition comprises:
The above-mentioned inorganic filler, titanium oxide, 2,2'-methylenebis (4-ethyl-6-tert-butylphenol) and a thermosetting resin are required as essential components. Depending on the solvent for viscosity adjustment, coupling agent and other additives as appropriate,
It can be added and blended. Examples of the solvent include dioxane, solvent naphtha, industrial gasoline, cellosolve acetate, ethyl cellosolve, butyl cellosolve acetate, butyl carbitol acetate, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, and the like. It can be mixed and used.

As a general method for preparing the encapsulating resin composition of the present invention as a molding material, an inorganic filler, titanium oxide, 2,2'-methylenebis (4- Ethyl-6-tert-butylphenol)
The mixture is mixed with additives and the like, and usually heated and kneaded using a kneader, a roll mill, a mixer or the like in a usual manner, cooled, and then pulverized to an appropriate size to obtain a molding material. If the molding material thus obtained is applied to sealing, coating, insulating, etc. of electronic parts or electric parts such as semiconductor devices, excellent properties and reliability can be imparted.

The semiconductor sealing device of the present invention can be easily manufactured by sealing a semiconductor chip using the sealing resin obtained as described above. As a semiconductor device for sealing, for example, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, and the like are not particularly limited. However, it is particularly effective for an optical circuit using a white sealing material. The most common sealing method is a low-pressure transfer molding method, but sealing by injection molding, compression molding, casting or the like is also possible. The sealing resin composition is heated and cured at the time of sealing, and finally a semiconductor sealing device sealed with a cured product of this composition is obtained. Curing by heating is desirably performed by heating to 150 ° C. or higher.

[0017]

The encapsulating resin composition and the semiconductor encapsulating apparatus according to the present invention comprise a titanium oxide in addition to a resin component and a filler component.
2,2'-methylenebis (4-ethyl-6-tert-
By using (butylphenol), desired characteristics can be obtained. That is, it is possible to mold an electronic component such as a semiconductor having a good filling property and workability, and significantly improved appearance and discoloration resistance of the cured resin.

[0018]

Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

Examples 1-2 Fused silica filler, titanium oxide filler and 2,2'-
Methylene bis (4-ethyl-6-tert-butylphenol) (W-500, manufactured by Kawaguchi Chemical Co., Ltd.) and an epoxy resin were blended in the ratio shown in Table 1, kneaded with a roll mill, and cooled and pulverized to obtain an epoxy resin. Resin compositions 1 and 2 were produced.

Comparative Examples 1 and 2 Similarly, a fusible silica filler, a titanium oxide filler and an epoxy resin were blended in the proportions shown in Table 1, kneaded in a roll mill, and cooled and pulverized to form an epoxy resin composition. Thing 3,4
Was manufactured.

In order to check the fluidity of the epoxy resin compositions obtained in Examples 1 and 2 and Comparative Examples 1 and 2, the flow viscosity at 800 nm and the light reflectance at 800 nm were measured.

The results are shown in Table 1. Examples 1 and 2
The resin compositions 1 and 2 of Comparative Examples 1 and 2
It has been confirmed that the resin composition has the same fluidity as the resin composition of No. 4, and has excellent storage stability and resistance to discoloration after post-cure.

[0023]

[Table 1] * 1: Cresol novolak epoxy resin and novolak phenol resin are mixed in equal amounts and an organic phosphorus-based catalyst is used.

* 2: Shimadzu flow tester CFT-500
It was measured at 175 ° C. and a load of 10 kg by a mold.

* 3: The surface of the molded article molded under the curing conditions of 175 ° C. × 2 minutes was measured with an ultraviolet-visible spectrophotometer V-
It was measured by Model 530.

* 4: The molded article of * 3 was post-cured at 175 ° C. for 8 hours, and the surface of the post-cured molded article was measured.

[0027]

As apparent from the above description and Table 1, the encapsulating resin composition of the present invention does not decrease the fluidity, and has storage stability, heat resistance, and discoloration resistance of the white encapsulant. By using this resin composition to seal electronic components, the performance and performance of the semiconductor sealing device can be improved.
The appearance can be improved.

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Claims (2)

[Claims] 1. An inorganic filler, (B) titanium oxide, (C) 2,2'-methylenebis (4-ethyl-6-).
tert-butylphenol) and (D) a thermosetting resin as essential components, and 30 to 95% by weight of the (A) inorganic filler and 1% of (B) titanium oxide based on the resin composition.
To 40% by weight of (C) 2,2'-methylenebis (4-ethyl-6-tert-butylphenol)
A sealing resin composition comprising 5% by weight. 2. A semiconductor sealing device, wherein a semiconductor chip is sealed with a cured product of the sealing resin composition according to claim 1.