JP3142059B2 - Sealing resin composition and semiconductor sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing resin composition having high adhesion, high strength and high fluidity, low water absorption, excellent moldability and excellent solder heat resistance.

[0002]

2. Description of the Related Art In order to protect semiconductor integrated circuits and the like from mechanical and chemical actions, sealing resin compositions have been developed. In recent years, ICs have become larger and more multi-polarized with higher integration, while the outer diameter of the package has been reduced. Therefore, high solder heat resistance is required for a device for surface mounting, which has a great need in the market. What is important for the solder heat resistance is an improvement in the adhesion to various members inside the package and the strength of the resin composition. In order to solve the problem, the sealing resin composition has been made to have high adhesion, high strength, and low water absorption by increasing the amount of an inorganic filler and adding an adhesion promoter. However, on the other hand, the result of causing a problem at the time of molding has occurred. In addition, warpage of the package has become a problem with the reduction in thickness. Although a resin having a high glass transfer temperature is effective for eliminating the warpage, it has been difficult to satisfy the requirement of solder heat resistance because it has a large water absorption and it is difficult to increase the amount of an inorganic filler.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned drawbacks. The present invention maintains a high glass transition temperature, enables a high filling of an inorganic filler, and has a high solder heat resistance. It is an object of the present invention to provide an encapsulating resin composition having characteristics such as high performance, low package warpage, and high fluidity.

[0004]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found that by using a specific phenol resin, a high glass transfer temperature can be maintained and the fluidity can be improved. The present invention has found a resin composition which is high in moldability, excellent in moldability, excellent in soldering heat resistance during mounting, free of resin cracks, good in adhesiveness and low in package warpage. Is completed.

That is, the present invention provides (A) the following formula:
Allyl group-modified polyfunctional phenolic resin curing agent to fix hydroxyl groups,

Embedded image (In the formula, n represents an integer of 1 or more.) (B) an epoxy resin, (C) an inorganic filler, and (D)
An encapsulating resin composition comprising a curing accelerator as an essential component and the inorganic filler (C) in an amount of 70 to 95% by weight based on the resin composition. Still another aspect of the present invention is a semiconductor encapsulation device, wherein a semiconductor chip is not encapsulated with a cured product of the encapsulating resin composition.

Hereinafter, the present invention will be described in detail.

As the (A) allyl group-modified polyfunctional phenol resin curing agent used in the present invention, those represented by the aforementioned general formula 3 are used. In addition, a novolak phenol resin, a polyfunctional phenol resin, and other generally known phenol resins can be used in combination with the modified phenol resin.

As the epoxy resin (B) used in the present invention, novolak epoxy resins, polyfunctional epoxy resins, and other known epoxy resins can be used in combination.

As the inorganic filler (C) used in the present invention, generally known inorganic fillers are widely used. Among them, silica powder having a low impurity concentration and an average particle diameter of 30 μm or less is preferably used. Can be. If the average particle size exceeds 30 μm, the moisture resistance and the moldability are poor, which is not preferable. The inorganic filler is desirably contained in a proportion of 70 to 95% by weight based on the whole resin composition. If the proportion is less than 70% by weight, the moisture absorption of the resin composition becomes large and the moisture resistance after solder immersion is inferior, and if it exceeds 95% by weight, the fluidity becomes extremely poor and the moldability is inferior. .

As the (D) curing accelerator used in the present invention, DBU-based curing accelerators, phosphorus-based curing accelerators, imidazole-based curing accelerators, and other curing accelerators are widely used. These can be used alone or in combination of two or more. It is desirable to mix the curing accelerator so that it is contained in an amount of 0.01 to 5% by weight based on the entire resin composition. If the proportion is less than 0.01% by weight, the gel time of the resin composition is long, the curing properties are poor, and
If the content is more than 10% by weight, the fluidity is extremely deteriorated, resulting in poor moldability, and the electrical properties are also deteriorated, resulting in poor moisture resistance.

The epoxy resin composition of the present invention contains the above-mentioned specific phenolic resin curing agent, epoxy resin, inorganic filler and curing accelerator as essential components. Depending on, for example, natural waxes, synthetic waxes, metal salts of linear fatty acids, acid amides, esters, release agents such as paraffins, flame retardants such as antimony trioxide, carbon black,
A coloring agent such as redwood, a silane coupling agent, a rubber-based or silicone-based low-stress imparting agent, and the like can be appropriately added and blended.

A general method for preparing the encapsulating resin composition of the present invention as a molding material includes the above-mentioned specific phenol resin curing agent, epoxy resin, inorganic filler, curing accelerator and other components. After mixing the raw materials selected in a predetermined composition ratio and mixing them sufficiently uniformly by a mixer, etc., they are further melt-mixed by a hot roll or mixed by a kneader, etc., then cooled and solidified, and pulverized to an appropriate size. To form a molding material. When the molding material thus obtained is applied to coating, insulation, and the like of electronic components or electric components such as semiconductor devices, excellent characteristics and reliability can be imparted.

The semiconductor encapsulation device of the present invention can be easily manufactured by encapsulating a semiconductor chip using the above-mentioned molding material. The semiconductor chip to be sealed is not particularly limited to, for example, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, and the like. The most common sealing method is a low-pressure transfer molding method, but sealing by injection molding, compression molding, casting or the like is also possible. The molding material is heated and cured at the time of sealing, and finally a semiconductor sealing device sealed with the cured product is obtained. Curing by heating is 150
Desirably, the composition is cured by heating to a temperature of at least ℃. Substrates for mounting chips include ceramics, plastics,
Examples include, but are not limited to, polyimide films and lead frames.

[0014]

The sealing resin composition and the semiconductor sealing device of the present invention use the above-mentioned specific phenolic resin, so that the glass transfer temperature of the resin composition is increased and the inorganic filler is highly filled. By having high fluidity even after the formation, the thermo-mechanical properties are improved, the occurrence of resin cracks after solder immersion and solder reflow is eliminated, and deterioration of moisture resistance is reduced.

[0015]

Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, “%” means “% by weight”.

Example 1 The above-mentioned phenolic resin of the formula (3) having n = 1 and n = 2
(HEX800A-1, Sumikin Chemical
4.0%,ManyFunctional epoxy treeFat5.0%,ShiRica
90% powder, accelerated curingAgent0.2%, ester waxS
0.3% and silane couplingAgentMix 0.5% at room temperature
And further kneaded at 90-95 ° C.
Thus, a molding material (A) was produced.

Example 2 The same phenolic resin as used in Example 1 (HEX
800A-1, manufactured by Sumitomo Metals Co., Ltd.) 4.0%, novolac epoxy resins 5.0%, shea silica powder 90%, a curing accelerator
Agent 0.2%, mixed with 0.3% ester wax scan and 0.5% silane coupling agent at room temperature, further 90 to 95
The mixture was kneaded at ℃ and cooled and solidified to produce a molding material (B).

Example 3 The same phenolic resin as used in Example 1 (HEX
800A-1, manufactured by Sumikin Chemical Co., Ltd.) 3.0%,ManySensuality
Poxy treeFat4.0%,ShiRica powder 92%, accelerated curingAgent
0.2%, ester waxS0.3% and silane cup
ringAgent0.5% mixed at room temperature, and further 90-95 ° C
And it is cooled and solidified to produce a molding material (C).
Was.

[0019] Comparative Example 1 triphenylmethane polyfunctional phenol resins 4.0%,
Polyfunctional epoxy resins 5.0%, shea silica powder 90%, curing accelerator 0.2%, mixed with 0.3% ester wax scan and 0.5% silane coupling agent at room temperature, further 90
The mixture was kneaded at 95 ° C. and cooled and solidified to produce a molding material (D).

[0020] Comparative Example 2 triphenylmethane polyfunctional phenol resins 3.0%
Polyfunctional epoxy resins 4.0%, shea silica powder 92%, curing accelerator 0.2%, mixed with 0.3% ester wax scan and 0.5% silane coupling agent at room temperature, further 90
The mixture was kneaded at 95 ° C. and cooled and solidified to produce a molding material (E).

[0021] Comparative Example 3 phenol novolac resins 3.0%, novolac epoxy resins 4.0%, shea silica powder 92%, the curing accelerator 0.2
%, An ester wax scan 0.3% and a silane coupling
0.5% of the agent was mixed at room temperature, further kneaded at 90 to 95 ° C., and cooled and solidified to produce a molding material (F).

The molding materials (A) to (F) thus produced
Was transferred into a mold heated to 180 ° C. and cured to seal a semiconductor chip, thereby manufacturing a semiconductor sealing device. Various tests were performed on these semiconductor sealing devices, and the results are shown in Table 1. The epoxy resin composition and the semiconductor sealing device of the present invention have little package warpage, fluidity, moisture resistance, The solder heat resistance was excellent, and the remarkable effect of the present invention could be confirmed.

[0023]

[Table 1] * 1: A molded article having a diameter of 50 mm and a thickness of 3 mm was prepared by transfer molding, left in a saturated steam at 127 ° C. and 2.5 atm for 24 hours, and measured by the increased weight.

* 2: A molded article was prepared in the same manner as in the case of the water absorption rate, post-cured at 175 ° C. for 8 hours, made into a test piece of an appropriate size, and measured using a thermomechanical analyzer.

* 3: Tested according to EMMI1-66.

* 4: Using a molding material, a silicon chip having two aluminum wirings was bonded to a normal QFP frame, transfer-molded at 180 ° C. for 1 minute, and after 8 hours at 175 ° C. Curing was performed. The molded product thus obtained was subjected to a moisture resistance test in saturated steam at 127 ° C. and 2.5 atm to evaluate the time at which 50% disconnection (defect occurrence) due to aluminum corrosion occurred.

* 5: A 6.0 × 6.0 mm dummy chip is placed in a QFP (10 × 10 × 1.0 mm) package.
After transfer molding at 180 ° C. for 1 minute using the molding material, post-curing was performed at 175 ° C. for 8 hours. After the thus-manufactured semiconductor sealing device is subjected to a moisture absorption treatment at 30 ° C., 60% and 192 hours, an IR reflow at 240 ° C. is performed for 30 minutes.
The test was performed for 2 seconds to evaluate whether or not a package crack occurred.

* 6: 10 × 10 mm dummy chip is BG
A (30 × 30 × 1.2 mm) package, transfer molding was performed at 180 ° C. for 1 minute using a molding material, and post-curing was performed at 175 ° C. for 8 hours. The amount of warpage of the semiconductor sealing device manufactured as described above was measured by a non-contact laser measuring device.

[0029]

As apparent from the above description and Table 1, the encapsulating resin composition and the semiconductor encapsulating apparatus of the present invention are:
It has a high glass transition temperature, less warpage of the package, good flowability, excellent moldability, excellent solder heat resistance during mounting, no resin cracks, good adhesion, Further, it is excellent in moisture resistance after mounting and can guarantee long-term reliability.

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C08G 59/62 C08L 63/00-63/10 H01L 23/29

Claims (2)

(57) [Claims] (A) A polyfunctional phenol resin curing agent modified by an allyl group to fix a hydroxyl group, which is represented by the following formula: (In the formula, n represents an integer of 1 or more.) (B) an epoxy resin, (C) an inorganic filler, and (D)
An encapsulating resin composition comprising a curing accelerator as an essential component, and 70 to 95% by weight of the inorganic filler (C) based on the resin composition. 2. (A) a polyfunctional phenol resin curing agent modified by an allyl group to fix a hydroxyl group, which is represented by the following formula: (Wherein, n represents an integer of 1 or more), (B) an epoxy resin, (C) an inorganic filler, and (D) a curing accelerator as essential components. 7 mineral fillers
A semiconductor sealing device, wherein a semiconductor chip is sealed with a cured product of a sealing resin composition contained at a ratio of 0 to 95% by weight.