JPS62184786U - - Google Patents
Info
- Publication number
- JPS62184786U JPS62184786U JP7382986U JP7382986U JPS62184786U JP S62184786 U JPS62184786 U JP S62184786U JP 7382986 U JP7382986 U JP 7382986U JP 7382986 U JP7382986 U JP 7382986U JP S62184786 U JPS62184786 U JP S62184786U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- insulating substrate
- wiring board
- printed wiring
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、絶縁基板に導電体パターンを設ける
状態を説明する断面概略図、第２図は、絶縁基板
に導電体パターンが埋込まれた状態を示す断面概
略図、第３図は、本考案のプリント配線板を示す
断面概略図、第４図は、従来のプリント配線板を
示す断面概略図である。
１…絶縁基板、２…導電体パターン、２１，２
１…部品取付座、２１ａ，２１ａ…部品取付座の
上面、２１ｂ，２１ｂ…部品取付座の下面、３…
ソルダーレジスト層。
FIG. 1 is a schematic cross-sectional view illustrating a state in which a conductive pattern is provided on an insulating substrate, FIG. 2 is a schematic cross-sectional view showing a state in which a conductive pattern is embedded in an insulating substrate, and FIG. FIG. 4 is a schematic cross-sectional view showing the invented printed wiring board. FIG. 4 is a schematic cross-sectional view showing the conventional printed wiring board. 1... Insulating substrate, 2... Conductor pattern, 21, 2
1... Parts mounting seat, 21a, 21a... Upper surface of the parts mounting seat, 21b, 21b... Bottom surface of the parts mounting seat, 3...
solder resist layer.
Claims (1)
体パターンを設け、該導電体パターン上に該部品
取付座を残してソルダーレジスト層を形成するも
のであつて、該部品取付座は絶縁基板の上面に埋
込まれた状態に設けられたプリント配線板。 (2) 前記部品取付座の下面は絶縁基板の上面よ
り低位となる状態に埋込まれたことを特徴とする
実用新案登録請求の範囲第１項記載のプリント配
線板。[Claims for Utility Model Registration] (1) A conductive pattern having a plurality of component mounting seats is provided on an insulating substrate, and a solder resist layer is formed on the conductive pattern with the component mounting seats remaining. , a printed wiring board in which the component mounting seat is embedded in the upper surface of an insulating substrate. (2) The printed wiring board according to claim 1, wherein the lower surface of the component mounting seat is embedded in a lower level than the upper surface of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7382986U JPS62184786U (en) | 1986-05-16 | 1986-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7382986U JPS62184786U (en) | 1986-05-16 | 1986-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62184786U true JPS62184786U (en) | 1987-11-24 |
Family
ID=30918504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7382986U Pending JPS62184786U (en) | 1986-05-16 | 1986-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62184786U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5493457A (en) * | 1977-12-29 | 1979-07-24 | Tanazawa Hakkosha Kk | Printed circuit board |
-
1986
- 1986-05-16 JP JP7382986U patent/JPS62184786U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5493457A (en) * | 1977-12-29 | 1979-07-24 | Tanazawa Hakkosha Kk | Printed circuit board |