JPS62184785U - - Google Patents
Info
- Publication number
- JPS62184785U JPS62184785U JP1986073828U JP7382886U JPS62184785U JP S62184785 U JPS62184785 U JP S62184785U JP 1986073828 U JP1986073828 U JP 1986073828U JP 7382886 U JP7382886 U JP 7382886U JP S62184785 U JPS62184785 U JP S62184785U
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- component mounting
- mounting seats
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0588—Second resist used as pattern over first resist
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986073828U JPS62184785U (de) | 1986-05-16 | 1986-05-16 | |
US07/012,945 US4767892A (en) | 1986-05-16 | 1987-02-10 | Printed-wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986073828U JPS62184785U (de) | 1986-05-16 | 1986-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62184785U true JPS62184785U (de) | 1987-11-24 |
Family
ID=13529394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986073828U Pending JPS62184785U (de) | 1986-05-16 | 1986-05-16 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4767892A (de) |
JP (1) | JPS62184785U (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002158429A (ja) * | 2000-11-16 | 2002-05-31 | Murata Mfg Co Ltd | 部品の実装構造 |
JP2008060182A (ja) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | 車載用電子回路装置 |
JP2015056228A (ja) * | 2013-09-10 | 2015-03-23 | 株式会社小糸製作所 | プリント基板および車両用灯具 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63302595A (ja) * | 1987-06-02 | 1988-12-09 | Murata Mfg Co Ltd | チップ部品の取付構造 |
US4859808A (en) * | 1988-06-28 | 1989-08-22 | Delco Electronics Corporation | Electrical conductor having unique solder dam configuration |
JPH02230792A (ja) * | 1989-03-03 | 1990-09-13 | Cmk Corp | プリント配線板の製造方法におけるソルダランドの形成方法 |
GB2258183A (en) * | 1991-08-01 | 1993-02-03 | Motorola Inc | Solder mask defined printed circuit board |
CA2055148C (en) * | 1991-10-25 | 2002-06-18 | Alain Langevin | Method of forming an electrically conductive contact on a substrate |
US5227589A (en) * | 1991-12-23 | 1993-07-13 | Motorola, Inc. | Plated-through interconnect solder thief |
JP3494443B2 (ja) * | 1991-12-26 | 2004-02-09 | 住友スリーエム株式会社 | 磁気ヘッド用2層テープリード線 |
JP2554542Y2 (ja) * | 1992-02-17 | 1997-11-17 | 台灣杜邦股▲ふん▼有限公司 | プリント回路基板 |
JPH05315734A (ja) * | 1992-05-01 | 1993-11-26 | Mitsubishi Electric Corp | 電子部品の実装基板と実装方法 |
US5644475A (en) * | 1994-09-30 | 1997-07-01 | Allen-Bradley Company, Inc. | Solder mask for a finger connector on a single in-line package module |
JPH11220234A (ja) * | 1998-01-29 | 1999-08-10 | Smk Corp | 回路基板 |
JP3951779B2 (ja) * | 2002-04-10 | 2007-08-01 | 株式会社デンソー | プリント回路板およびその製造方法 |
TWI221343B (en) * | 2003-10-21 | 2004-09-21 | Advanced Semiconductor Eng | Wafer structure for preventing contamination of bond pads during SMT process and process for the same |
JP4734995B2 (ja) * | 2005-03-29 | 2011-07-27 | ミツミ電機株式会社 | ランド構造及びプリント配線板並びに電子装置 |
JP2008147458A (ja) * | 2006-12-11 | 2008-06-26 | Nec Electronics Corp | プリント配線板およびその製造方法 |
JP2008205132A (ja) * | 2007-02-19 | 2008-09-04 | Nec Corp | プリント配線板及びこれとフレキシブルプリント基板とのはんだ接続構造並びに方法 |
JP2008210993A (ja) * | 2007-02-26 | 2008-09-11 | Nec Corp | プリント配線板及びその製造方法 |
JP2012156257A (ja) | 2011-01-25 | 2012-08-16 | Fujitsu Ltd | 回路基板及び電子装置 |
KR102434435B1 (ko) * | 2015-10-26 | 2022-08-19 | 삼성전자주식회사 | 인쇄회로기판 및 이를 가지는 반도체 패키지 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1187282B (de) * | 1964-06-12 | 1965-02-18 | Nordmende | Schaltungsplatte mit aufkaschierten Leiterbahnen und im Tauchloetverfahren elektrisch leitend verbundenen Schaltungsbauteilen |
JPS5441102B2 (de) * | 1975-03-04 | 1979-12-06 | ||
JPS54158661A (en) * | 1978-06-01 | 1979-12-14 | Tokyo Purinto Kougiyou Kk | Printed circuit board |
JPS5724775U (de) * | 1980-07-17 | 1982-02-08 | ||
US4389771A (en) * | 1981-01-05 | 1983-06-28 | Western Electric Company, Incorporated | Treatment of a substrate surface to reduce solder sticking |
-
1986
- 1986-05-16 JP JP1986073828U patent/JPS62184785U/ja active Pending
-
1987
- 1987-02-10 US US07/012,945 patent/US4767892A/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002158429A (ja) * | 2000-11-16 | 2002-05-31 | Murata Mfg Co Ltd | 部品の実装構造 |
JP2008060182A (ja) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | 車載用電子回路装置 |
JP2015056228A (ja) * | 2013-09-10 | 2015-03-23 | 株式会社小糸製作所 | プリント基板および車両用灯具 |
Also Published As
Publication number | Publication date |
---|---|
US4767892A (en) | 1988-08-30 |